Renesas ZSSC3281BC6B
- Part No.:
- ZSSC3281BC6B
- Manufacturer:
- Renesas
- Category:
- Sensor and Detector Interfaces
- Package:
- Die
- Datasheet:
-
ZSSC3281BC6B.pdf
- Description:
- DICE ON 725 MICRO METER WAFER WI
- Quantity:
- Payment:

- Shipping:

Inventory:2,680
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ZSSC3281BC6B from Renesas Electronics is a dual-channel resistive sensor signal conditioner IC designed for high-accuracy amplification, 24-bit digitization, and on-the-fly digital correction of bridge, half-bridge, Pt100, and diode-based sensors. It integrates a 32-bit ARM Cortex-M3 math core, non-volatile reprogrammable memory for calibration coefficients, and supports absolute/ratiometric voltage (0–10 V), 4–20 mA current-loop, and interrupt outputs - deployed in industrial pressure transmitters and medical blood pressure modules.
For engineers reviewing the ZSSC3281BC6B datasheet, ZSSC3281BC6B pinout, ZSSC3281BC6B application, or ZSSC3281BC6B equivalent, this page delivers verified technical context, real-world interface configurations (I²C/SPI/OWI), calibrated output modes, diagnostic capabilities, and validated alternative options for sensor front-end design.
Technical Context
The ZSSC3281BC6B implements a dual-path analog front end with independent PGA gain control (up to 128×), 24-bit sigma-delta ADCs per channel, and deterministic AFE sequencing for synchronized bridge and auxiliary temperature measurements. Its ARM M3-based math engine executes sensor-specific correction algorithms including parabolic (SOT Curve-0) and S-shaped (SOT Curve-1) compensation for offset, sensitivity, temperature drift, and non-linearity.
It supports three digital interfaces - I²C (Standard/Fast/Fast+/I3C SDR), SPI (≤12 MHz), and One-Wire Interface (≤100 kbit/s) - with command/response protocol, advanced error handling, and firmware-updatable configuration. On-chip diagnostics cover sensor connection integrity, AFE self-test, and NVM memory integrity verification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Channels | Dual independent signal paths for simultaneous bridge/half-bridge or resistive element sensing |
| ADC Resolution | 24-bit sigma-delta with programmable oversampling ratio for noise reduction |
| Output Options | 0–1 V / 0–5 V / 0–10 V absolute voltage; VDD-ratiometric voltage; 4–20 mA 2-/3-wire current loop |
| Digital Interfaces | I²C (up to 1 MHz Fast+), SPI (up to 12 MHz), OWI (up to 100 kbit/s) |
| Calibration Memory | Reprogrammable non-volatile memory storing full 32-bit correction coefficients per channel |
| Operating Temp | −40°C to +125°C - qualified for industrial and medical-grade continuous operation |
| Supply Range | 1.8 V to 5.5 V (direct VDD); supports external JFET pre-regulation for 7–48 V industrial supplies |
Pinout & Package
Package: 40-pin QFN (6 mm × 6 mm, 0.5 mm pitch), wettable flank, RoHS-compliant, thermal pad exposed on underside.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Main power supply | 1.8–5.5 V input; powers digital core, AFE, and internal regulators |
| GND | Ground reference | Analog and digital common ground; connects to thermal pad |
| AINP1 / AINN1 | Channel 1 differential input | Accepts bridge output signals from 1 mV/V to 500 mV/V span |
| AINP2 / AINN2 | Channel 2 differential input | Independent second sensor path with identical gain and filtering capability |
| AOUT | Analog output driver | Programmable voltage or current output; supports True-0V operation and negative voltage generation |
| SCL / SDA | I²C interface | Open-drain bidirectional bus lines; compatible with I3C SDR mode |
| SCLK / MOSI / MISO / CS | SPI interface | Full-duplex synchronous serial communication up to 12 MHz |
| OWI | One-wire interface | Single-pin bidirectional communication supporting multi-drop topology |
| EOC / EOB / ALARM | Event output pins | Configurable interrupt outputs for end-of-conversion, end-of-burst, or alarm conditions |
| TEMP_SENSE | Internal PTAT sensor | On-die temperature measurement used for real-time drift compensation |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent AFE paths | Enables simultaneous conditioning of two resistive sensors without cross-talk or timing conflict |
| ARM Cortex-M3 math core | Executes real-time, user-programmable correction algorithms using stored 32-bit coefficients |
| True-0V analog output | Supports rail-to-rail 0 V start in voltage modes - critical for precision zero-referenced systems |
| Multi-sensor temperature compensation | Combines internal PTAT, external diode, and bridge-as-thermistor inputs for multi-point thermal modeling |
| Integrated diagnostics | Hardware-verified sensor open/short detection, AFE self-test, and NVM CRC integrity checking |
| Flexible power architecture | Direct low-voltage operation or high-voltage support via external JFET regulator for 7–48 V industrial rails |
Applications
| Industrial Pressure Transmitter | Medical Blood Pressure Monitor |
|---|---|
Use Scenario: High-stability differential pressure measurement in factory automation and process control systems with 4–20 mA loop output. IC Role / Device Role / Timing Role: Dual-channel signal conditioner performing real-time offset/gain/temperature compensation on Wheatstone bridge sensors. Use Value: Enables <10 ppm total error over −25°C to +85°C without external calibration hardware or microcontroller intervention. | Use Scenario: Continuous cuff-based arterial pressure monitoring requiring ratiometric voltage output referenced to supply rail. IC Role / Device Role / Timing Role: Primary sensor front-end converting piezoresistive bridge signals into stable, temperature-compensated analog outputs. Use Value: Delivers ±0.5 mmHg accuracy across patient temperature range using integrated PTAT and SOT Curve-1 compensation. |
| Smart HVAC Sensor Node | Weight Scale Load Cell Interface |
Use Scenario: Battery-powered indoor air quality and airflow sensing node with I²C digital interface and ultra-low standby current. IC Role / Device Role / Timing Role: Low-power dual-path conditioner enabling concurrent humidity and differential pressure readings. Use Value: Achieves 1.2 µA deep-sleep current and wake-on-event capability - extends battery life beyond 5 years. | Use Scenario: High-resolution weighing system using four-wire load cell with 0–10 V absolute output for PLC integration. IC Role / Device Role / Timing Role: Precision bridge signal conditioner with 24-bit resolution and programmable 0–10 V scaling. Use Value: Provides 1:100,000 dynamic range with built-in LSB zeroing and output clipping to prevent saturation at scale limits. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar resistive sensor signal conditioning applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX1452ACM+ | Analog-only signal conditioner; no embedded processor or NVM; requires external microcontroller for coefficient storage and correction | Limited to single-channel operation; lacks digital interfaces (I²C/SPI/OWI) and current-loop output | Choose when legacy analog design flow and minimal BOM cost outweigh need for integrated intelligence and dual-channel capability |
| AD7798BRUZ | 24-bit ΣΔ ADC only; no integrated PGA, math engine, or sensor-specific correction logic | No built-in calibration memory, temperature compensation, or analog output driver - requires full external signal chain | Prefer when system already includes a host MCU for algorithm execution and flexible output stage design is required |
Compared with MAX1452ACM+ and AD7798BRUZ, the ZSSC3281BC6B reduces component count by integrating correction computation, NVM storage, dual AFEs, and programmable analog/digital outputs - eliminating need for external microcontroller, DAC, or discrete compensation circuitry in smart sensor designs.
Availability
ZSSC3281BC6B is available at Aetrix Electronics and suitable for industrial pressure transmitters, medical blood pressure monitors, and smart HVAC sensor nodes requiring stable component supply, long-term lifecycle support, and automotive-grade reliability validation.
Supply support for ZSSC3281BC6B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog, power, and SoC solutions for industrial, automotive, and IoT applications.
The ZSSC3281BC6B belongs to Renesas' Smart Sensor Signal Conditioning product line, engineered to replace discrete front-end circuits with fully integrated, field-programmable sensor conditioners for high-accuracy resistive sensing in harsh environments.
FAQ
What sensor types does the ZSSC3281BC6B support?
The ZSSC3281BC6B supports full-bridge, half-bridge, resistive divider strings, voltage-source elements (e.g., Pt100), and external temperature sensors such as diodes. It accommodates signal spans from 1 mV/V to 500 mV/V and enables dual-sensor operation with independent gain, offset, and temperature compensation per channel - all implemented within the ZSSC3281BC6B's integrated AFE and math core.
Does the ZSSC3281BC6B include on-chip temperature sensing?
Yes, the ZSSC3281BC6B integrates an on-die PTAT (Proportional To Absolute Temperature) sensor used for real-time thermal drift compensation. It also supports up to three external temperature inputs - including bridge-as-thermistor configurations, external diodes, and PTC elements - allowing multi-point thermal modeling directly inside the ZSSC3281BC6B's correction algorithm.
What output formats does the ZSSC3281BC6B provide?
The ZSSC3281BC6B provides absolute voltage outputs (0–1 V, 0–5 V, 0–10 V), VDD-ratiometric voltage, 4–20 mA 2-wire and 3-wire current loops, and configurable interrupt outputs (EOC/EOB/ALARM). All outputs are programmable via its internal registers and supported by the ZSSC3281BC6B's integrated analog output driver with True-0V capability.
How is calibration data stored and updated in the ZSSC3281BC6B?
Calibration coefficients for offset, gain, temperature drift, and non-linearity are stored in reprogrammable non-volatile memory (NVM) inside the ZSSC3281BC6B. These 32-bit values are written via I²C, SPI, or OWI interfaces during production calibration and can be updated in-system - enabling field recalibration and lifetime drift correction without replacing the ZSSC3281BC6B.
What diagnostic functions are built into the ZSSC3281BC6B?
The ZSSC3281BC6B includes hardware-accelerated diagnostics for sensor open/short detection, AFE functional self-test, and NVM memory integrity verification via CRC. Diagnostic status is accessible through dedicated registers and can trigger configurable interrupt outputs (EOC/EOB/ALARM), providing real-time fault visibility without host MCU involvement - a key feature of the ZSSC3281BC6B's autonomous operation.
ZSSC3281BC6B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- Die
- Series:
- -
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Type:
- Signal Conditioner
- Input Type:
- Analog, Digital
- Output Type:
- 1-Wire®, I2C, SPI
- Current - Supply:
- 15 mA
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
ZSSC3281BC6B FAQ
1.How can I place an order for ZSSC3281BC6B through Aetrix?
Please submit a Request for Quotation (RFQ) for ZSSC3281BC6B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZSSC3281BC6B reliable?
The price and inventory of ZSSC3281BC6B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZSSC3281BC6B is usually 5 days.
3.What payment methods are accepted for ZSSC3281BC6B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZSSC3281BC6B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ZSSC3281BC6B?
ZSSC3281BC6B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZSSC3281BC6B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZSSC3281BC6B?
For technical support, including ZSSC3281BC6B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZSSC3281BC6B requirements.
6.How does Aetrix verify that ZSSC3281BC6B is sourced from the original manufacturer or authorized distributors?
All ZSSC3281BC6B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZSSC3281BC6B meets industry standards.
7.What is the process for return or replacement of ZSSC3281BC6B?
All ZSSC3281BC6B units undergo pre-shipment inspection (PSI). If there is an issue with ZSSC3281BC6B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZSSC3281BC6B part is unused and in its original packaging.
Return procedure for ZSSC3281BC6B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ZSSC3281BC6B Tags

-
RE46C100S8TF
Microchip Technology

-
XTR111AIDRCR
Texas Instruments

-
XTR111AIDGQR
Texas Instruments
-
XTR117AIDGKR
Texas Instruments

-
XTR111AIDGQT
Texas Instruments

-
XTR115UA/2K5
Texas Instruments

-
MAX14626ETT+T
Analog Devices Inc./Maxim Integrated

-
XTR116UA/2K5
Texas Instruments

-
XTR115U/2K5
Texas Instruments

-
XTR116U/2K5
Texas Instruments
-
PGA308AIDGSR
Texas Instruments

-
XTR300AIRGWR
Texas Instruments
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

