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Microchip Technology 1N4148UBCCC
- Part No.:
- 1N4148UBCCC
- Manufacturer:
- Microchip Technology
- Category:
- Diode Arrays
- Package:
- 3-SMD, No Lead
- Datasheet:
-
1N4148UBCCC.pdf
- Description:
- DIODE ARRAY GEN PURP 75V 1A UBC
- Quantity:
- Payment:
- Shipping:
Inventory:5,562
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Product details
Overview
1N4148UBCCC from Microsemi is a military-qualified surface-mount silicon switching diode in a ceramic UB package with common cathode polarity, 75 V working peak reverse voltage, 5 ns reverse recovery time, and 0.8 V forward voltage at 10 mA - used in high-frequency RS-232/RS-422 interface networks and Ethernet 10 Base-T data lines.
For engineers reviewing the 1N4148UBCCC datasheet, 1N4148UBCCC pinout, 1N4148UBCCC application, or 1N4148UBCCC equivalent, key selection criteria include MIL-PRF-19500/116 JANTXV qualification, low 4.0 pF capacitance at 0 V, thermal resistance of 120 °C/W junction-to-solder pad, and unidirectional/common cathode configuration for signal routing in space-constrained military avionics and ruggedized comms hardware.
Technical Context
This device implements a planar-diffused silicon PN junction optimized for fast transient response in signal-level switching applications. Its ceramic UB package provides hermetic sealing and stable electrical performance across −65 °C to +200 °C junction temperature range, with gold-plated terminals ensuring reliable solderability under thermal cycling.
The 1N4148UBCCC meets MIL-PRF-19500/116 requirements for JAN/JANTX/JANTXV reliability levels, supporting operation in high-reliability systems where reverse recovery time (trr = 5 ns) and low leakage (IR1 = 25 nA @ 20 V) are critical for noise immunity in digital I/O and bus termination circuits.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Working Peak Reverse Voltage | 75 V - maximum continuous DC reverse bias before significant leakage or breakdown in RS-232 line protection. |
| Reverse Recovery Time | 5 ns - enables clean edge transitions in >10 MHz digital signal routing without ringing or cross-talk. |
| Forward Voltage | 0.8 V @ 10 mA - low conduction loss for logic-level clamping and level-shifting in 3.3 V/5 V systems. |
| Junction Temperature Range | −65 °C to +200 °C - supports deployment in aerospace, downhole, and engine-control environments. |
| Capacitance | 4.0 pF @ 0 V - minimizes signal loading on high-speed data lines such as Ethernet 10 Base-T differential pairs. |
| Average Rectified Current | 200 mA @ TA = 75 °C - sufficient for transient suppression and signal conditioning in low-power interface ICs. |
| Thermal Resistance (J–Solder Pad) | 120 °C/W - allows direct thermal path to PCB copper for sustained pulse operation without derating. |
Pinout & Package
Ceramic UB surface-mount package with two terminals: base-mounted metallized pads, gold-plated nickel underplate, hermetically sealed lid. Dimensions: 3.25 mm × 2.74 mm × 1.42 mm (L × W × H), weight < 0.04 g.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pad 1 | Anode | Input node for forward conduction; connects to signal source or positive rail in clamping configurations. |
| Pad 2 | Cathode | Output/reference node; ties to ground or lower-potential rail in common-cathode ESD protection or level-shift paths. |
Key Features
| Feature | Design Value |
|---|---|
| MIL-PRF-19500/116 JANTXV qualification | Validated screening for burn-in, temperature cycling, and life testing - required for flight-critical subsystems. |
| Common cathode polarity (CC suffix) | Enables dual-diode parallel routing from shared cathode node - simplifies layout in bidirectional bus terminations. |
| Low 4.0 pF junction capacitance | Preserves signal integrity on 10–50 MHz digital lines without added impedance discontinuity or timing skew. |
| Hermetic ceramic construction | Eliminates moisture ingress and parameter drift over 20+ year service life in humid or corrosive environments. |
| Gold-plated terminals | Ensures repeatable solder joint strength and intermetallic formation during reflow, even after multiple thermal cycles. |
Applications
| RS-232 Interface Protection | Ethernet 10 Base-T Termination |
|---|---|
Use Scenario: Protecting UART transceivers against ESD and line transients in industrial serial gateways. IC Role / Device Role: Unidirectional clamping diode placed between TX/RX lines and chassis ground. Use Value: 5 ns trr prevents latch-up during fast-rising ESD pulses; 75 V VRWM withstands induced surges up to ±1 kV per IEC 61000-4-2 Level 4. | Use Scenario: Biasing and termination of twisted-pair differential signals in legacy Ethernet PHY interfaces. IC Role / Device Role: Common-cathode dual diode providing DC bias and AC coupling isolation. Use Value: 4.0 pF capacitance avoids signal reflection on 100 Ω differential lines; ceramic package ensures stable C vs. temperature across −40 °C to +85 °C ambient. |
| Avionics Data Bus Clamping | Ruggedized LAN Node Protection |
Use Scenario: Signal integrity preservation in ARINC 429 or MIL-STD-1553B stubs exposed to aircraft power transients. IC Role / Device Role: Fast-switching clamp on data line inputs to FPGAs or ASICs. Use Value: −65 °C to +200 °C TJ rating supports operation inside sealed avionics enclosures near engines; JANTXV screening guarantees failure rate < 100 FIT. | Use Scenario: Surge suppression on PoE-powered LAN switches deployed in outdoor telecom cabinets. IC Role / Device Role: Low-leakage (25 nA @ 20 V) reverse-biased diode shunting induced transients to ground. Use Value: 120 °C/W RθJSP enables direct thermal coupling to heatsinked PCB layers - sustains 2 A surge current without thermal runaway. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar switching diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 1N4148W-7-F (Diodes Inc.) | Plastic SOD-123 package; 4.0 pF capacitance same, but RθJA = 350 °C/W (vs. 120 °C/W); no MIL qualification. | Commercial industrial controls only; unsuitable for aerospace or extended-temperature deployments. | Select when cost sensitivity outweighs reliability requirements and thermal constraints permit higher ambient rise. |
| NSR0230HT1G (ON Semiconductor) | Schottky architecture; VF = 0.3 V @ 10 mA (lower), but VRWM = 30 V (reduced); trr not specified (inherently faster). | 3.3 V logic-level clamping only; cannot replace 1N4148UBCCC in 75 V-rated RS-422 or Ethernet lines. | Choose only for low-voltage, high-efficiency rectification where reverse voltage margin is ≤30 V. |
Compared with 1N4148W-7-F and NSR0230HT1G, the 1N4148UBCCC uniquely delivers MIL-qualified reliability, hermetic ceramic packaging, and full 75 V reverse voltage capability - making it irreplaceable in defense-grade signal routing where long-term parametric stability and survivability under thermal shock are mandatory.
Availability
1N4148UBCCC is available at Aetrix Electronics and suitable for RS-232 interface protection, Ethernet 10 Base-T termination, and avionics data bus clamping requiring stable component supply across extended temperature and radiation-hardened environments.
Supply support for 1N4148UBCCC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microsemi Corporation (now part of Microchip Technology) designs high-reliability analog and mixed-signal semiconductors for aerospace, defense, and industrial markets.
The 1N4148UBCCC belongs to Microsemi's military-grade discrete diode product line, engineered specifically for signal integrity and survivability in mission-critical electronic systems operating under extreme environmental stress.
FAQ
What does the 'CC' suffix mean in 1N4148UBCCC?
The 'CC' suffix in 1N4148UBCCC denotes Common Cathode polarity - indicating a dual-diode configuration where both cathodes are internally tied together and accessible via a single terminal. This configuration supports bidirectional signal clamping and bus termination in RS-422 and MIL-STD-1553B applications. The 1N4148UBCCC uses this arrangement to simplify PCB layout while maintaining fast 5 ns reverse recovery performance.
Is 1N4148UBCCC qualified to MIL-PRF-19500/116?
Yes, the 1N4148UBCCC is qualified to MIL-PRF-19500/116 at the JANTXV reliability level, including full screening for temperature cycling, burn-in, and life testing. This qualification is documented in Microsemi's T4-LDS-0281-2 datasheet and confirms suitability for high-integrity applications such as airborne computing and satellite command telemetry. The 1N4148UBCCC carries full traceability and lot-level test reports per MIL standard.
What is the thermal resistance of 1N4148UBCCC from junction to solder pad?
The thermal resistance from junction to solder pad (RθJSP) for the 1N4148UBCCC is 120 °C/W, measured under standard JEDEC conditions. This value enables efficient heat transfer directly into the PCB copper, supporting sustained operation at 200 mA average current even at elevated ambient temperatures. The 1N4148UBCCC achieves this via its ceramic package's low-impedance thermal path and gold-plated terminals that ensure consistent solder joint thermal conductivity.
Can 1N4148UBCCC replace standard 1N4148 in commercial designs?
The 1N4148UBCCC is functionally compatible with standard 1N4148 diodes in terms of electrical parameters (VF, trr, C), but its ceramic UB package, JANTXV qualification, and common cathode configuration make it over-specified for most commercial use cases. While it will operate correctly in non-military designs, the 1N4148UBCCC incurs higher cost and longer lead times. Use the 1N4148UBCCC only where hermeticity, extended temperature range, or MIL compliance are explicitly required.
What is the maximum reverse recovery time for 1N4148UBCCC?
The maximum reverse recovery time (trr) for the 1N4148UBCCC is 5 ns, tested under IF = IR = 10 mA, RL = 100 Ω, per Microsemi's T4-LDS-0281-2 datasheet. This value is guaranteed across the full −65 °C to +200 °C junction temperature range and ensures minimal switching distortion in high-frequency data lines such as RS-232, RS-422, and Ethernet 10 Base-T. The 1N4148UBCCC maintains this performance due to its optimized silicon process and low-junction-capacitance design.
1N4148UBCCC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 3-SMD, No Lead
- Packaging:
- Bulk
- Product Status:
- Active
- Diode Configuration:
- 1 Pair Common Cathode
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 75 V
- Current - Average Rectified (Io) (per Diode):
- 1A
- Voltage - Forward (Vf) (Max) @ If:
- 800 mV @ 100 mA
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 5 ns
- Current - Reverse Leakage @ Vr:
- 25 nA @ 20 V
- Operating Temperature - Junction:
- -65°C ~ 200°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- UBC
1N4148UBCCC FAQ
1.How can I place an order for 1N4148UBCCC through Aetrix?
Please submit a Request for Quotation (RFQ) for 1N4148UBCCC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 1N4148UBCCC reliable?
The price and inventory of 1N4148UBCCC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 1N4148UBCCC is usually 5 days.
3.What payment methods are accepted for 1N4148UBCCC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 1N4148UBCCC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 1N4148UBCCC?
1N4148UBCCC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 1N4148UBCCC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 1N4148UBCCC?
For technical support, including 1N4148UBCCC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 1N4148UBCCC requirements.
6.How does Aetrix verify that 1N4148UBCCC is sourced from the original manufacturer or authorized distributors?
All 1N4148UBCCC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 1N4148UBCCC meets industry standards.
7.What is the process for return or replacement of 1N4148UBCCC?
All 1N4148UBCCC units undergo pre-shipment inspection (PSI). If there is an issue with 1N4148UBCCC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 1N4148UBCCC part is unused and in its original packaging.
Return procedure for 1N4148UBCCC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
1N4148UBCCC Tags
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BAV99-7-F
Diodes Incorporated
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BAT54C-7-F
Diodes Incorporated
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BAV99,215
Nexperia USA Inc.
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BAT54SLT1G
onsemi
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BAV70LT1G
onsemi
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BAT54CLT1G
onsemi
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BAT54S-7-F
Diodes Incorporated
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BAV99LT1G
onsemi
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BAT54S,215
Nexperia USA Inc.
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BAS40-04LT1G
onsemi
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MMBD1503-TP
Micro Commercial Co
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BAV99WT1G
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