Nexperia USA Inc. 1PS76SB70,135

Overview

1PS76SB70 from Nexperia is a general-purpose Schottky diode in SOD323 (SC-76) surface-mount package, designed for ultra-high-speed switching and voltage clamping. It delivers 70 V reverse voltage rating, 70 mA forward current capability, 410 mV forward voltage at 1 mA, 2 pF capacitance at 0 V, and 100 nA reverse leakage at 50 V - enabling compact, low-loss signal path protection in space-constrained DC-DC and interface circuits.

For engineers reviewing the 1PS76SB70 datasheet, 1PS76SB70 pinout, 1PS76SB70 application, or 1PS76SB70 equivalent, key selection criteria include its low VF/low IR trade-off, SOD323 footprint compatibility, thermal resistance of 450 K/W on FR4, and verified performance across −40 °C to 125 °C ambient operation - critical for portable power management and high-frequency signal routing.

Technical Context

This Schottky diode leverages a planar epitaxial construction to achieve fast recovery (no minority-carrier storage), low forward voltage drop, and minimal junction capacitance. Its 70 V VR rating supports use in 48 V and 36 V bus protection, while pulsed IF = 70 mA and IFSM = 100 mA allow transient surge handling without thermal runaway.

The device operates with junction temperatures up to 150 °C and ambient ranges from −65 °C to 150 °C. Thermal resistance Rth(j-a) = 450 K/W is specified for standard single-sided FR4 PCB mounting - confirming suitability for low-power, non-heatsinked applications where self-heating must remain below 30 K at 15 mA DC.

Key Specifications

Pinout & Package

Package: SOD323 (SC-76), 2-pin surface-mount plastic package, body dimensions 1.7 mm × 1.25 mm × 0.95 mm, 1.3 mm lead pitch, cathode marked by bar on top surface.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky diode applications.

Compared with BAS70-04 and 1N5711TR, the 1PS76SB70 offers the lowest capacitance (2 pF) and smallest SMT footprint among 70 V Schottkys, making it optimal for high-frequency signal integrity and miniaturized power routing - whereas alternatives trade size, speed, or manufacturability.

Availability

1PS76SB70 is available at Aetrix Electronics and suitable for USB interface protection, DC-DC snubbing, logic-level translation, and RF detector buffering requiring stable component supply and consistent SOD323 packaging.

Supply support for 1PS76SB70 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in advanced packaging and automotive-qualified components.

The 1PS76SB70 belongs to Nexperia's general-purpose Schottky diode series targeting cost-sensitive, high-speed signal conditioning and power rail protection in consumer, industrial, and communications equipment.

FAQ

What is the maximum continuous forward current for 1PS76SB70?

The absolute maximum continuous forward current (IF) is 70 mA at Tamb = 25 °C. Derating applies above 25 °C ambient: junction temperature must not exceed 150 °C, and thermal resistance is 450 K/W on standard FR4. At 70 mA, power dissipation is ~29 mW, resulting in ~13 K rise - well within safe operating limits.

Can 1PS76SB70 be used in 5 V logic clamping applications?

Yes - with VF = 410 mV at 1 mA, the diode clamps positive transients to ~5.4 V when anode is tied to 5 V rail and cathode to protected line. Its 2 pF capacitance avoids signal distortion on lines up to 200 MHz, and 100 nA IR prevents loading of high-impedance nodes like microcontroller inputs.

Is the SOD323 footprint compatible with automated reflow soldering?

Yes - Nexperia specifies a validated reflow footprint (Fig. 6) with 0.5 mm solder land width, 0.6 mm solder resist opening, and 1.5 mm center-to-center spacing. The 1.7 mm × 1.25 mm body and 0.95 mm height ensure stability during standard lead-free reflow profiles (peak 260 °C).

How does reverse leakage vary with temperature?

Reverse leakage increases exponentially with temperature: IR = 100 nA at 50 V and 25 °C, rising to ~10 µA at 50 V and 125 °C (per Fig. 2). This behavior is inherent to Schottky barrier physics and must be accounted for in high-temperature bias networks - e.g., reference dividers may drift >0.5% error at 125 °C.