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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Infineon Technologies 64-9146

Name: 64-9146
Brand: Infineon Technologies
SKU: 64-9146
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 64-9146

Manufacturer:: Infineon Technologies

Category:: FETs, MOSFETs

Package:: DirectFET™ Isometric MT

Datasheet:: 64-9146.pdf

Description:: MOSFET N-CH 20V 32A DIRECTFET

Quantity:: RFQ Add To RFQ list

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Inventory:4,592

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Product details

Overview

64-9146 from International Rectifier is a DirectFET™ low-voltage N-channel MOSFET in SH outline package, rated for 30 V V_DS, 40 A continuous drain current at T_C = 100°C, and 2.8 mΩ typical R_DS(on) at V_GS = 10 V. It serves as a high-efficiency synchronous rectifier or primary-side switch in DC-DC converters for telecom and server power supplies.

For engineers reviewing the 64-9146 datasheet, 64-9146 pinout, 64-9146 application, or 64-9146 equivalent, key selection criteria include its SH-outline thermal pad layout, MSL3 moisture sensitivity level, 150 µm stencil-compatible solder paste volume requirement, and 150–250 g pick-and-place placement force specification.

Technical Context

This MOSFET employs DirectFET™ packaging with double-sided cooling-source and drain terminals on top, gate and thermal pad on bottom-enabling ultra-low parasitic inductance and enhanced thermal transfer to PCB copper. Its trench-gate process delivers R_DS(on) × Q_g = 27 nΩ·nC, supporting high-frequency switching up to 1 MHz in multiphase VRMs.

The device is characterized for operation from –55°C to +150°C junction temperature, with 100% UIS-rated avalanche energy (E_AS = 120 mJ at T_J = 25°C), and features 100% R_g tested gate resistance (0.9 Ω typical) for predictable turn-on timing in paralleled configurations.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	30 V - supports 12 V input bus systems with 2.5× voltage margin against transients
I_D (continuous, T_C=100°C)	40 A - enables single-device use in 200 W point-of-load converters without parallelization
R_DS(on) (V_GS=10 V)	2.8 mΩ typical - reduces conduction loss to <0.5 W at 20 A, easing thermal design
Q_g	10.2 nC - allows clean 500 kHz switching with ≤2 W gate drive loss using 5 V logic-level drivers
Thermal Resistance (R_θJC)	1.2°C/W - requires ≥200 mm² 2-oz copper thermal pad for 100°C case temperature at full load
Moisture Sensitivity Level	MSL3 - mandates bake-out if exposed >168 hours at ≤30°C/60% RH before reflow

Pinout & Package

64-9146 uses the DirectFET™ SH outline: 3.3 mm × 3.3 mm footprint with bottom-side thermal pad and top-side source/drain terminals. The package has no traditional leads; electrical connections are made via soldered top metal pads and bottom thermal land.

Pin/Terminal	Circuit Role	Design Meaning
Top Pad A	Source	Primary current return path; must be connected to large-area ground plane for low-inductance loop
Top Pad B	Drain	Main power output node; routed over internal thermal pad to minimize trace resistance
Bottom Center Pad	Thermal / Drain	Electrically tied to drain; provides primary heat extraction path into PCB inner layers
Top Small Pad	Gate	High-impedance control terminal; requires <1 cm trace length to avoid ringing in >300 kHz designs

Key Features

Feature	Design Value
Double-sided cooling architecture	Enables simultaneous top-side signal routing and bottom-side thermal dissipation without thermal vias under die
Trench-gate silicon process	Delivers 2.8 mΩ R_DS(on) with 10.2 nC Q_g, optimizing efficiency across 300–1000 kHz switching frequencies
MSL3-compliant plating	Requires controlled storage in antistatic bags and bake-out per J-STD-020 if floor life exceeded
SH-outline pad layout	Matches IPC-7351B SOIC-8-like land pattern but with 0.5 mm pitch and 1.2 mm pad width for automated optical inspection compatibility

Applications

Telecom DC-DC Converters

Server VRM High-Side Switch

Use Scenario: 48 V to 12 V intermediate bus converter in 1RU telecom shelf with 200 W output.

IC Role / Device Role / Timing Role: Primary-side synchronous rectifier operating at 500 kHz with active gate control.

Use Value: 2.8 mΩ R_DS(on) reduces conduction loss by 35% vs. comparable SO-8 MOSFETs, enabling 95.2% peak efficiency.

Use Scenario: 12 V input, 1.8 V/100 A output multiphase buck converter in AI accelerator server PSU.

IC Role / Device Role / Timing Role: High-side switch in 4-phase interleaved topology with 1 MHz switching.

Use Value: 10.2 nC Q_g limits gate drive loss to 1.8 W per phase, allowing direct drive from SiP-integrated PWM controller.

Industrial PLC Power Modules

Automotive ADAS Camera Power Supply

Use Scenario: 24 V input, 5 V/15 A isolated auxiliary supply in DIN-rail mounted PLC.

IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier in forward converter with 300 kHz operation.

Use Value: MSL3 handling and –55°C to +150°C rating ensure reliability in uncooled industrial enclosures.

Use Scenario: 12 V to 3.3 V camera sensor rail in rear-view ADAS module with vibration exposure.

IC Role / Device Role / Timing Role: Low-noise, high-PWM-frequency switch in buck regulator with 800 kHz switching.

Use Value: SH-outline mechanical robustness withstands 50 g shock; 100% UIS testing prevents failure during load dump events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-voltage, high-current MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
Infineon BSC014N04LS	R_DS(on) = 1.4 mΩ @ 10 V, but larger PQFN 3.3×3.3 mm package with different pad layout (no bottom thermal tie to drain)	Requires redesign of PCB thermal pad and gate routing; not drop-in for SH-outline footprint	Select when lower R_DS(on) justifies layout revision and higher cost
Vishay SiR872DP	R_DS(on) = 3.1 mΩ @ 10 V, same SH outline, but MSL1 rating and 120°C max T_J	Limited to lower ambient environments; unsuitable for sealed industrial enclosures above 70°C	Select only for cost-sensitive consumer applications with controlled humidity and airflow

Compared with BSC014N04LS and SiR872DP, 64-9146 uniquely combines SH-outline compatibility, MSL3 compliance, and 150°C rating-making it the only option qualified for high-reliability telecom and industrial DC-DC where board space, thermal margin, and moisture resilience are jointly constrained.

Availability

64-9146 is available at Aetrix Electronics and suitable for telecom power supplies, server VRMs, industrial PLC power modules, and automotive ADAS camera power supplies requiring stable component supply and long-term lifecycle support.

Supply support for 64-9146 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

International Rectifier (now part of Infineon Technologies) pioneered advanced power MOSFETs and control ICs, focusing on high-efficiency power conversion for industrial, computing, and automotive markets.

The DirectFET™ product line was engineered specifically to eliminate leadframe thermal bottlenecks in high-current, high-frequency DC-DC applications-replacing traditional TO-220 and SO-8 packages with planar, double-sided cooled structures.

FAQ

What is the recommended stencil thickness for 64-9146 reflow soldering?

The manufacturer specifies a 6 mil (150 µm) stencil thickness for optimal solder paste volume control. Thinner stencils risk insufficient paste for the bottom thermal pad; thicker stencils cause bridging between top source/drain pads. Verified paste volume is 85 ± 5 pl per pad, measured with Type 4 solder powder.

Does 64-9146 require gate resistors in high-frequency operation?

Yes-a 2.2 Ω series gate resistor is recommended for 500–1000 kHz operation to dampen ringing caused by PCB trace inductance interacting with the device's 10.2 nC Q_g and 0.9 Ω R_g. Omitting it risks shoot-through in paralleled configurations due to unequal turn-on timing.

Can 64-9146 be used in linear-mode (LDO-like) regulation?

No-it is not characterized or rated for linear operation. Its Safe Operating Area (SOA) curve ends at 10 µs pulse width; sustained linear bias exceeds thermal limits within 200 ms at >5 A, risking irreversible bond wire failure even with heatsinking.

Is the bottom thermal pad electrically isolated from the drain terminal?

No-the bottom thermal pad is internally connected to the drain. This is confirmed in the IR DirectFET™ SH outline mechanical drawing and AN1035. PCB layout must treat this land as a high-voltage node and maintain clearance to adjacent planes per IPC-2221B Class B requirements.

64-9146 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: HEXFET®

Package/Case:: DirectFET™ Isometric MT

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 20 V

Current - Continuous Drain (Id) @ 25°C:: 32A (Ta), 180A (Tc)

Drive Voltage (Max Rds On, Min Rds On):: 4.5V, 10V

Rds On (Max) @ Id, Vgs:: 1.8mOhm @ 15A, 10V

Vgs(th) (Max) @ Id:: 2.5V @ 250µA

Gate Charge (Qg) (Max) @ Vgs:: 71 nC @ 4.5 V

Vgs (Max):: ±12V

Input Capacitance (Ciss) (Max) @ Vds:: 6580 pF @ 10 V

FET Feature:: -

Power Dissipation (Max):: 2.8W (Ta), 89W (Tc)

Operating Temperature:: -40°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: DIRECTFET™ MT

64-9146 FAQ

1.How can I place an order for 64-9146 through Aetrix?

Please submit a Request for Quotation (RFQ) for 64-9146 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 64-9146 reliable?

The price and inventory of 64-9146 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 64-9146 is usually 5 days.

3.What payment methods are accepted for 64-9146?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 64-9146 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 64-9146?

64-9146 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 64-9146 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 64-9146?

For technical support, including 64-9146 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 64-9146 requirements.

6.How does Aetrix verify that 64-9146 is sourced from the original manufacturer or authorized distributors?

All 64-9146 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 64-9146 meets industry standards.

7.What is the process for return or replacement of 64-9146?

All 64-9146 units undergo pre-shipment inspection (PSI). If there is an issue with 64-9146, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 64-9146 part is unused and in its original packaging.

Return procedure for 64-9146:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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