Diodes Incorporated ZXTP03200BGTA

Overview

ZXTP03200BGTA from Diodes Incorporated is a 200V PNP medium-power low-saturation transistor in SOT223 package, rated for -2A continuous collector current and -200V collector-emitter breakdown voltage, with V_CE(sat) < -160mV at -1A and R_SAT = 135mΩ; used in high-reliability DC-DC conversion stages requiring robust high-voltage switching.

For engineers reviewing the ZXTP03200BGTA datasheet, ZXTP03200BGTA pinout, ZXTP03200BGTA application, or ZXTP03200BGTA equivalent, key selection criteria include verified AEC-Q101 qualification, low on-resistance under high-current bias, thermal performance on 50mm×50mm 2oz copper, and safe operating area up to -200V/-2A DC conditions.

Technical Context

This PNP bipolar junction transistor delivers enhanced switching performance via optimized base doping and epitaxial structure, enabling fast turn-off (t_f = 75ns) and short storage time (t_s = 680ns) under -1A load with -100mA base drive. Its BV_CEO = -200V and BVCBO = -220V support operation in high-voltage industrial power rails.

The device features a thermally efficient SOT223 package with R_θJL = 10.5°C/W to lead and R_θJA = 21.5°C/W on 50mm×50mm 2oz copper, enabling stable 3.0W continuous dissipation at T_A ≤ 70°C. ESD ratings meet JEDEC HBM Class 3A (4kV) and MM (400V).

Key Specifications

Pinout & Package

SOT223 package with three terminals: emitter (E), collector (C), and base (B); molded green plastic case, UL 94V-0 rated, 0.112g weight, matte tin-plated leads solderable per MIL-STD-202 Method 208.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PNP high-voltage switching applications.

Compared with ZXTP2027GTA and MJD2955T4G, ZXTP03200BGTA uniquely balances 200V blocking, 2A current, and sub-160mV saturation in a surface-mount SOT223 package-making it optimal for space-constrained, medium-power industrial converters where thermal design leverages PCB copper area rather than heatsinks.

Availability

ZXTP03200BGTA is available at Aetrix Electronics and suitable for industrial DC-DC converters, automotive LED drivers, and high-voltage relay drivers requiring stable component supply and AEC-Q101-compliant reliability.

Supply support for ZXTP03200BGTA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in China, Malaysia, and Taiwan.

The ZXTP series targets high-reliability medium-power switching applications, emphasizing AEC-Q101 qualification, low saturation, and thermal robustness in compact surface-mount packages for industrial and automotive power systems.

FAQ

What is the maximum allowable continuous collector current for ZXTP03200BGTA at 100°C ambient?

At T_A = 100°C, the maximum continuous collector current is derated to approximately -1.1A based on the 3.0W power dissipation limit and R_θJA = 41.6°C/W (25mm×25mm 1oz copper). This value is confirmed by the derating curve on page 3 of DS33722 Rev. 2–2.

Is ZXTP03200BGTA suitable for linear regulator applications?

Yes-its low V_CE(sat) and high h_FE (170 typ. @ -1A) support stable linear operation, but thermal design must accommodate R_θJA = 21.5°C/W on 50mm×50mm 2oz copper to sustain 3.0W dissipation. It is not recommended for >2A linear loads without active cooling.

Does ZXTP03200BGTA require a base resistor in typical switching configurations?

Yes-a series base resistor is required to limit I_B to ≤ -400mA (absolute max) and ensure proper saturation. For -1A collector current with h_FE ≥ 100, a 10Ω resistor from -5V logic drive yields -450mA base current, meeting the I_C/I_B = 20 rule-of-thumb for hard saturation.

How does the SOT223 package's thermal performance compare between single-sided and double-sided PCB layouts?

R_θJA improves from 100°C/W (15mm×15mm 1oz single-sided) to 21.5°C/W (50mm×50mm 2oz single-sided) per datasheet notes 5–8. Double-sided copper with thermal vias can further reduce R_θJA by ~15%, but the datasheet only specifies single-sided test conditions.