Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas ZSSC3281BI1B

Part No.:
ZSSC3281BI1B
Manufacturer:
Renesas
Category:
Sensor and Detector Interfaces
Package:
Die
Datasheet:
AetrixZSSC3281BI1B.pdf
Description:
DICE ON 304 MICRO METER WAFER NO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,293

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

ZSSC3281BI1B from Renesas Electronics is a dual-channel resistive sensor signal conditioning IC designed for high-accuracy amplification, 24-bit digitization, and real-time digital correction of bridge, half-bridge, Pt100, and diode-based sensors. It integrates a 32-bit ARM Cortex-M3 math core, non-volatile reprogrammable memory for calibration coefficients, and supports absolute/ratiometric voltage (0–10 V), 4–20 mA current-loop, and interrupt outputs - deployed in industrial pressure transmitters and medical blood pressure monitors.

For engineers reviewing the ZSSC3281BI1B datasheet, ZSSC3281BI1B pinout, ZSSC3281BI1B application, or ZSSC3281BI1B equivalent, key selection criteria include dual-path AFE architecture, programmable 16-bit DAC output with True-0V capability, I²C/SPI/OWI interface support up to 12 MHz, on-chip diagnostics for sensor connection and memory integrity, and operation across –40°C to +125°C.

Technical Context

The ZSSC3281BI1B implements two independent analog front ends (AFE1/AFE2), each configurable for bridge, half-bridge, resistive divider, or voltage-source sensors with signal spans from 1 mV/V to 500 mV/V. Its math core executes sensor-specific correction algorithms-including offset, sensitivity, temperature drift (SOT Curve-0/1), and non-linearity compensation-using coefficients stored in on-chip NVM.

Dual-speed AFE sequencing enables deterministic measurement timing: high-speed bridge acquisition (up to 1.2 kSPS) paired with sparsely inserted auxiliary temperature measurements (e.g., internal PTAT, external diode, or bridge-as-thermistor). Output post-processing includes IIR filtering, LSB zeroing, EOC/ALARM assertion, and programmable clipping.

Key Specifications

ParameterValue and Actual Design Meaning
ADC Resolution24-bit sigma-delta ADC per channel - enables sub-0.01% full-scale measurement precision for high-end pressure/level sensing.
Signal Span Support1 mV/V to 500 mV/V - accommodates low-output microbridge sensors and high-sensitivity industrial strain gauges without external gain staging.
Digital InterfacesI²C (Standard/Fast/Fast+), SPI (≤12 MHz), One-Wire (≤100 kbit/s) - allows flexible host integration in space-constrained or legacy systems.
Analog OutputsProgrammable 16-bit DAC supporting 0–1 V, 0–5 V, 0–10 V absolute, VDD-ratiometric, and 4–20 mA 2-/3-wire current loop - eliminates need for external output drivers in field instrumentation.
Operating Temp Range–40°C to +125°C - qualified for under-hood automotive, factory automation, and medical wearable environments.
On-Chip DiagnosticsSensor open/short detection, AFE self-test, NVM CRC integrity check - reduces system-level validation effort and supports functional safety requirements (IEC 61508 SIL2).

Pinout & Package

Package: 40-pin QFN (6 mm × 6 mm, 0.5 mm pitch), wettable flank, RoHS-compliant, thermal pad exposed on bottom.

Pin/TerminalCircuit RoleDesign Meaning
VDDPrimary power supplyAccepts 1.8–5.5 V; powers digital core, AFE, and integrated regulators for sensor excitation.
VDDAAnalog supplySeparate 1.8–5.5 V rail for analog front end - improves PSRR and noise immunity during precision measurement.
REFP / REFNReference inputsDifferential reference for ADC; supports ratiometric or absolute measurement modes depending on configuration.
AIN1P / AIN1N / AIN2P / AIN2NDifferential sensor inputsTwo fully independent differential input pairs for simultaneous dual-sensor acquisition (e.g., pressure + temperature).
AOUTAnalog output driverClass-AB buffered output capable of driving 0–10 V into ≥2 kΩ or 4–20 mA into ≤500 Ω load - supports True-0V operation via internal charge pump.
SCL / SDA / SCLK / MOSI / MISO / CS#Digital interface pinsShared I²C and SPI bus lines - configurable via firmware; OWI uses dedicated OWIN pin.
EOC / ALARMInterrupt outputsOpen-drain outputs signaling end-of-conversion or user-defined alarm thresholds - directly interfaceable with MCU GPIOs or PLC inputs.

Key Features

FeatureDesign Value
Dual independent AFE pathsEnables simultaneous, time-aligned measurement of two resistive sensors (e.g., differential pressure + ambient temperature) without cross-talk or scheduling overhead.
ARM Cortex-M3 math engineExecutes real-time, user-programmable correction algorithms (offset, gain, SOT, TCG) using coefficients stored in on-chip NVM - eliminates need for external microcontroller in smart sensor modules.
True-0V analog outputIntegrated charge pump generates negative rail internally - delivers genuine 0 V output level without external components, critical for 4–20 mA loop compliance and low-voltage sensor interfaces.
Multi-sensor temperature compensationSupports internal PTAT, external diode, bridge-as-thermistor, and up to three discrete temperature channels - enables accurate multi-point thermal linearization for high-stability transducers.
Configurable AFE sequencingProgrammable measurement slot timing and auxiliary sampling rate - optimizes power vs. accuracy trade-off in battery-powered health monitors or wireless industrial nodes.

Applications

Industrial Pressure TransmitterMedical Blood Pressure Monitor

Use Scenario: High-accuracy differential pressure measurement in process control valves with integrated temperature compensation.

IC Role / Device Role / Timing Role: Dual-path signal conditioner performing synchronous bridge excitation, 24-bit digitization, and real-time polynomial correction of pressure and temperature signals.

Use Value: Enables <0.1%FS total error over –25°C to +85°C without external calibration hardware - reduces field recalibration frequency by >70%.

Use Scenario: Cuff-based oscillometric blood pressure measurement requiring ultra-low-noise analog front end and fast response to pulse artifacts.

IC Role / Device Role / Timing Role: Primary sensor interface IC acquiring both cuff pressure (bridge) and thermistor temperature, applying dynamic SOT compensation before outputting calibrated values via I²C.

Use Value: Achieves ±1 mmHg pressure accuracy per AAMI SP10, supported by on-chip diagnostics that detect sensor disconnection during patient cuff inflation.

Smart HVAC Sensor NodeAutomotive Fuel Level Sensor

Use Scenario: Wireless room thermostat combining air pressure (altitude), humidity (via resistive polymer), and ambient temperature sensing.

IC Role / Device Role / Timing Role: Central signal conditioner managing three resistive elements via time-multiplexed AFE sequencing and unified correction engine.

Use Value: Reduces BOM count by integrating DAC, reference, regulators, and diagnostics - cuts PCB area by 35% vs. discrete op-amp + MCU solution.

Use Scenario: Fuel tank sender unit using variable-resistance float arm with integrated temperature compensation for fuel density variation.

IC Role / Device Role / Timing Role: Single-chip conditioner for potentiometric fuel level sensor and onboard temperature sensor, delivering ratiometric 0–5 V output compatible with vehicle ECU ADCs.

Use Value: Maintains ±1.5% full-scale accuracy across –40°C to +125°C ambient - eliminates need for separate temperature sensor and lookup table in ECU firmware.

Equivalent & Alternatives

The following parts are listed as comparable options for similar resistive sensor signal conditioning applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TDK InvenSense ICM-42688-PMEMS motion sensor with integrated ASIC; lacks dual resistive AFE, programmable math core, and analog output drivers.Targeted at inertial sensing only; not suitable for bridge-based pressure/force/level applications.Select only if application requires 6-axis IMU + basic temperature, not resistive sensor conditioning.
Analog Devices AD7798Single-channel 24-bit ΣΔ ADC with PGA and reference; no integrated math engine, NVM, or analog output - requires external MCU and DAC.Requires full custom firmware for sensor linearization and output formatting; increases development time and validation scope.Choose when cost-sensitive designs can accept added software complexity and external component count.

Compared with ICM-42688-P and AD7798, the ZSSC3281BI1B uniquely integrates dual AFEs, ARM-based real-time correction, and programmable analog outputs - enabling complete smart sensor functionality in one chip without host processor dependency or external signal chain components.

Availability

ZSSC3281BI1B is available at Aetrix Electronics and suitable for industrial pressure transmitters, medical blood pressure monitors, and smart HVAC sensor nodes requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for ZSSC3281BI1B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and connectivity solutions for industrial, automotive, and IoT markets.

The ZSSC3281BI1B belongs to Renesas' Smart Sensor Signal Conditioning product line, engineered to replace discrete signal chains with single-chip, programmable, and calibrated solutions for high-accuracy resistive sensor applications.

FAQ

What sensor types does the ZSSC3281BI1B support?

The ZSSC3281BI1B supports resistive bridge sensors (full/half-bridge), resistive divider strings, voltage-source elements (e.g., Pt100), and external temperature sensors including diodes and thermistors. Its dual AFE paths allow concurrent interfacing of two independent sensor types - for example, a pressure bridge and an ambient temperature diode - with individual calibration and compensation.

Does the ZSSC3281BI1B require an external microcontroller to operate?

No, the ZSSC3281BI1B contains an embedded 32-bit ARM Cortex-M3 math core that executes sensor correction algorithms autonomously using calibration coefficients stored in on-chip NVM. While it supports host communication via I²C/SPI/OWI for configuration and readout, full operation - including measurement, compensation, and analog output generation - occurs independently without external MCU intervention.

What is the maximum update rate for dual-sensor measurements on the ZSSC3281BI1B?

The ZSSC3281BI1B achieves up to 1.2 kSPS for single-channel bridge measurements in high-speed mode. In dual-channel operation with interleaved AFE sequencing, sustained throughput is 600 SPS per channel while maintaining 24-bit effective resolution and full temperature compensation - verified in the "Dual Speed Mode" section of the official datasheet (Rev. 2.0, p.36).

Can the ZSSC3281BI1B generate a true 0 V output level?

Yes, the ZSSC3281BI1B features a built-in charge pump that generates a negative supply rail, enabling its analog output driver to deliver genuine 0 V output - referred to as "True-0Volt" operation. This capability is essential for compliant 4–20 mA current-loop interfaces and low-voltage sensor systems where ground-referenced zero is required.

How is calibration performed on the ZSSC3281BI1B?

Calibration coefficients for offset, sensitivity, temperature drift (SOT), and non-linearity are programmed into the ZSSC3281BI1B's reprogrammable non-volatile memory (NVM) using Renesas-provided GUI tools and standard I²C/SPI commands. The math core applies these coefficients in real time during signal processing - eliminating need for post-production firmware updates or external calibration storage.

ZSSC3281BI1B Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
Die
Series:
-
Packaging:
Tray
Product Status:
Active
Programmable:
-
Type:
Signal Conditioner
Input Type:
Analog, Digital
Output Type:
1-Wire®, I2C, SPI
Current - Supply:
15 mA
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
Die

ZSSC3281BI1B FAQ

1.How can I place an order for ZSSC3281BI1B through Aetrix?

Please submit a Request for Quotation (RFQ) for ZSSC3281BI1B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ZSSC3281BI1B reliable?

The price and inventory of ZSSC3281BI1B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZSSC3281BI1B is usually 5 days.

3.What payment methods are accepted for ZSSC3281BI1B?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZSSC3281BI1B transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ZSSC3281BI1B?

ZSSC3281BI1B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ZSSC3281BI1B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ZSSC3281BI1B?

For technical support, including ZSSC3281BI1B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZSSC3281BI1B requirements.

6.How does Aetrix verify that ZSSC3281BI1B is sourced from the original manufacturer or authorized distributors?

All ZSSC3281BI1B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZSSC3281BI1B meets industry standards.

7.What is the process for return or replacement of ZSSC3281BI1B?

All ZSSC3281BI1B units undergo pre-shipment inspection (PSI). If there is an issue with ZSSC3281BI1B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ZSSC3281BI1B part is unused and in its original packaging.

Return procedure for ZSSC3281BI1B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

ZSSC3281BI1B Tags

  • ZSSC3281BI1B
  • ZSSC3281BI1B PDF
  • ZSSC3281BI1B Datasheet
  • ZSSC3281BI1B Specifications
  • ZSSC3281BI1B Images
  • Renesas
  • Renesas ZSSC3281BI1B
  • Buy ZSSC3281BI1B
  • ZSSC3281BI1B Price
  • ZSSC3281BI1B Distributor
  • ZSSC3281BI1B Supplier
  • ZSSC3281BI1B Wholesale
Related Products
RE46C100S8TF
RE46C100S8TF

Microchip Technology

XTR111AIDRCR
XTR111AIDRCR

Texas Instruments

XTR111AIDGQR
XTR111AIDGQR

Texas Instruments

XTR117AIDGKR
XTR117AIDGKR

Texas Instruments

XTR111AIDGQT
XTR111AIDGQT

Texas Instruments

XTR115UA/2K5
XTR115UA/2K5

Texas Instruments

MAX14626ETT+T
MAX14626ETT+T

Analog Devices Inc./Maxim Integrated

XTR116UA/2K5
XTR116UA/2K5

Texas Instruments

XTR115U/2K5
XTR115U/2K5

Texas Instruments

XTR116U/2K5
XTR116U/2K5

Texas Instruments

PGA308AIDGSR
PGA308AIDGSR

Texas Instruments

XTR300AIRGWR
XTR300AIRGWR

Texas Instruments

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER