Nexperia USA Inc. 74HC259BZX

Overview

74HC259BZX from Nexperia is an 8-bit addressable latch IC with four operational modes: addressable latch, memory, 3-to-8 demultiplexing, and reset. It features CMOS-level inputs, operates from 2.0 V to 6.0 V, supports -40 °C to +125 °C ambient range, and delivers 17 ns propagation delay at 6.0 V - used in industrial I/O expansion and serial-to-parallel data conversion.

For engineers reviewing the 74HC259BZX datasheet, 74HC259BZX pinout, 74HC259BZX application, or 74HC259BZX equivalent, key selection factors include its dual-mode functionality (latch + decoder), active-low LE/MR control logic, DHXQFN16 thermal-enhanced package, and compatibility with 3.3 V/5 V digital systems requiring deterministic output state control.

Technical Context

The device implements a combinational 3-to-8 decoder core integrated with eight independent D-type latches, each individually addressable via A0–A2. Mode selection is determined solely by LE and MR logic levels per Table 4 - no internal clock or state machine governs operation.

All outputs are buffered push-pull with ±25 mA drive capability, input clamp diodes enable overvoltage-tolerant interfacing, and static current remains below 160 μA across full temperature range - enabling low-power retention in memory mode without external gating.

Key Specifications

Pinout & Package

DHXQFN16 plastic leadless package (SOT8016-1), 2.0 mm × 2.4 mm × 0.48 mm body, 0.4 mm pitch, exposed thermal pad (non-soldered or floating GND).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit addressable latch applications.

Compared with 74HC259BZX, the 74HCT259BZX offers guaranteed TTL input compatibility at 5 V while maintaining identical latch/demux functionality; the SN74HC259PWR trades thermal performance for easier hand-soldering and broader distributor availability in TSSOP format.

Availability

74HC259BZX is available at Aetrix Electronics and suitable for industrial PLC I/O expansion, automotive body control modules, LED matrix drivers, and automated test equipment requiring stable component supply across extended temperature ranges.

Supply support for 74HC259BZX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance, reliable logic, analog, and MOSFET solutions with focus on efficiency, reliability, and miniaturization.

The 74HC259 belongs to Nexperia's HC logic family - engineered for low-power, wide-voltage industrial and automotive applications where deterministic timing and robust latch behavior are essential.

FAQ

What is the function of the MR pin on the 74HC259BZX?

The MR (Master Reset) pin is an active-LOW asynchronous input that forces all eight outputs (Q0–Q7) to LOW regardless of LE, address, or D input states. It overrides all other modes and requires no setup time - used for hardware-initiated system reset or fail-safe shutdown in safety-critical designs.

Can the 74HC259BZX operate at 3.3 V supply voltage?

Yes - the 74HC259BZX is fully specified from 2.0 V to 6.0 V, including 3.3 V operation. At VCC = 3.3 V, VIH is 2.1 V min and VOL is 0.26 V max at 4 mA load, ensuring clean interfacing with 3.3 V microcontrollers and FPGAs without level translation.

How does the addressable latch mode differ from memory mode?

In addressable latch mode (LE = LOW, MR = HIGH), the addressed latch follows the D input; non-addressed latches retain prior states. In memory mode (LE = HIGH, MR = HIGH), all latches freeze - inputs A0–A3 and D have no effect, preserving stored data during host processor interrupts or bus contention.

Is the thermal pad on the DHXQFN16 package required to be soldered?

No - the exposed thermal pad (terminal 1 index area) has no electrical or mechanical requirement to be soldered. If connected, it must remain electrically floating or tied to GND; improper grounding may cause latch instability due to substrate coupling in high-noise environments.