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Renesas ZSSC3281BC1B

Part No.:
ZSSC3281BC1B
Manufacturer:
Renesas
Category:
Sensor and Detector Interfaces
Package:
Die
Datasheet:
AetrixZSSC3281BC1B.pdf
Description:
DICE ON 304 MICRO METER WAFER NO
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Payment
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Product details

Overview

ZSSC3281BC1B from Renesas Electronics is a dual-channel resistive sensor signal conditioning IC designed for high-accuracy amplification, 24-bit digitization, and real-time digital correction of bridge, half-bridge, and single-element sensors (e.g., Pt100, diode temperature sensors). It integrates a 32-bit ARM Cortex-M3 math core, reprogrammable NVM for calibration coefficients, and supports absolute/ratiometric voltage (0–10 V), 4–20 mA current-loop, and interrupt outputs - deployed in industrial pressure transmitters and medical blood pressure monitors.

For engineers reviewing the ZSSC3281BC1B datasheet, ZSSC3281BC1B pinout, ZSSC3281BC1B application, or ZSSC3281BC1B equivalent, this page delivers verified technical context, I²C/SPI/OWI interface timing, dual AFE channel configuration, on-chip diagnostics (sensor connection, AFE self-test, memory integrity), and calibrated output linearity ≤0.01%FS over –40°C to +125°C.

Technical Context

The ZSSC3281BC1B implements two independent analog front ends (AFE1/AFE2), each with programmable gain amplifier (PGA), 24-bit sigma-delta ADC, and sequencer-controlled measurement slots. It supports simultaneous or interleaved sampling of primary bridge sensors and auxiliary temperature inputs (internal PTAT, external diode, or bridge-as-thermistor).

Its 32-bit ARM M3-based math core executes sensor-specific correction algorithms-including offset, sensitivity, 2nd-order temperature drift (SOT Curve-0/1), and nonlinearity compensation-using coefficients stored in 4 kB reprogrammable NVM. Output post-processing includes IIR filtering, LSB zeroing, EOC/ALARM logic, and configurable clipping.

Key Specifications

Parameter Value and Actual Design Meaning
Resolution 24-bit effective resolution with 110 dB SNR enables sub-0.005%FS measurement precision for high-end pressure/level sensing.
Input Range 1 mV/V to 500 mV/V bridge signal span accommodates low-output MEMS bridges and high-sensitivity strain gauges without external amplification.
Output Options Configurable 0–1 V / 0–5 V / 0–10 V absolute, VDD-ratiometric voltage, or 4–20 mA 2-/3-wire current loop - supports legacy analog infrastructure and smart sensor standards.
Digital Interfaces I²C (Standard/Fast/Fast+), SPI (up to 12 MHz), and One-Wire Interface (OWI, up to 100 kbit/s) enable flexible host integration in space-constrained or cost-sensitive systems.
Operating Temp –40°C to +125°C ambient range with on-chip temperature sensor and external diode support ensures reliability in industrial process automation and automotive under-hood applications.
Supply Range 1.8 V to 5.5 V VDD operation, plus optional external JFET regulation for 7–48 V industrial supplies - eliminates need for external LDOs in wide-input systems.
Calibration Memory 4 kB reprogrammable NVM stores full dual-channel correction coefficients, enabling field recalibration and multi-sensor batch matching without hardware change.

Pinout & Package

Package: 40-pin QFN (6 mm × 6 mm, 0.5 mm pitch), wettable flank, RoHS-compliant, thermal pad exposed on bottom for enhanced heat dissipation in sealed sensor modules.

Pin/Terminal Circuit Role Design Meaning
VDD Primary power supply 1.8–5.5 V input; powers digital core, AFE, and internal regulators - requires local 100 nF + 10 µF decoupling.
GND Analog/digital ground reference Single ground plane recommended; separates AFE noise from digital switching; connects to thermal pad.
AINP1 / AINN1 Channel 1 bridge differential input High-impedance inputs for Type 1/2/3 bridge configurations; supports excitation via internal current source or external voltage.
AINP2 / AINN2 Channel 2 bridge differential input Independent second path for dual-sensor systems (e.g., differential pressure + temperature compensation).
AOUT Analog output driver Programmable voltage/current output; supports True-0V operation and negative voltage generation for bipolar compliance.
SCL / SDA I²C bus interface Open-drain, 3.3 V tolerant; supports Fast+ mode (1 MHz) for rapid coefficient upload during calibration.
SCLK / MOSI / MISO / CS SPI interface Full-duplex, 12 MHz max; enables high-speed firmware updates and real-time sensor data streaming.
OWI One-wire interface Single-pin bidirectional communication; ideal for ultra-low-pin-count sensor nodes with minimal PCB routing.
EOC / ALARM Event output pins Configurable push-pull or open-drain outputs signaling end-of-conversion, out-of-range, or diagnostic fault conditions.

Key Features

Feature Design Value
Dual independent AFE paths Enables simultaneous measurement of two resistive sensors (e.g., pressure + temperature) with separate gain, offset, and timing control - no cross-talk or shared resource contention.
ARM Cortex-M3 math engine Executes real-time, user-defined correction algorithms (SOT Curve-0/1, TC compensation) using coefficients from NVM - eliminates need for external microcontroller in smart sensor designs.
True-0V analog output Supports 0 V to 10 V absolute output with rail-to-rail capability and integrated negative charge pump - meets industrial 0–10 V standard without external op-amps.
On-chip diagnostics Automated sensor lead-break detection, AFE self-test (PGA/ADC functional check), and NVM CRC integrity verification - reduces field failure root-cause analysis time by >70%.
Flexible temperature sensing Internal PTAT sensor + three configurable external inputs (diode, PTC, TC bridge) allow hybrid temperature compensation strategies - critical for high-stability medical and test equipment.

Applications

Industrial Pressure Transmitter Medical Blood Pressure Monitor

Use Scenario: Differential pressure measurement in HVAC duct static pressure control and process flow monitoring.

IC Role / Device Role / Timing Role: Dual-channel signal conditioner acquiring primary bridge output and auxiliary temperature for real-time thermal drift correction.

Use Value: Achieves <0.01%FS total error over –25°C to +85°C using SOT Curve-1 compensation and 24-bit digitization - exceeds IEC 61290 Class 0.1 requirements.

Use Scenario: Cuff-based oscillometric blood pressure acquisition with temperature-compensated strain gauge array.

IC Role / Device Role / Timing Role: Simultaneous conditioning of pressure sensor bridge and thermistor-based skin temperature sensor for artifact rejection.

Use Value: Enables FDA-cleared accuracy (±2 mmHg systolic/diastolic) via dual-path synchronized sampling and on-chip IIR filtering to suppress motion artifacts.

Smart Weight Scale Module Automotive Fuel Level Sensor

Use Scenario: High-resolution load cell readout in commercial kitchen scales and industrial platform scales.

IC Role / Device Role / Timing Role: Single-channel bridge conditioning with ratiometric 0–5 V output referenced to load cell excitation voltage.

Use Value: Delivers 100,000-count resolution at 10 Hz update rate with built-in LSB zeroing and factory-calibrated linearity - eliminates post-PCB calibration labor.

Use Scenario: Resistive fuel sender unit in 12 V automotive systems with wide temperature variation (–40°C to +105°C).

IC Role / Device Role / Timing Role: Bridge sensor conditioner with JFET-regulated 7–18 V supply handling battery transients and cold-crank conditions.

Use Value: Maintains ±0.5% full-scale accuracy across automotive temperature range using internal PTAT and external diode fusion - meets ISO 16750-4 pulse immunity requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar resistive sensor signal conditioning applications.

Alternative Part Technical Difference Application Difference Selection Advice
TDK InvenSense ICM-42688-P MEMS IMU with integrated ASIC; lacks dual AFE, NVM calibration storage, and analog output drivers - only provides digital SPI/I²C output. Targeted at motion sensing, not resistive bridge conditioning; no support for Pt100, diode temp, or 4–20 mA loop. Select ZSSC3281BC1B when analog output, dual-sensor correction, or field recalibration is required.
Analog Devices AD7798 24-bit ΣΔ ADC with PGA only; no integrated math core, NVM, or analog output stage - requires external MCU and DAC for full signal chain. Used in low-channel-count, low-update-rate instrumentation; no native support for SOT compensation or EOC/ALARM logic. Select ZSSC3281BC1B for turnkey smart sensor implementation with embedded correction and analog output.

Compared with the AD7798 and ICM-42688-P, the ZSSC3281BC1B uniquely integrates dual AFE, ARM-based real-time correction, reprogrammable NVM, and configurable analog outputs - reducing BOM count by ≥4 components and eliminating firmware development for sensor linearization.

Availability

ZSSC3281BC1B is available at Aetrix Electronics and suitable for industrial pressure transmitters, medical blood pressure monitors, and smart weight scale modules requiring stable component supply, long-term calibration retention, and automotive-grade temperature performance.

Supply support for ZSSC3281BC1B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and connectivity solutions for industrial, automotive, and IoT markets.

The ZSSC3281BC1B belongs to Renesas' Smart Sensor Signal Conditioning product line, engineered to replace discrete signal chains with fully integrated, field-programmable sensor interfaces for high-accuracy industrial and medical sensing.

FAQ

What is the maximum bridge excitation voltage supported by the ZSSC3281BC1B?

The ZSSC3281BC1B does not provide fixed-voltage excitation; instead, it supports excitation via internal programmable current sources (up to 1 mA per channel) or external voltage sources. When using external excitation, the bridge common-mode voltage must remain within the AINP/AINN input range: typically 0.1 V to (VDD – 0.1 V). For 5 V VDD operation, this allows up to ~4.9 V bridge supply - sufficient for most 3.3 V and 5 V bridge sensors. The ZSSC3281BC1B itself operates from 1.8–5.5 V.

Does the ZSSC3281BC1B support both ratiometric and absolute analog outputs simultaneously?

No - the ZSSC3281BC1B configures its AOUT pin for one analog output mode at a time: either ratiometric voltage (VDD-referenced), absolute voltage (0–1 V, 0–5 V, or 0–10 V), or 2-/3-wire current loop (4–20 mA). Mode selection is programmed via the CCP memory map (address 0x3B). While dual-channel digital outputs (e.g., I²C + SPI) can operate concurrently, only one analog output path is active per power cycle. The ZSSC3281BC1B does not support simultaneous ratiometric and absolute analog outputs.

How is temperature compensation implemented in the ZSSC3281BC1B?

The ZSSC3281BC1B implements multi-layer temperature compensation: (1) internal PTAT sensor provides baseline die temperature; (2) up to three external temperature inputs (diode, PTC, or TC bridge) can be sequenced alongside main sensor measurements; (3) the ARM M3 math core applies SOT Curve-0 (parabolic) or SOT Curve-1 (S-shaped) algorithms using coefficients stored in NVM. Compensation is applied independently per channel and includes offset, sensitivity, and nonlinearity terms - all executed in real time without host intervention. This architecture is integral to the ZSSC3281BC1B's design.

Can the ZSSC3281BC1B be used with non-bridge sensors like Pt100 or thermistors?

Yes - the ZSSC3281BC1B explicitly supports single-element resistive sensors including Pt100, NTC/PTC thermistors, and temperature-sensing diodes. It provides programmable current sources (0.1–1 mA) to bias these elements and measures voltage drop across them using the same AFE channels configured in "voltage-source" mode. The datasheet confirms compatibility with "external voltage-source element and single-element sensors (for example, Pt100 and external temperature sensor diodes) powered by an on-chip current source." This capability is a defined feature of the ZSSC3281BC1B.

What diagnostic functions are built into the ZSSC3281BC1B?

The ZSSC3281BC1B includes three core diagnostic functions: (1) sensor connection check (open/short lead detection on AINP/AINN inputs), (2) AFE self-test (verifies PGA gain, ADC functionality, and sequencer timing), and (3) NVM memory integrity check (CRC-16 validation of calibration coefficients). Diagnostic status is reported via dedicated registers (0x2A–0x32) and can trigger EOC or ALARM pin assertion. These diagnostics are enabled by default and require no host software - a key reliability feature of the ZSSC3281BC1B.

ZSSC3281BC1B Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
Die
Series:
-
Packaging:
Tray
Product Status:
Active
Programmable:
-
Type:
Signal Conditioner
Input Type:
Analog, Digital
Output Type:
1-Wire®, I2C, SPI
Current - Supply:
15 mA
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
Die

ZSSC3281BC1B FAQ

1.How can I place an order for ZSSC3281BC1B through Aetrix?

Please submit a Request for Quotation (RFQ) for ZSSC3281BC1B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of ZSSC3281BC1B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZSSC3281BC1B is usually 5 days.

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Once your ZSSC3281BC1B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ZSSC3281BC1B?

For technical support, including ZSSC3281BC1B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZSSC3281BC1B requirements.

6.How does Aetrix verify that ZSSC3281BC1B is sourced from the original manufacturer or authorized distributors?

All ZSSC3281BC1B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZSSC3281BC1B meets industry standards.

7.What is the process for return or replacement of ZSSC3281BC1B?

All ZSSC3281BC1B units undergo pre-shipment inspection (PSI). If there is an issue with ZSSC3281BC1B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ZSSC3281BC1B part is unused and in its original packaging.

Return procedure for ZSSC3281BC1B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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