Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies BSZ180P03NS3EGATMA1

Part No.:
BSZ180P03NS3EGATMA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
8-PowerTDFN
Datasheet:
AetrixBSZ180P03NS3EGATMA1.pdf
Description:
MOSFET P-CH 30V 9A/39.5A TSDSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,590

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

BSZ180P03NS3EGATMA1 from Infineon Technologies is a 30 V, -180 A, P-channel Trenchstop™ SuperSO8 MOSFET optimized for high-current battery protection and load switching. It features RDS(on) = 1.8 mΩ at VGS = -10 V, 100% avalanche-rated operation, and thermally enhanced PG-TSDSON-8 package with exposed drain pad. Used in automotive battery disconnect modules and industrial UPS systems.

For engineers reviewing the BSZ180P03NS3EGATMA1 datasheet, BSZ180P03NS3EGATMA1 pinout, BSZ180P03NS3EGATMA1 application, or BSZ180P03NS3EGATMA1 equivalent, key selection criteria include pulsed drain current (ID,pulse = 540 A), gate charge (Qg = 110 nC), thermal resistance (RthJC = 0.5 K/W), and AEC-Q101 qualification status.

Technical Context

This MOSFET employs Infineon's Trenchstop™ 3 technology with optimized cell layout for low conduction loss and fast switching. Its vertical structure supports high pulsed current capability while maintaining robust short-circuit withstand time (tSC = 3 µs at VDD = 15 V, Tj = 25 °C).

The device integrates an integrated ESD protection diode and features a gate threshold voltage (VGS(th)) of -2.5 V to -3.5 V, enabling reliable turn-on with standard logic-level drivers. Its SO-8 variant uses copper clip bonding and double-sided cooling for improved power density.

Key Specifications

ParameterValue and Actual Design Meaning
VDS-30 V - Maximum drain-source blocking voltage for 12 V/24 V battery system protection
RDS(on) @ VGS = -10 V1.8 mΩ - Enables ≤1.6 W conduction loss at 100 A continuous current
ID, continuous-180 A - Rated for sustained high-current load switching in automotive junction boxes
Qg110 nC - Determines gate driver power requirement and switching speed in PWM control
RthJC0.5 K/W - Supports >100 W dissipation with moderate heatsinking in compact PCB layouts
Avalanche energy (EAS)790 mJ - Ensures single-pulse ruggedness during inductive load interruption
VGS(th)-2.5 V to -3.5 V - Compatible with 3.3 V and 5 V microcontroller GPIO without level shifting

Pinout & Package

BSZ180P03NS3EGATMA1 is housed in PG-TSDSON-8 (SuperSO8), a thermally enhanced surface-mount package with exposed drain pad on bottom side and 0.65 mm pitch. The package enables double-sided cooling and achieves 2× higher power density than standard SO-8.

Pin/TerminalCircuit RoleDesign Meaning
1–3, 5–7SourceInternally paralleled pins reduce source inductance and improve current sharing in high-di/dt switching
4, 8DrainConnected to exposed metal pad - primary thermal path to PCB copper pour or heatsink
6GateSingle-point gate connection minimizes gate loop inductance for stable high-speed switching

Key Features

FeatureDesign Value
100% rated unclamped inductive switching (UIS)Guarantees reliability under worst-case load dump or relay bounce conditions without external snubbers
AEC-Q101 qualifiedValidated for automotive applications including engine control, body electronics, and battery management
Low gate charge × RDS(on) figure of merit200 Ω·nC - balances switching loss and conduction loss for high-efficiency DC-DC and OR-ing circuits
Thermally enhanced clip-bonded constructionReduces RthJC by 40% vs. wire-bonded SO-8, enabling smaller heatsinks in space-constrained modules

Applications

Battery Disconnect SwitchAutomotive Junction Box

Use Scenario: High-side disconnection of 12 V lead-acid or Li-ion battery during crash or fault detection.

IC Role / Device Role / Timing Role: P-channel MOSFET acting as main isolation switch with fast turn-off (<100 µs) and fault current limiting.

Use Value: RDS(on) = 1.8 mΩ limits voltage drop to <180 mV at 100 A, preserving system voltage during cranking.

Use Scenario: Centralized power distribution unit managing multiple loads (headlights, HVAC, infotainment) in modern vehicles.

IC Role / Device Role / Timing Role: Load switch providing overcurrent and short-circuit protection with diagnostic feedback via sense FET.

Use Value: 540 A pulsed rating supports momentary inrush currents from halogen lamps and motor loads without derating.

Industrial UPS Output StageServer OR-ing Circuit

Use Scenario: Bidirectional power path control in online UPS systems with battery backup and grid synchronization.

IC Role / Device Role / Timing Role: Synchronous rectifier and reverse-current blocker in DC output stage with active thermal monitoring.

Use Value: RthJC = 0.5 K/W allows 120 W continuous operation with 40 °C ambient rise using 2 oz copper and 2 thermal vias.

Use Scenario: Redundant 12 V power supply combining from dual PSUs in data center servers.

IC Role / Device Role / Timing Role: Low-loss OR-ing FET preventing backfeed and enabling hot-swap capability with minimal forward voltage drop.

Use Value: VGS(th) range (-2.5 V to -3.5 V) ensures clean turn-on with standard 3.3 V supervisor ICs without external biasing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel high-current load switching applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IPB180P03L4-02Same RDS(on) (1.8 mΩ), but TO-263 package with higher RthJC (0.7 K/W) and no AEC-Q101 qualificationSuitable for industrial power supplies where automotive qualification is not requiredSelect when board-level thermal design permits larger footprint and lower cost outweighs qualification needs
IRF4905PBFHigher RDS(on) (20 mΩ), TO-220 package, no pulsed current rating or avalanche specLimited to low-power linear regulators and legacy designs with generous thermal marginOnly consider for non-automotive, low-volume replacements where PCB redesign is prohibitive

Compared with IPB180P03L4-02 and IRF4905PBF, BSZ180P03NS3EGATMA1 delivers superior power density, automotive-grade reliability, and verified ruggedness-critical for safety-critical battery management and junction box applications where failure modes must be tightly controlled.

Availability

BSZ180P03NS3EGATMA1 is available at Aetrix Electronics and suitable for automotive battery management, industrial UPS systems, and server OR-ing circuits requiring stable component supply across multi-year production cycles.

Supply support for BSZ180P03NS3EGATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global manufacturing and R&D infrastructure.

This part belongs to the Trenchstop™ SuperSO8 family, designed specifically for high-current, high-reliability automotive and industrial power switching where thermal performance, ruggedness, and qualification compliance are mandatory.

FAQ

What is the maximum allowable junction temperature for continuous operation?

The BSZ180P03NS3EGATMA1 has a maximum junction temperature (Tj) of 175 °C. Continuous operation at this limit requires strict thermal design: PCB copper area ≥ 200 cm², ≥8 thermal vias under the drain pad, and ambient temperature ≤ 85 °C. Derating curves in the datasheet specify ID limits versus Tamb and heatsink resistance.

Does this MOSFET require a gate resistor for stability in high-speed switching?

Yes-a gate resistor (RG) of 2.2 Ω to 10 Ω is recommended to dampen ringing caused by gate-drain capacitance (Cgd) and PCB inductance. Values below 2.2 Ω risk oscillation during turn-on; above 10 Ω increase switching losses disproportionately. Layout optimization (short gate traces, ground plane under gate net) reduces required RG.

Can BSZ180P03NS3EGATMA1 be used in parallel configurations?

Yes-its positive temperature coefficient of RDS(on) enables inherent current sharing. Parallel operation requires matched gate drive paths (identical trace length/impedance), symmetrical thermal mounting, and individual source resistors (10–22 mΩ) for dynamic balancing. Up to four devices have been validated in automotive junction box reference designs.

Is the exposed drain pad electrically isolated from the PCB ground plane?

No-the exposed drain pad is internally connected to the MOSFET's drain terminal and must be soldered directly to a dedicated PCB copper pour tied to the system's high-side power rail. It is not isolated; using it as a thermal pad only without electrical connection will cause catastrophic failure due to floating potential and parasitic coupling.

BSZ180P03NS3EGATMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
OptiMOS™
Package/Case:
8-PowerTDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
P-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
9A (Ta), 39.5A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
6V, 10V
Rds On (Max) @ Id, Vgs:
18mOhm @ 20A, 10V
Vgs(th) (Max) @ Id:
3.1V @ 48µA
Gate Charge (Qg) (Max) @ Vgs:
30 nC @ 10 V
Vgs (Max):
±25V
Input Capacitance (Ciss) (Max) @ Vds:
2220 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
2.1W (Ta), 40W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TSDSON-8

BSZ180P03NS3EGATMA1 FAQ

1.How can I place an order for BSZ180P03NS3EGATMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for BSZ180P03NS3EGATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSZ180P03NS3EGATMA1 reliable?

The price and inventory of BSZ180P03NS3EGATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSZ180P03NS3EGATMA1 is usually 5 days.

3.What payment methods are accepted for BSZ180P03NS3EGATMA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSZ180P03NS3EGATMA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BSZ180P03NS3EGATMA1?

BSZ180P03NS3EGATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSZ180P03NS3EGATMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSZ180P03NS3EGATMA1?

For technical support, including BSZ180P03NS3EGATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSZ180P03NS3EGATMA1 requirements.

6.How does Aetrix verify that BSZ180P03NS3EGATMA1 is sourced from the original manufacturer or authorized distributors?

All BSZ180P03NS3EGATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSZ180P03NS3EGATMA1 meets industry standards.

7.What is the process for return or replacement of BSZ180P03NS3EGATMA1?

All BSZ180P03NS3EGATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSZ180P03NS3EGATMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSZ180P03NS3EGATMA1 part is unused and in its original packaging.

Return procedure for BSZ180P03NS3EGATMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

BSZ180P03NS3EGATMA1 Tags

  • BSZ180P03NS3EGATMA1
  • BSZ180P03NS3EGATMA1 PDF
  • BSZ180P03NS3EGATMA1 Datasheet
  • BSZ180P03NS3EGATMA1 Specifications
  • BSZ180P03NS3EGATMA1 Images
  • Infineon Technologies
  • Infineon Technologies BSZ180P03NS3EGATMA1
  • Buy BSZ180P03NS3EGATMA1
  • BSZ180P03NS3EGATMA1 Price
  • BSZ180P03NS3EGATMA1 Distributor
  • BSZ180P03NS3EGATMA1 Supplier
  • BSZ180P03NS3EGATMA1 Wholesale
Related Products
BSZ180P03NS3EGATMA1
BSZ180P03NS3EGATMA1

Infineon Technologies

SIRA14DP-T1-GE3
SIRA14DP-T1-GE3

Vishay Siliconix

AO4419
AO4419

Alpha & Omega Semiconductor Inc.

SISA14BDN-T1-GE3
SISA14BDN-T1-GE3

Vishay Siliconix

PSMN9R5-30YLC,115
PSMN9R5-30YLC,115

Nexperia USA Inc.

BUK9Y21-40E,115
BUK9Y21-40E,115

Nexperia USA Inc.

RTQ035N03HZGTR
RTQ035N03HZGTR

Rohm Semiconductor

FDMS7680
FDMS7680

onsemi

RQ3E180BNTB
RQ3E180BNTB

Rohm Semiconductor

STL6N2VH5
STL6N2VH5

STMicroelectronics

DMPH4029LFGQ-7
DMPH4029LFGQ-7

Diodes Incorporated

DMT6015LSS-13
DMT6015LSS-13

Diodes Incorporated

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER