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NXP Semiconductors 74ABT373ADB,112

Part No.:
74ABT373ADB,112
Manufacturer:
NXP Semiconductors
Category:
Latches
Package:
20-SSOP (0.209", 5.30mm Width)
Datasheet:
Aetrix74ABT373ADB,112.pdf
Description:
IC D-TYPE TRANSP SGL 8:8 20SSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,318

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Product details

Overview

74ABT373ADB,112 from NXP Semiconductors (formerly Philips) is an octal transparent latch with 3-State outputs, designed for bus interface and data buffering in 5V TTL-compatible systems. It features active-High latch enable (E), active-Low output enable (OE), ±64mA/–32mA drive capability, 3.2ns typical D→Q propagation delay at 5V, and operates across –40°C to +85°C.

For engineers reviewing the 74ABT373ADB,112 datasheet, 74ABT373ADB,112 pinout, 74ABT373ADB,112 application, or 74ABT373ADB,112 equivalent, key selection criteria include latch transparency timing, 3-State bus contention control, high-current drive for legacy TTL loads, and SSOP-20 footprint compatibility with industrial control and memory address/data latching.

Technical Context

The 74ABT373ADB,112 implements two independent control domains: latch operation governed by active-High E input (with 1.5ns setup and 1.0ns hold time at 5V), and output gating controlled by active-Low OE. Its BiCMOS architecture delivers low static current (100µA in 3-State) while sustaining high-speed switching (≤5.1ns max D→Q delay over temperature).

Each of the eight D→Q paths functions as a transparent latch during E = High and holds data on E transition; outputs enter high-impedance state only when OE = High-regardless of E or data state-enabling safe bus sharing without contention.

Key Specifications

ParameterValue and Actual Design Meaning
VCC Range4.5V to 5.5V - ensures robust operation under noisy 5V rail conditions common in industrial backplanes
tPLH / tPHL (D→Q)3.2ns / 3.6ns typ @ 5V, CL=50pF - enables reliable latching at >200MHz data rates in synchronous bus designs
IOL / IOH Drive+64mA / –32mA - directly drives multiple 74-series TTL inputs or terminates stubs on heavily loaded data buses
CIN / COUT4pF / 7pF - minimizes capacitive loading on upstream drivers and reduces signal integrity degradation
ICCZ (3-State)100µA max @ 5.5V - supports low-quiescent-power system states when outputs are disabled
ts / th (D→E)0.7ns / 0.0ns min @ –40°C to +85°C - defines minimum data stability window before latch enable edge

Pinout & Package

74ABT373ADB,112 is housed in a 20-pin plastic SSOP Type II package (SOT339-1), 5.3 mm body width, with 0.65 mm lead pitch and exposed pad not present. Pin 1 is OE (active-Low output enable); Pin 11 is E (active-High latch enable); Pins 3,4,7,8,13,14,17,18 are D0–D7; Pins 2,5,6,9,12,15,16,19 are Q0–Q7; Pin 10 is GND; Pin 20 is VCC.

Pin/TerminalCircuit RoleDesign Meaning
1 (OE)Active-Low output enableAsserting Low enables Q0–Q7 outputs; High forces all outputs into high-impedance state independent of latch state
3,4,7,8,13,14,17,18 (D0–D7)Data inputsAccept parallel data during E = High; sampled on High-to-Low E transition with 0.7ns setup requirement
2,5,6,9,12,15,16,19 (Q0–Q7)Latched data outputsReflect Dn when E = High (transparent mode) or held value after E transition; tri-stated when OE = High
11 (E)Active-High latch enableControls latching: data passes through while E = High; value frozen on E falling edge
10 (GND)Ground referencePrimary 0V return for logic and output drive circuits; must be low-inductance connection for noise immunity
20 (VCC)Positive supply5V nominal power rail; decoupling capacitor required within 1 cm to suppress switching transients

Key Features

FeatureDesign Value
Power-up 3-StateOutputs remain in high-impedance state until VCC stabilizes above 2.0V, preventing bus contention during power ramp
Live insertion/extraction supportInput/output structures tolerate hot-plug events without latch-up or damage per JEDEC Std 17 (>500mA)
ESD protection2000V HBM and 200V Machine Model - exceeds MIL-STD-883 requirements for manufacturing handling safety
BiCMOS processCombines CMOS low static power with bipolar speed and drive strength for optimal 5V system performance

Applications

Microprocessor Address LatchingMemory Data Bus Isolation

Use Scenario: Holding upper address bits during multiplexed AD bus cycles in 80x86 or Z80-based systems.

IC Role / Device Role / Timing Role: Transparent latch capturing A8–A15 while AD0–AD7 carry data; enabled by ALE pulse on E pin.

Use Value: Eliminates need for external glue logic; 3.2ns D→Q delay ensures setup compliance with 12MHz CPU timing.

Use Scenario: Isolating RAM/ROM data lines from peripheral controllers sharing a common 8-bit data bus.

IC Role / Device Role / Timing Role: Bidirectional buffer controlled by peripheral select and RD/WR strobes via OE and E pins.

Use Value: +64mA sink capability drives full TTL fan-out; high-impedance state prevents bus conflicts during idle periods.

Industrial I/O ExpansionDigital Control Panel Interface

Use Scenario: Latching parallel status signals from sensors or PLC modules before scanning by host controller.

IC Role / Device Role / Timing Role: Input capture device synchronized to scan clock edge on E; outputs read via shared data bus gated by OE.

Use Value: Wide temperature range (–40°C to +85°C) and latch-up immunity ensure reliability in factory-floor environments.

Use Scenario: Buffering keypad scan matrix outputs or LED segment drivers in embedded HMI panels.

IC Role / Device Role / Timing Role: Output latch holding display data while microcontroller services other peripherals; OE toggled for dynamic refresh.

Use Value: Low 100µA 3-State supply current extends battery life in portable panel designs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal transparent latch applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
74ABT373AD,118Same logic function and AC/DC specs; packaged in SO-20 (SOT163-1) instead of SSOP-20Requires PCB layout change due to wider 7.5mm body and 1.27mm pitch vs. SSOP's 5.3mm/0.65mmSelect when board space allows larger footprint and hand-soldering is preferred
SN74ABT373NIdentical functionality and timing; TI-manufactured version with same 20-pin DIP package (SOT146-1)Through-hole mounting only; no surface-mount option; higher thermal resistance than SSOPChoose for prototyping, legacy repair, or wave-soldered assemblies where DIP is mandated

Compared with 74ABT373ADB,112, the SO-20 alternative offers easier rework but consumes more board area, while the DIP version sacrifices density and thermal performance for mechanical robustness and manual assembly compatibility.

Availability

74ABT373ADB,112 is available at Aetrix Electronics and suitable for industrial control systems, legacy microprocessor bus interfaces, and memory subsystem design requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 74ABT373ADB,112 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions and high-performance logic for industrial and automotive markets.

The 74ABT373ADB,112 belongs to NXP's ABT-series advanced BiCMOS logic family, engineered specifically for high-speed, high-drive 5V bus interfacing in noise-sensitive and thermally demanding applications.

FAQ

What is the maximum operating frequency supported by the 74ABT373ADB,112?

The 74ABT373ADB,112 does not specify a maximum clock frequency, as it is a transparent latch-not a clocked register-but its 3.2ns typical D→Q propagation delay at 5V enables reliable use in systems with data valid windows ≥5ns. For 12MHz microprocessors with 41.7ns cycle time, the 74ABT373ADB,112 meets timing margins with margin. Actual usable rate depends on system-level setup/hold and bus loading.

Does the 74ABT373ADB,112 support live insertion in backplane applications?

Yes, the 74ABT373ADB,112 supports live insertion and extraction per its design: input/output structures include latch-up protection exceeding 500mA per JEDEC Std 17 and ESD hardening to 2000V HBM, enabling safe hot-swap in modular industrial backplanes without risk of damage or bus disruption.

What is the power-up behavior of the 74ABT373ADB,112 outputs?

During power-up, the 74ABT373ADB,112 outputs default to high-impedance state regardless of OE or E pin states until VCC rises above ~2.0V. This power-up 3-State feature prevents bus contention and spurious writes during supply ramp, a critical safeguard in multi-device 5V systems.

Can the 74ABT373ADB,112 drive standard TTL loads directly?

Yes, the 74ABT373ADB,112 can directly drive standard TTL loads: its –32mA high-level and +64mA low-level output currents exceed the –0.4mA / +16mA requirements of 74LS TTL, supporting up to 40 LS loads per output. This eliminates need for buffer amplifiers in legacy 5V bus designs.

Is the 74ABT373ADB,112 pin-compatible with older 74LS373 devices?

No, the 74ABT373ADB,112 is not pin-compatible with 74LS373: although both are 20-pin octal latches, the 74ABT373ADB,112 uses SSOP-20 (SOT339-1) with 0.65mm pitch, whereas 74LS373 typically uses DIP-20 or SO-20. Signal pin functions match (E, OE, Dn, Qn), but physical layout and thermal characteristics differ significantly.

74ABT373ADB,112 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
74ABT
Package/Case:
20-SSOP (0.209", 5.30mm Width)
Packaging:
Tube
Product Status:
Obsolete
Logic Type:
D-Type Transparent Latch
Circuit:
8:8
Output Type:
Tri-State
Voltage - Supply:
4.5V ~ 5.5V
Independent Circuits:
1
Delay Time - Propagation:
3.6ns
Current - Output High, Low:
32mA, 64mA
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
20-SSOP

74ABT373ADB,112 FAQ

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Please submit a Request for Quotation (RFQ) for 74ABT373ADB,112 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of 74ABT373ADB,112 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74ABT373ADB,112 is usually 5 days.

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5.How can I obtain technical support or documentation for 74ABT373ADB,112?

For technical support, including 74ABT373ADB,112 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74ABT373ADB,112 requirements.

6.How does Aetrix verify that 74ABT373ADB,112 is sourced from the original manufacturer or authorized distributors?

All 74ABT373ADB,112 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74ABT373ADB,112 meets industry standards.

7.What is the process for return or replacement of 74ABT373ADB,112?

All 74ABT373ADB,112 units undergo pre-shipment inspection (PSI). If there is an issue with 74ABT373ADB,112, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74ABT373ADB,112 part is unused and in its original packaging.

Return procedure for 74ABT373ADB,112:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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