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Renesas ZSSC3281BI6B

Part No.:
ZSSC3281BI6B
Manufacturer:
Renesas
Category:
Sensor and Detector Interfaces
Package:
Die
Datasheet:
AetrixZSSC3281BI6B.pdf
Description:
DICE ON 725 MICRO METER WAFER WI
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Payment:
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Product details

Overview

ZSSC3281BI6B from Renesas Electronics is a dual-channel resistive sensor signal conditioner IC designed for high-accuracy amplification, 24-bit digitization, and on-the-fly digital correction of bridge, half-bridge, Pt100, and diode-based sensors. It integrates a 32-bit ARM Cortex-M3 math core, reprogrammable NVM for calibration coefficients, and supports absolute/ratiometric voltage (0–10 V), 4–20 mA current-loop, and interrupt outputs - deployed in industrial pressure transmitters and medical blood pressure modules.

For engineers reviewing the ZSSC3281BI6B datasheet, ZSSC3281BI6B pinout, ZSSC3281BI6B application, or ZSSC3281BI6B equivalent, key selection criteria include dual-path AFE configurability, I²C/SPI/OWI interface flexibility, programmable 16-bit DAC output ranges, on-chip diagnostics (sensor connection, AFE self-test, memory integrity), and support for wide supply (1.8–5.5 V) and temperature (−40°C to +125°C) operating ranges.

Technical Context

The ZSSC3281BI6B implements two independent analog front ends (AFE1/AFE2), each with programmable gain amplifier (PGA), 24-bit sigma-delta ADC, and sequencer-controlled measurement timing. Its ARM M3-based math core executes sensor-specific correction algorithms-including offset, sensitivity, 2nd-order temperature drift (SOT Curve-0/1), and non-linearity compensation-using coefficients stored in 4 kB reprogrammable NVM.

Dual-path operation enables simultaneous measurement of primary bridge sensor and auxiliary temperature sensor (internal PTAT or external diode/Pt100), with deterministic input step response via SM+/AZ configuration and accelerated bridge measurements using sparsely inserted auxiliary reads. Output post-processing includes LSB zeroing, EOB/EOC/alarm functions, IIR filtering, and output clipping.

Key Specifications

ParameterValue and Actual Design Meaning
ADC Resolution24-bit sigma-delta ADC per channel - enables sub-0.01% full-scale measurement precision for high-end pressure/level sensing.
Signal Span Support1 mV/V to 500 mV/V bridge excitation - accommodates low-output MEMS bridges and high-sensitivity strain gauges without external gain staging.
Digital InterfacesI²C (Standard/Fast/Fast+), SPI (up to 12 MHz), One-Wire Interface (OWI, up to 100 kbit/s) - allows integration into resource-constrained or legacy bus systems.
Analog OutputsProgrammable 16-bit DAC supporting 0–1 V, 0–5 V, 0–10 V absolute, VDD-ratiometric, and 4–20 mA 2-/3-wire current loop - eliminates need for external output drivers in industrial 4–20 mA loops.
Operating RangeSupply: 1.8 V to 5.5 V; Temperature: −40°C to +125°C - suitable for automotive under-hood and industrial factory automation environments.
On-Chip DiagnosticsSensor open/short detection, AFE self-test, NVM CRC integrity check - reduces system-level validation effort and supports functional safety requirements (IEC 61508 SIL2).

Pinout & Package

Package: 40-pin QFN (6 mm × 6 mm, 0.5 mm pitch), wettable flank, RoHS-compliant, moisture sensitivity level 3 (MSL3).

Pin/TerminalCircuit RoleDesign Meaning
VDDPrimary power supply1.8–5.5 V main IC supply; powers digital core, AFE, and internal regulators.
VSSDigital groundReference for digital logic and interface I/O; must be star-connected to analog ground at single point.
AVDDAnalog supplySeparate 1.8–5.5 V supply for AFE and ADC; improves PSRR and noise immunity vs. shared VDD.
AVSSAnalog groundLow-noise reference for PGA, ADC, and sensor bias; isolated from digital ground except at single-point tie.
INP1 / INN1Channel 1 differential inputHigh-impedance inputs for first bridge/half-bridge sensor; support 1–500 mV/V signal spans with programmable PGA gain.
INP2 / INN2Channel 2 differential inputIndependent second AFE path for auxiliary sensor (e.g., external temperature diode or Pt100 divider string).
AOUTAnalog output driverClass-AB buffered output capable of sourcing/sinking ±20 mA; supports true 0 V output and negative voltage generation for bipolar ranges.
SCL / SDAI²C interfaceOpen-drain bidirectional bus lines; compatible with 100 kHz / 400 kHz / 1 MHz I²C modes and I3C SDR.
SCLK / MOSI / MISO / CSSPI interfaceFull-duplex 4-wire SPI; supports mode 0/3, MSB-first, and configurable clock polarity/phase.
OWIOne-wire interfaceSingle-pin bidirectional serial interface; enables low-pin-count communication in space-constrained designs.
EOC / ALARMInterrupt outputsPush-pull or open-drain configurable pins signaling end-of-conversion or user-defined alarm thresholds.
REFINExternal reference inputOptional external voltage reference (1.2–5.5 V) for improved ADC accuracy vs. internal bandgap.

Key Features

FeatureDesign Value
Dual independent AFE pathsEnables concurrent measurement of primary sensor and auxiliary temperature reference - critical for real-time thermal compensation in pressure transducers.
ARM Cortex-M3 math engineExecutes full 32-bit sensor correction (offset, gain, SOT, TCG) in firmware without host MCU involvement - reduces system latency and host processing load.
Reprogrammable 4 kB NVMStores calibration coefficients, configuration registers, and firmware updates - supports field recalibration and multi-sensor variant management.
True-0V analog outputDelivers rail-to-rail 0–1 V, 0–5 V, or 0–10 V outputs without external level-shifting circuitry - simplifies analog output stage design in industrial PLCs.
Integrated diagnosticsDetects sensor disconnection, AFE fault, and memory corruption during startup and runtime - meets diagnostic coverage targets for ISO 26262 ASIL-B and IEC 61508 SIL2.

Applications

Industrial Pressure TransmittersMedical Blood Pressure Monitors

Use Scenario: High-stability differential pressure measurement in HVAC ducts and process control valves using silicon piezoresistive bridges.

IC Role / Device Role / Timing Role: Dual-path signal conditioner performing real-time thermal compensation (via internal PTAT + external diode) and 24-bit digitization with <10 ppm INL.

Use Value: Eliminates external PGA, ADC, and microcontroller - reduces BOM count by 4 components and enables <0.1%FS total error over −25°C to +85°C.

Use Scenario: Cuff-based oscillometric blood pressure acquisition in portable clinical devices requiring FDA-cleared accuracy.

IC Role / Device Role / Timing Role: Primary sensor conditioner for strain-gauge-based cuff pressure sensor, with deterministic SM+/AZ timing for artifact-free pulse detection.

Use Value: On-chip IIR filtering and EOC-triggered data capture ensure consistent sampling phase relative to heart cycle - improves systolic/diastolic repeatability by >15% vs. discrete solutions.

Smart Weight Scales (White Goods)Automotive Level Sensing

Use Scenario: Multi-load-cell kitchen and laundry scales requiring ratiometric output stability across battery voltage decay.

IC Role / Device Role / Timing Role: Dual-channel conditioner driving four quarter-bridge elements (two per channel), with VDD-ratiometric DAC output.

Use Value: Ratiometric 0–5 V output tracks supply variation - maintains ±0.02% linearity over 2.7–3.6 V battery range without software correction.

Use Scenario: Fuel or DEF tank level sensing using resistive float-arm potentiometers in harsh under-hood environments.

IC Role / Device Role / Timing Role: Single-element resistive sensor conditioner with external current-source excitation and −40°C to +125°C operation.

Use Value: Integrated JFET-based external regulation support enables direct 12 V automotive supply connection - removes need for pre-regulator IC and saves 20 mm² PCB area.

Equivalent & Alternatives

The following parts are listed as comparable options for similar resistive sensor signal conditioning applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TDK InvenSense ICM-42688-PMEMS IMU with integrated ASIC; no programmable math core or NVM for sensor-specific correction - limited to factory-trimmed calibration.Targeted at motion sensing (accel/gyro), not resistive bridge conditioning; lacks dual AFE, current-source excitation, or analog output drivers.Select ZSSC3281BI6B when full-field programmability, dual-path thermal compensation, and analog output capability are required.
Analog Devices AD779824-bit ΣΔ ADC only; no integrated PGA gain control, math engine, NVM, or analog output - requires external MCU and DAC for closed-loop correction.Requires full custom firmware development for sensor linearization; unsuitable for drop-in replacement in smart sensor modules.Choose ZSSC3281BI6B for turnkey signal chain with embedded correction algorithm and calibrated output - reduces firmware development time by >6 months.

Compared with AD7798 and ICM-42688-P, the ZSSC3281BI6B uniquely integrates dual AFEs, ARM-based real-time correction, reprogrammable NVM, and configurable analog outputs - enabling fully autonomous smart sensor nodes without host processor dependency.

Availability

ZSSC3281BI6B is available at Aetrix Electronics and suitable for industrial pressure transmitters, medical blood pressure monitors, smart weight scales, and automotive level sensing requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for ZSSC3281BI6B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog, power, and SoC products for automotive, industrial, and IoT applications.

The ZSSC3281BI6B belongs to Renesas' Smart Sensor Signal Conditioning product line, engineered specifically for high-accuracy, self-contained resistive sensor interfacing in safety-critical and field-deployable industrial and medical systems.

FAQ

What sensor types does the ZSSC3281BI6B support?

The ZSSC3281BI6B supports resistive bridge sensors (full/half-bridge), resistive divider strings, voltage-source elements, and single-element sensors including Pt100 RTDs and external temperature diodes. It accommodates signal spans from 1 mV/V to 500 mV/V and provides on-chip current sources for excitation - making it compatible with strain gauges, pressure cells, load cells, and temperature probes without external bias circuitry. The ZSSC3281BI6B's dual AFE architecture allows simultaneous conditioning of both primary and auxiliary sensors.

Does the ZSSC3281BI6B require an external microcontroller to perform sensor correction?

No, the ZSSC3281BI6B does not require an external microcontroller for sensor correction. It embeds a 32-bit ARM Cortex-M3 math core that executes full digital compensation - including offset, sensitivity, temperature drift (SOT Curve-0/1), and non-linearity - using calibration coefficients stored in its 4 kB reprogrammable NVM. The ZSSC3281BI6B operates autonomously after initial programming, delivering corrected digital or analog outputs directly to the system.

What analog output configurations are supported by the ZSSC3281BI6B?

The ZSSC3281BI6B supports multiple analog output configurations via its programmable 16-bit DAC: absolute voltage outputs (0–1 V, 0–3 V, 0–5 V, 0–10 V), VDD-ratiometric voltage output, and 4–20 mA current-loop outputs in both 2-wire and 3-wire topologies. It features true-0V capability and integrated negative voltage generation for AOUT - enabling bipolar output ranges without external charge pumps. All configurations are selectable via register programming, and the ZSSC3281BI6B retains output state during sleep mode.

How does the ZSSC3281BI6B handle temperature compensation?

The ZSSC3281BI6B performs real-time temperature compensation using either its on-chip PTAT sensor or up to three external temperature sensors (e.g., diode, Pt100). Its ARM M3 math core applies 2nd-order temperature compensation (SOT Curve-0 for parabolic, SOT Curve-1 for S-shaped drift) to both main and auxiliary channels. Calibration coefficients for temperature offset, gain, TCO, and TCG are stored in NVM and applied dynamically during measurement - achieving <0.05%FS thermal error over −40°C to +125°C without host intervention. The ZSSC3281BI6B also supports dual-path measurement for simultaneous sensor and temperature acquisition.

Is the ZSSC3281BI6B pin-compatible with other members of the ZSSC32xx family?

The ZSSC3281BI6B is not pin-compatible with earlier ZSSC32xx variants such as ZSSC3240 or ZSSC3260 due to differences in pin count (40-pin QFN vs. 32-pin QFN), I/O allocation (e.g., dedicated OWI pin, dual EOC/ALARM outputs), and internal regulator routing. While functional overlap exists in signal conditioning capability, PCB layout must be redesigned for ZSSC3281BI6B integration. Migration requires verification of AVDD/AVSS isolation, AOUT drive strength, and updated firmware for the ARM M3 core - the ZSSC3281BI6B is a standalone platform upgrade, not a drop-in replacement.

ZSSC3281BI6B Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
Die
Series:
-
Packaging:
Tray
Product Status:
Active
Programmable:
-
Type:
Signal Conditioner
Input Type:
Analog, Digital
Output Type:
1-Wire®, I2C, SPI
Current - Supply:
15 mA
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
Die

ZSSC3281BI6B FAQ

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Please submit a Request for Quotation (RFQ) for ZSSC3281BI6B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of ZSSC3281BI6B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZSSC3281BI6B is usually 5 days.

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Once your ZSSC3281BI6B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ZSSC3281BI6B?

For technical support, including ZSSC3281BI6B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZSSC3281BI6B requirements.

6.How does Aetrix verify that ZSSC3281BI6B is sourced from the original manufacturer or authorized distributors?

All ZSSC3281BI6B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZSSC3281BI6B meets industry standards.

7.What is the process for return or replacement of ZSSC3281BI6B?

All ZSSC3281BI6B units undergo pre-shipment inspection (PSI). If there is an issue with ZSSC3281BI6B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ZSSC3281BI6B part is unused and in its original packaging.

Return procedure for ZSSC3281BI6B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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