Infineon Technologies 62-0063PBF
- Part No.:
- 62-0063PBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
62-0063PBF.pdf
- Description:
- MOSFET N-CH 12V 15A 8SO
- Quantity:
- Payment:

- Shipping:

Inventory:5,481
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Product details
Overview
IRF7476PbF from Infineon Technologies (formerly International Rectifier) is a 12 V, 15 A, 8.0 mΩ single N-channel Trench MOSFET in SO-8 package, optimized for synchronous buck converter high-side and low-side switching in 3.3 V/5 V point-of-load power stages. It features ultra-low gate impedance, fully characterized avalanche capability (160 mJ), and fast switching (tr = 29 ns, tf = 8.3 ns) for high-frequency DC-DC conversion in netcom and computing applications.
For engineers reviewing the IRF7476PbF datasheet, IRF7476PbF pinout, IRF7476PbF application, or IRF7476PbF equivalent, key selection criteria include RDS(on) @ 4.5 V (8.0 mΩ), Qg (26–40 nC), avalanche energy rating (160 mJ), thermal resistance RθJA (50 °C/W), and SO-8 lead-free compliance - all critical for thermally constrained, high-efficiency POL designs.
Technical Context
This MOSFET employs Trench-based silicon process technology to achieve low on-resistance with enhanced gate charge control. Its 8.0 mΩ RDS(on) at VGS = 4.5 V enables efficient conduction in 3.3 V gate-driven topologies, while its 26–40 nC total gate charge supports high-frequency PWM operation up to several MHz.
The device integrates a robust body diode with trr = 54–82 ns and Qrr = 59–90 nC, enabling reliable synchronous rectification without external Schottky diodes. Its 160 mJ single-pulse avalanche energy and 12 A IAR rating allow safe operation under unclamped inductive switching conditions typical in buck converter freewheeling phases.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 12 V - Maximum drain-source blocking voltage; defines use in ≤12 V input rails only. |
| RDS(on) @ VGS = 4.5 V | 8.0 mΩ - Enables <150 mW conduction loss at 15 A; critical for 3.3 V gate drive compatibility. |
| ID @ TA = 25°C | 15 A - Continuous current rating at room ambient; derates to 12 A at 70°C case temperature. |
| Qg | 26–40 nC - Total gate charge determines driver strength requirement and switching loss trade-off. |
| EAS | 160 mJ - Single-pulse avalanche energy; ensures reliability during transient overvoltage events in buck converters. |
| RθJA | 50 °C/W - Junction-to-ambient thermal resistance on standard PCB; sets maximum power dissipation limit at 2.5 W. |
| tr/tf | 29 ns / 8.3 ns - Rise/fall times at ID = 12 A; enables >1 MHz switching with controlled EMI. |
Pinout & Package
IRF7476PbF is housed in a surface-mount SO-8 (Small Outline-8) package with exposed drain pads for thermal enhancement. The package conforms to EIA-481/EIA-541 standards and supports automated pick-and-place assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4 | Drain (D) | Four parallel drain terminals connected internally; primary current path and thermal conduction path to PCB copper. |
| 5 | Gate (G) | Control terminal; requires low-impedance 3.3 V/5 V driver due to 26–40 nC Qg. |
| 6, 7, 8 | Source (S) | Three parallel source terminals; forms return path for load current and reference for gate drive. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(on) at 4.5 V | 8.0 mΩ - Reduces conduction loss by >30% vs. legacy 12 V MOSFETs in 3.3 V gate-drive systems. |
| Fully characterized avalanche | 160 mJ EAS, 12 A IAR - Eliminates need for external snubbers in synchronous buck freewheeling phase. |
| Low gate charge | 26–40 nC Qg - Enables use of low-power gate drivers and reduces switching losses at ≥500 kHz. |
| Fast body diode recovery | trr = 54–82 ns, Qrr = 59–90 nC - Minimizes reverse recovery loss and shoot-through risk in synchronous rectification. |
| Lead-free SO-8 package | RoHS-compliant, JEDEC-standard footprint - Ensures drop-in replacement in existing 8-pin power layouts. |
Applications
| Server VRM Power Stage | Network Switch POL Converter |
|---|---|
Use Scenario: High-current, multi-phase 12 V input → 1.0 V/100 A output VRM supplying CPU core power. IC Role / Device Role / Timing Role: Low-side synchronous rectifier switch operating at 500–1000 kHz PWM frequency. Use Value: 8.0 mΩ RDS(on) minimizes I²R loss at 100 A; SO-8 thermal design supports 2.5 W dissipation per phase under airflow-limited chassis conditions. | Use Scenario: Compact 5 V input → 3.3 V/20 A point-of-load regulator on network switch line card. IC Role / Device Role / Timing Role: High-side main switch in single-phase buck converter with integrated controller. Use Value: 4.5 V gate threshold enables direct drive from 5 V controller outputs; 160 mJ avalanche rating prevents failure during hot-swap transients. |
| Portable SSD Power Management | Industrial PLC I/O Module Supply |
Use Scenario: Dual-rail 5 V → 3.3 V/1.8 V power delivery for NVMe SSD controller and NAND flash. IC Role / Device Role / Timing Role: Secondary low-side switch in cascaded buck stage handling 12 A peak load. Use Value: Fast 8.3 ns fall time suppresses cross-conduction loss; Qrr < 90 nC avoids voltage spikes during light-load discontinuous mode. | Use Scenario: 24 V industrial bus → 5 V/3 A isolated auxiliary supply for digital I/O logic. IC Role / Device Role / Timing Role: Primary switch in non-isolated buck pre-regulator feeding isolated DC-DC module. Use Value: -55 °C to +150 °C junction range ensures operation in sealed enclosures; SO-8 footprint simplifies layout in space-constrained DIN-rail modules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Si7852DP-T1-GE3 | RDS(on) = 7.5 mΩ @ 4.5 V; Qg = 32 nC; SO-8 package; 20 V VDS | Higher VDS rating allows 15 V input margin but increases gate drive capacitance slightly. | Preferred where system-level overvoltage tolerance exceeds 12 V or where lower RDS(on) justifies marginal Qg increase. |
| DMN3025LSD-13 | RDS(on) = 2.5 mΩ @ 4.5 V; dual N-channel; 30 V VDS; 8-pin SO-8 | Dual configuration enables half-bridge integration; higher VDS and lower RDS(on) suit 24 V intermediate bus designs. | Select when designing compact half-bridge POL stages or requiring >12 V input headroom with minimal footprint impact. |
Compared with Si7852DP-T1-GE3 and DMN3025LSD-13, IRF7476PbF offers optimal balance of 12 V-specific optimization, proven avalanche ruggedness, and lowest gate charge among 12 V SO-8 MOSFETs - making it ideal for cost-sensitive, thermally constrained 3.3 V/5 V POL applications where strict input voltage limits apply.
Availability
IRF7476PbF is available at Aetrix Electronics and suitable for server VRMs, network switch POL converters, portable SSD power management, and industrial PLC I/O module supplies requiring stable component supply and long-term manufacturing continuity.
Supply support for IRF7476PbF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive, and industrial control ICs and discrete devices.
The IRF7476PbF belongs to Infineon's HEXFET® Power MOSFET product line, engineered specifically for high-efficiency, high-frequency DC-DC conversion in computing and communications infrastructure where low-voltage, high-current power delivery is essential.
FAQ
Is IRF7476PbF suitable for 3.3 V gate drive applications?
Yes. With a gate threshold voltage (VGS(th)) of 0.6–1.9 V and guaranteed RDS(on) of 8.0 mΩ at VGS = 4.5 V, IRF7476PbF is explicitly characterized for 3.3 V and 5 V logic-level gate drive. Its low Qg (26–40 nC) further ensures fast turn-on with standard microcontroller GPIO or dedicated low-VGS drivers.
What is the maximum continuous drain current at 70°C ambient?
The datasheet specifies ID = 12 A at TA = 70°C with VGS = 10 V. This rating assumes standard SO-8 mounting on FR-4 PCB with 1-inch² copper; actual current must be derated based on measured board temperature and airflow. At TC = 70°C, maximum ID remains 12 A per Figure 9.
Does IRF7476PbF have an integrated Schottky diode?
No. IRF7476PbF uses a monolithic p-n junction body diode inherent to the MOSFET structure. Its reverse recovery characteristics (trr = 54–82 ns, Qrr = 59–90 nC) are fully specified and optimized for synchronous rectification - no external Schottky is required, but it is not a separate integrated Schottky device.
Can IRF7476PbF replace older IRF7476 in existing designs?
Yes. IRF7476PbF is the lead-free, RoHS-compliant version of IRF7476, with identical electrical specifications, pinout, package dimensions, and thermal performance. The "PbF" suffix denotes lead-free termination; no layout or firmware changes are needed for drop-in replacement in legacy designs.
62-0063PBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 12 V
- Current - Continuous Drain (Id) @ 25°C:
- 15A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 2.8V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 8mOhm @ 15A, 4.5V
- Vgs(th) (Max) @ Id:
- 1.9V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 40 nC @ 4.5 V
- Vgs (Max):
- ±12V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2550 pF @ 6 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.5W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO
62-0063PBF FAQ
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7.What is the process for return or replacement of 62-0063PBF?
All 62-0063PBF units undergo pre-shipment inspection (PSI). If there is an issue with 62-0063PBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 62-0063PBF part is unused and in its original packaging.
Return procedure for 62-0063PBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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