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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Infineon Technologies 62-0136PBF

Name: 62-0136PBF
Brand: Infineon Technologies
SKU: 62-0136PBF
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 62-0136PBF

Manufacturer:: Infineon Technologies

Category:: FETs, MOSFETs

Package:: -

Datasheet:: 62-0136PBF.pdf

Description:: MOSFET N-CH 30V 19A 8-SOIC

Quantity:: RFQ Add To RFQ list

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Inventory:7,341

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Product details

Overview

62-0136PBF from Infineon Technologies is an N-channel enhancement-mode MOSFET in 8-SOIC package, rated for 30 V V_DS, 19 A continuous drain current at T_C = 25°C, and 4.5 mΩ typical R_DS(on) at V_GS = 10 V. It serves as a high-efficiency synchronous rectifier or low-side switch in DC-DC converters for telecom power supplies.

For engineers reviewing the 62-0136PBF datasheet, 62-0136PBF pinout, 62-0136PBF application, or 62-0136PBF equivalent, key selection criteria include its 30 V breakdown voltage, low on-resistance under standard gate drive, SOIC-8 thermal performance, and suitability for 12 V input POL converters requiring <20 A switching capability.

Technical Context

This MOSFET employs trench-based silicon process technology to achieve low conduction losses while maintaining fast switching transitions. Its gate threshold voltage (V_GS(th)) ranges from 1.0 V to 2.5 V, enabling compatibility with 3.3 V and 5 V logic-level gate drivers.

The device features integrated ESD protection per HBM Class 2 (≥2 kV), and its SOIC-8 footprint supports standard PCB layout practices for thermal relief and current routing in high-density power stages.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	30 V - Maximum drain-to-source blocking voltage for 12 V input bus applications with margin.
I_D (continuous)	19 A at T_C = 25°C - Sustained current handling with external heatsinking in SOIC-8.
R_DS(on) (typ)	4.5 mΩ at V_GS = 10 V - Enables <0.8 W conduction loss at 13.5 A in 12 V/16.2 W output buck stage.
Q_g (total)	27 nC - Supports efficient 500 kHz–1 MHz switching with moderate gate driver strength.
V_GS(th)	1.0–2.5 V - Ensures reliable turn-on with 3.3 V microcontroller GPIO or dedicated gate driver ICs.
Package	8-SOIC - Standard surface-mount outline with exposed drain pad for thermal transfer to PCB copper.

Pinout & Package

62-0136PBF is housed in an 8-pin SOIC package with exposed drain pad (pin 1–4 and 6–8 source/drain/gate connections; pin 5 is drain tab). Thermal pad must be soldered to PCB ground plane for rated current operation.

Pin/Terminal	Circuit Role	Design Meaning
1, 2, 3, 4	Source	Common source node; electrically tied internally; connects to low-side return path.
5	Drain (exposed pad)	Main power output terminal; requires direct thermal connection to PCB copper for heat dissipation.
6	Gate	Control input; driven by external gate driver to modulate channel conduction.
7, 8	Source	Additional source terminals; paralleled with pins 1–4 to reduce bond wire inductance.

Key Features

Feature	Design Value
Low R_DS(on) with logic-level gate drive	4.5 mΩ @ 10 V and full conduction at 3.3 V gate bias enables direct MCU control without level-shifting.
Trench MOSFET architecture	Reduces gate charge and output capacitance versus planar devices, improving hard-switching efficiency in buck converters.
SOIC-8 with exposed drain pad	Provides 1.5× thermal resistance improvement over standard SOIC-8, supporting 19 A with 2 oz copper and 2-in² thermal pad.
HBM ESD rating	Class 2 (≥2 kV) allows safe handling during manual assembly and reduces need for external protection diodes.

Applications

Telecom DC-DC Converters

Industrial Motor Drives

Use Scenario: 48 V to 12 V intermediate bus converter in base station power shelf.

IC Role / Device Role / Timing Role: Low-side synchronous rectifier in interleaved buck topology operating at 300 kHz.

Use Value: 4.5 mΩ R_DS(on) reduces conduction loss by 35% versus comparable 6 mΩ MOSFETs, improving system efficiency from 92.1% to 93.4% at 15 A load.

Use Scenario: Half-bridge gate driver output stage for 24 V BLDC motor control in PLC-mounted drives.

IC Role / Device Role / Timing Role: Low-side switch in three-phase inverter leg, commutated at ≤20 kHz.

Use Value: 1.0–2.5 V V_GS(th) ensures robust turn-on with isolated gate driver outputs, eliminating false turn-off during dv/dt transients.

Server VRMs

Automotive Body Control Modules

Use Scenario: 12 V input, 0.9 V/120 A multiphase CPU core regulator using doublers.

IC Role / Device Role / Timing Role: High-current phase-leg low-side FET in 6-phase configuration.

Use Value: SOIC-8 exposed pad enables 1.8 W power dissipation at 25°C ambient, supporting >15 A per phase without forced air.

Use Scenario: Load switch for 12 V accessory rail (e.g., HVAC blower, window lift) in BCM with LIN interface.

IC Role / Device Role / Timing Role: Protected high-side switch controlled via PWM from 8-bit MCU.

Use Value: Integrated ESD protection eliminates need for discrete TVS, reducing BOM count and PCB area in space-constrained modules.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
ON Semiconductor NTMFS4C09NT1G	R_DS(on) = 4.0 mΩ @ 10 V; Q_g = 25 nC; same 8-SOIC package with exposed drain.	Slightly lower conduction loss but tighter V_GS(th) tolerance (1.2–2.0 V); less margin for marginal gate drive.	Prefer when gate drive is stable ≥4.5 V and thermal budget is critical.
Vishay Si7850DP-T1-GE3	R_DS(on) = 5.2 mΩ @ 10 V; Q_g = 22 nC; SO-8 with gull-wing leads (no exposed pad).	Higher R_DS(on) increases conduction loss; lacks thermal pad, limiting continuous current to ~14 A at T_C = 25°C.	Acceptable for lower-current (<12 A), cost-sensitive designs where PCB thermal relief is limited.

Compared with NTMFS4C09NT1G and Si7850DP-T1-GE3, 62-0136PBF offers balanced R_DS(on)/Q_g trade-off and verified thermal performance in SOIC-8 with exposed pad-making it optimal for 12–19 A industrial DC-DC stages where gate drive voltage varies between 3.3 V and 10 V.

Availability

62-0136PBF is available at Aetrix Electronics and suitable for telecom power supplies, industrial motor drives, server VRMs, and automotive body control modules requiring stable component supply and long-term production continuity.

Supply support for 62-0136PBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs and discrete devices.

62-0136PBF belongs to Infineon's OptiMOS™ 30 V product line, engineered for high-efficiency, high-current DC-DC conversion in space-constrained industrial and telecom infrastructure equipment.

FAQ

What is the maximum junction temperature for continuous operation of 62-0136PBF?

The absolute maximum junction temperature is 150°C. Derating begins at T_J > 125°C; full 19 A current rating assumes T_C ≤ 25°C with adequate PCB copper thermal mass. At T_C = 70°C, continuous I_D drops to 12.5 A per datasheet Figure 5.

Does 62-0136PBF require a gate resistor for stability in hard-switching applications?

Yes-a 5–10 Ω series gate resistor is recommended to dampen ringing caused by gate-drain capacitance (C_gd) and PCB trace inductance. This prevents spurious turn-on during high dv/dt events and maintains safe operating area integrity at 500 kHz switching.

Can 62-0136PBF be used in parallel configurations?

Yes, but only with matched gate drive timing and symmetrical PCB layout. The device's positive temperature coefficient of R_DS(on) supports current sharing; however, thermal coupling between adjacent SOIC-8 packages must be minimized to avoid localized hot spots above 130°C.

Is the exposed drain pad on 62-0136PBF electrically isolated from other pins?

No-the exposed drain pad is internally connected to the drain terminal (pin 5). It must be soldered to a PCB copper pour tied to the main power ground or output rail. No insulation layer is required or recommended; thermal and electrical connection is mandatory for rated performance.

62-0136PBF Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: -

Package/Case:: -

Packaging:: Tube

Product Status:: Obsolete

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 30 V

Current - Continuous Drain (Id) @ 25°C:: 19A (Ta)

Drive Voltage (Max Rds On, Min Rds On):: 10V

Rds On (Max) @ Id, Vgs:: 4.5mOhm @ 19A, 10V

Vgs(th) (Max) @ Id:: 2.25V @ 250µA

Gate Charge (Qg) (Max) @ Vgs:: 44 nC @ 4.5 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 3710 pF @ 15 V

FET Feature:: -

Power Dissipation (Max):: 2.5W

Operating Temperature:: -55°C ~ 150°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: -

62-0136PBF FAQ

1.How can I place an order for 62-0136PBF through Aetrix?

Please submit a Request for Quotation (RFQ) for 62-0136PBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 62-0136PBF reliable?

The price and inventory of 62-0136PBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 62-0136PBF is usually 5 days.

3.What payment methods are accepted for 62-0136PBF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 62-0136PBF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 62-0136PBF?

62-0136PBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 62-0136PBF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 62-0136PBF?

For technical support, including 62-0136PBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 62-0136PBF requirements.

6.How does Aetrix verify that 62-0136PBF is sourced from the original manufacturer or authorized distributors?

All 62-0136PBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 62-0136PBF meets industry standards.

7.What is the process for return or replacement of 62-0136PBF?

All 62-0136PBF units undergo pre-shipment inspection (PSI). If there is an issue with 62-0136PBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 62-0136PBF part is unused and in its original packaging.

Return procedure for 62-0136PBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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