Diodes Incorporated ZXTS1000E6TA

Overview

ZXTS1000E6TA from Diodes Incorporated (formerly Zetex) is a monolithic PNP bipolar transistor and Schottky barrier diode in a single SOT23-6 package, designed for low-saturation switching and fast DC-DC conversion. It delivers V_CEO = −12 V, I_C = −1.25 A (transistor), V_R = 40 V / I_F = 0.5 A (diode), and V_CE(sat) as low as −110 mV at I_C = −0.5 A / I_B = −10 mA - used in PCMCIA power switches and mobile telecomms load control.

For engineers reviewing the ZXTS1000E6TA datasheet, ZXTS1000E6TA pinout, ZXTS1000E6TA application, or ZXTS1000E6TA equivalent, key selection criteria include verified dual-die thermal coupling, confirmed SOT23-6 terminal mapping, measured t_on/t_off of 50 ns / 135 ns, and validated Schottky V_F ≤ 460 mV at 250 mA - critical for synchronous buck topologies requiring integrated freewheeling.

Technical Context

This dual-function device integrates a high-gain (h_FE ≥ 300 @ I_C = −10 mA) PNP switch with a low-V_F, fast-recovery (t_rr = 10 ns) Schottky diode on one die substrate. Both elements share thermal mass but operate electrically independent - enabling compact, thermally coupled switching cells where the diode provides freewheeling path during transistor turn-off.

It supports pulsed operation up to I_FSM = 6.75 A (t ≤ 100 µs) and maintains safe operating area (SOA) compliance up to V_CE = −2 V / I_C = −1.25 A at +25°C. R_θJA is 113°C/W when both dies are active on FR4 with 1 oz copper - confirming suitability for space-constrained, intermittently loaded DC-DC stages.

Key Specifications

Pinout & Package

Package: SOT23-6 (6-lead surface-mount plastic package per JEDEC TO-236AB); dimensions match Zetex drawing A1 with 0.95 mm lead pitch (e), 2.9 mm × 2.8 mm body (D × E), and 1.1 mm max height (A).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-function PNP + Schottky switching applications.

Compared with ZXTS1000E6TA, ZXTS1000E6TC offers identical performance in larger reels for volume manufacturing, while DMBT3725E6T5G trades 150 mV higher diode V_F for +8 V V_CEO headroom and +0.75 A I_C - making it preferable for 24 V industrial rails but less efficient in portable 12 V designs.

Availability

ZXTS1000E6TA is available at Aetrix Electronics and suitable for mobile telecomms power switching, PCMCIA hot-swap control, and SCSI termination regulation requiring stable component supply, consistent parametric performance, and long-term lifecycle support.

Supply support for ZXTS1000E6TA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated acquired Zetex plc in 2008 and maintains its high-performance analog and discrete product lines with focus on power management, signal integrity, and protection devices.

ZXTS1000E6TA belongs to Zetex's legacy "ZXT" series of integrated bipolar-Schottky switches - engineered specifically for space-constrained, high-efficiency DC-DC conversion in portable and communications equipment.

FAQ

What is the maximum junction temperature for continuous operation?

The absolute maximum junction temperature T_j is 125°C, as specified in the Absolute Maximum Ratings table. Operation above this temperature risks permanent degradation of both transistor gain and Schottky reverse leakage. Derating is required above +85°C ambient - for example, at +100°C ambient, maximum allowable power dissipation drops to 0.3 W when both dies are active (R_θJA = 113°C/W).

Can Pin 5 be left unconnected in a buck converter layout?

Yes - Pin 5 (isolated diode cathode) may be left floating or tied to ground depending on topology. In standard synchronous buck configurations, Pin 4 (shared collector/cathode) connects to the switch node, while Pin 5 remains unused. Leaving it unconnected does not affect functionality but improves layout flexibility for PCB routing and thermal relief.

Is the transistor electrically isolated from the Schottky diode?

No - both devices share the same silicon substrate and thermal mass, though their electrical paths are independent. The datasheet confirms no isolation barrier exists between them; therefore, simultaneous conduction is possible but must be avoided in design. Thermal coupling is intentional: R_θJA values assume both dies contribute to total power dissipation.

What is the recommended PCB pad layout for thermal reliability?

Use the Zetex-provided SOT23-6 footprint with 1.5 mm × 1.75 mm pad (E1), 0.35 mm wide leads (b), and full 1 oz copper pour under the package. For thermal performance, connect Pins 1 and 6 (emitters) and Pin 4 (collector/cathode) to ≥25 mm² copper areas - matching the 25 mm × 25 mm test board condition used to derive R_θJA = 113°C/W.