Microchip Technology 1N6940UTK3/TR
- Part No.:
- 1N6940UTK3/TR
- Manufacturer:
- Microchip Technology
- Category:
- Single Diodes
- Package:
- ThinKey™3
- Datasheet:
-
1N6940UTK3/TR.pdf
- Description:
- DIODE SCHOTTKY 15V 150A THINKEY3
- Quantity:
- Payment:

- Shipping:

Inventory:8,710
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Product details
Overview
1N6940UTK3 from Microsemi is a hermetically sealed, ceramic-molybdenum ThinKey™ 3 surface-mount Schottky diode with anode-to-strap polarity, 15 V working peak reverse voltage, 150 A average rectified output current at TC = +100 °C, and 0.25 °C/W thermal resistance junction-to-case (anode-to-strap), designed for high-density aerospace power conversion and thermal-critical defense rectification.
For engineers reviewing the 1N6940UTK3 datasheet, 1N6940UTK3 pinout, 1N6940UTK3 application, or 1N6940UTK3 equivalent, key selection criteria include its MIL-PRF-19500/726 qualification level (JAN/JANTX/JANTXV), low forward voltage (0.43 V @ 75 A pk, TC = +25 °C), rugged strap-based thermal path, and strapless variant availability upon request.
Technical Context
This device implements an oxide-passivated, guard-ringed epitaxial Schottky structure to minimize forward voltage drop while enhancing reverse energy capability and surge robustness. Its anode-to-strap configuration establishes a direct low-inductance thermal conduction path from the silicon junction to the external heatsink via the metal strap.
The ThinKey™ 3 package enables double-side cooling and eliminates wire bonds, supporting high-reliability operation across -65 °C to +150 °C junction temperature range. It is qualified per MIL-PRF-19500/726 with JEDEC-registered 1N6940 numbering and supports up-screening for mission-critical applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRWM | 15 V - Maximum continuous reverse voltage before significant leakage; defines safe blocking capability in DC bus clamping. |
| IO (TC = +100 °C) | 150 A - Sustained forward current rating under real-world heatsink-limited thermal conditions. |
| RθJC (Anode-to-Strap) | 0.25 °C/W - Enables efficient heat transfer to external heatsink; critical for high-power density designs. |
| VF1 (IF = 75 A pk, TC = +25 °C) | 0.43 V - Low conduction loss at medium pulse current; reduces I²R heating during transient loads. |
| IFSM (tp = 8.3 ms) | 2000 A pk - Withstands short-duration surge events such as motor startup or lightning-induced transients. |
| CJ (VR = 5 V, f = 1 MHz) | 10,000 pF - Junction capacitance impacts high-frequency switching behavior and EMI filtering design. |
Pinout & Package
Package: Ceramic-molybdenum ThinKey™ 3 surface-mount package with anode-to-strap polarity; hermetically sealed, low-profile construction; weight ≈ 1.7 g; terminals plated with tin/lead or RoHS-compliant matte tin (commercial grade only).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (Strap) | Main current entry point tied to metal strap | Provides low-inductance, low-thermal-resistance path to external heatsink; enables double-side cooling. |
| Cathode (Top Surface) | Main current exit point | Surface-mounted terminal for PCB interconnection; optimized for minimal parasitic inductance in high-di/dt circuits. |
Key Features
| Feature | Design Value |
|---|---|
| Oxide-passivated structure | Improves long-term stability of reverse leakage and breakdown characteristics under thermal cycling and radiation exposure. |
| Guard ring protection | Increases reverse energy handling (dV/dt and avalanche) without requiring external snubbers in high-surge environments. |
| Epitaxial Schottky construction | Reduces forward voltage drop by ~0.1–0.2 V versus planar Schottky, lowering conduction losses in high-current rectifiers. |
| Hermetic ceramic-metal seal | Ensures reliability in vacuum, humidity, and corrosive atmospheres typical of space and naval platforms. |
Applications
| Aerospace Power Rectification | Defense Radar Pulse Modulators |
|---|---|
Use Scenario: High-current DC bus rectification in satellite power conditioning units operating in wide temperature ranges. IC Role / Device Role / Timing Role: Primary output rectifier in multi-kW isolated DC-DC converters feeding payload electronics. Use Value: 0.25 °C/W RθJC and strap-based thermal path enable stable 150 A operation without forced air, reducing system mass and complexity. | Use Scenario: Pulse-forming network (PFN) charging and discharge clamping in ground-based radar transmitters. IC Role / Device Role / Timing Role: Fast-recovery, high-surge-capability clamp diode protecting modulator switches during high-voltage pulse collapse. Use Value: 2000 A non-repetitive surge rating and guard-ringed structure withstand repeated 10–100 kV, µs-scale transients without degradation. |
| MIL-STD-704 Aircraft Power Systems | High-Reliability Industrial UPS |
Use Scenario: Input rectification in airborne auxiliary power units (APUs) subject to MIL-STD-704 voltage transients and vibration. IC Role / Device Role / Timing Role: Main AC-to-DC rectifier in 400 Hz aircraft generator interface modules. Use Value: JAN/JANTXV qualification ensures traceable lot control, burn-in, and radiation tolerance required for flight-critical systems. | Use Scenario: Battery-charger rectification in nuclear plant backup UPS where failure modes must be mitigated for 40+ year service life. IC Role / Device Role / Timing Role: High-current freewheeling and charge-path diode in dual-conversion online UPS inverters. Use Value: Hermetic ceramic package and oxide passivation prevent moisture-induced parametric drift and corrosion over decades of operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-current Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| VSKY15015 | 150 A / 15 V TO-263-2L; RθJC = 0.45 °C/W; non-hermetic polymer package | Lacks MIL-PRF-19500 qualification and strap-based thermal path; unsuitable for vacuum or extended temperature missions | Select when cost-sensitive commercial industrial use requires surface-mount compatibility but not aerospace reliability. |
| SD15015S | 150 A / 15 V SOT-227B; RθJC = 0.30 °C/W; non-hermetic; no JANTXV option | Lower thermal performance than 1N6940UTK3; no military screening or up-screening path available | Choose for high-volume telecom rectifiers where RoHS compliance and lead-free assembly are mandatory and qualification is not required. |
Compared with VSKY15015 and SD15015S, the 1N6940UTK3 delivers superior thermal resistance (0.25 °C/W), hermetic reliability, and full MIL-PRF-19500 qualification-making it the only choice for flight hardware, naval radar, and other safety-critical defense systems demanding proven long-term parametric stability.
Availability
1N6940UTK3 is available at Aetrix Electronics and suitable for aerospace power conversion, defense radar modulators, and MIL-STD-704 aircraft power systems requiring stable component supply with full traceability and long-term lifecycle support.
Supply support for 1N6940UTK3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microsemi Corporation (now part of Microchip Technology) is a U.S.-based semiconductor company specializing in high-reliability analog and mixed-signal ICs, discrete devices, and RF solutions for aerospace, defense, and industrial markets.
The 1N6940UTK3 belongs to Microsemi's ThinKey™ Schottky diode product line, engineered specifically for high-power, high-reliability rectification in thermally constrained and mission-critical environments where hermeticity, surge immunity, and qualification integrity are non-negotiable.
FAQ
What is the thermal resistance junction-to-case for 1N6940UTK3, and how does it impact heatsink design?
The 1N6940UTK3 has a thermal resistance junction-to-case (RθJC) of 0.25 °C/W when measured anode-to-strap. This exceptionally low value directly enables compact heatsink sizing and passive cooling in space-constrained aerospace enclosures. Because the anode is bonded to the metal strap, thermal energy transfers efficiently to the external heatsink without relying on PCB copper layers-making 1N6940UTK3 ideal for double-side cooled assemblies where both strap and cathode surfaces contact thermal interfaces.
Is 1N6940UTK3 qualified to MIL-PRF-19500/726, and what reliability levels are offered?
Yes, the 1N6940UTK3 is qualified per MIL-PRF-19500/726 for Schottky diodes. It is available in JAN, JANTX, and JANTXV reliability levels-each including rigorous screening such as temperature cycling, burn-in, and parameter verification. The JANTXV level adds radiation hardness assurance and extended lot traceability, making 1N6940UTK3 suitable for launch-critical avionics and strategic defense platforms where failure is not an option.
What is the forward voltage of 1N6940UTK3 at high current and elevated temperature?
At 150 A peak forward current and case temperature of +125 °C, the 1N6940UTK3 exhibits a forward voltage (VF3) of 0.43 V. This low, stable VF under extreme thermal and electrical stress reflects its epitaxial Schottky construction and oxide passivation-key to minimizing conduction losses in high-efficiency power supplies used in radar transmitters and satellite power systems where thermal runaway must be avoided.
Does 1N6940UTK3 support cathode-to-strap polarity, and how is it designated?
No-the 1N6940UTK3 specifically denotes anode-to-strap polarity (AS suffix). For cathode-to-strap configuration, Microsemi offers the 1N6940UTK3CS variant. The AS/CS designation is part of the official nomenclature and determines thermal path orientation and PCB layout requirements. Using the wrong polarity variant risks improper heatsinking and thermal overload, so designers must verify the suffix and corresponding pad layout before committing to production.
Can 1N6940UTK3 be used without the metal strap, and how is that ordered?
Yes-Microsemi offers a strapless version of this device by special request, designated as 1N6940UTK3 (no AS/CS suffix). The strapless variant retains the same electrical ratings and ThinKey™ 3 footprint but removes the metal strap to accommodate alternative mechanical mounting or conformal coating requirements. Ordering requires direct coordination with Microchip (ex-Microsemi) sales or authorized distributors, as it is not stocked standard and may involve minimum order quantities or extended lead times.
1N6940UTK3/TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- ThinKey™3
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 15 V
- Current - Average Rectified (Io):
- 150A
- Voltage - Forward (Vf) (Max) @ If:
- 500 mV @ 150 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 5 mA @ 15 V
- Capacitance @ Vr, F:
- 10000pF @ 5V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- ThinKey™3
- Operating Temperature - Junction:
- -65°C ~ 150°C
1N6940UTK3/TR FAQ
1.How can I place an order for 1N6940UTK3/TR through Aetrix?
Please submit a Request for Quotation (RFQ) for 1N6940UTK3/TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 1N6940UTK3/TR reliable?
The price and inventory of 1N6940UTK3/TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 1N6940UTK3/TR is usually 5 days.
3.What payment methods are accepted for 1N6940UTK3/TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 1N6940UTK3/TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 1N6940UTK3/TR?
1N6940UTK3/TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 1N6940UTK3/TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 1N6940UTK3/TR?
For technical support, including 1N6940UTK3/TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 1N6940UTK3/TR requirements.
6.How does Aetrix verify that 1N6940UTK3/TR is sourced from the original manufacturer or authorized distributors?
All 1N6940UTK3/TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 1N6940UTK3/TR meets industry standards.
7.What is the process for return or replacement of 1N6940UTK3/TR?
All 1N6940UTK3/TR units undergo pre-shipment inspection (PSI). If there is an issue with 1N6940UTK3/TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 1N6940UTK3/TR part is unused and in its original packaging.
Return procedure for 1N6940UTK3/TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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