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Analog Devices Inc. ADN8833ACBZ-R7
- Part No.:
- ADN8833ACBZ-R7
- Manufacturer:
- Analog Devices Inc.
- Category:
- Power Management - Specialized
- Package:
- 25-WFBGA, WLCSP
- Datasheet:
-
ADN8833ACBZ-R7.pdf
- Description:
- IC THERMO COOLER DRIVER 25WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:8,276
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Product details
Overview
ADN8833ACBZ-R7 from Analog Devices is a monolithic H-bridge thermoelectric cooler (TEC) driver with integrated 1 A power MOSFETs, supporting both linear (LDR) and PWM (SW) output stages for bidirectional TEC current control. It features programmable heating/cooling current limits (±1 A), 2.5 V reference (±1%), 2 MHz switching frequency, and real-time analog monitoring of TEC voltage (VTEC) and current (ITEC). It is used in optical modules requiring precise laser diode temperature stabilization.
For engineers reviewing the ADN8833ACBZ-R7 datasheet, ADN8833ACBZ-R7 pinout, ADN8833ACBZ-R7 application, or ADN8833ACBZ-R7 equivalent, key selection considerations include its WLCSP-25 package, dual-mode (linear + PWM) architecture, independent cooling/heating limit programming, no external sense resistor requirement, and compatibility with digital PID thermal control loops using DAC-generated CONT signals.
Technical Context
The ADN8833ACBZ-R7 implements a patented single-inductor, hybrid H-bridge architecture: one side uses a high-gain linear amplifier (LDR, ±1 A, RDS(ON) ≤ 60 mΩ), the other uses a 2 MHz PWM stage (SW, ±1 A, RDS(ON) ≤ 80 mΩ). This enables >90% efficiency while eliminating need for external current-sense resistors.
It supports fully differential TEC drive with independent analog programming of cooling and heating current limits via ILIM (40 µA sink for cooling mode), and bidirectional voltage limits via VLIM/SD (10 µA sink for heating mode), referenced to an internal 2.5 V ±1% VREF. The CONT input accepts 0–2.5 V DAC output to set target temperature, while VTEC and ITEC provide ratiometric analog feedback (0.25 V/V and 0.525 V/A gain, respectively).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Current | ±1 A continuous - sufficient to drive typical 2 Ω TECs in optical transceivers without external boost stages. |
| Switching Frequency | 2 MHz internal oscillator - enables use of compact 1 µH inductors and reduces EMI compared to sub-MHz alternatives. |
| Voltage Reference | 2.50 V ±1% - provides stable bias for ILIM/VLIM dividers and serves as precision reference for external DAC/ADC circuits. |
| TEC Current Sense | 0.525 V/A gain, ±10% accuracy (WLCSP) - eliminates need for external shunt, simplifies BOM, and enables direct ADC interfacing. |
| TEC Voltage Sense | 0.25 V/V gain, ±2.5% full-scale accuracy - allows real-time differential TEC voltage measurement without external amplifiers. |
| Supply Range | 2.7 V to 5.5 V on VDD and PVIN - supports direct integration with 3.3 V or 5 V system rails without LDO overhead. |
| Thermal Shutdown | 170°C threshold with 17°C hysteresis - protects device during overload or poor heatsinking in sealed optical modules. |
Pinout & Package
ADN8833ACBZ-R7 is packaged in a 25-ball, 2.5 mm × 2.5 mm Wafer-Level Chip Scale Package (WLCSP) with 0.4 mm pitch and exposed thermal pad (EP) soldered to AGND plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| LDR | Linear driver output | H-bridge high-side linear output; sinks/sources ±1 A with low RDS(ON); connects directly to TEC+. |
| SW | PWM switch node | H-bridge low-side PWM output; switches at 2 MHz; requires external LC filter for TEC smoothing. |
| ITEC | TEC current monitor | Analog voltage output (1.25 V ±0.525 V/A) - directly interfaces with ADC for closed-loop current feedback. |
| VTEC | TEC voltage monitor | Analog voltage output (1.25 V ±0.25×ΔVTEC) - enables real-time differential voltage measurement across TEC terminals. |
| CONT | Digital control input | 0–2.5 V analog input from DAC; sets target temperature by controlling LDR/SW duty and polarity. |
| ILIM | Current limit programming | Accepts resistor divider to independently set cooling (sourcing) and heating (sinking) current thresholds. |
| VLIM/SD | Voltage limit/shutdown | Resistor-divider input for asymmetric TEC voltage limits; pulled low (<0.07 V) forces shutdown. |
| EN/SY | Enable/synchronization | Logic-enable input or external 1.85–3.25 MHz sync clock; enables phase synchronization across multiple ADN8833 units. |
| VREF | Reference output | 2.5 V ±1% buffered reference; powers ILIM/VLIM dividers and can serve as ADC/DAC reference. |
| AGND | Signal ground | Separate analog ground return for VREF, CONT, ITEC, VTEC - must be star-connected to minimize noise coupling. |
| PGNDL / PGNDS | Power grounds | Dedicated linear (PGNDL) and PWM (PGNDS) ground returns - prevent high-current switching noise from corrupting analog signals. |
Key Features
| Feature | Design Value |
|---|---|
| Hybrid H-bridge architecture | Combines low-noise linear stage (LDR) with high-efficiency PWM stage (SW) - achieves >90% efficiency while minimizing output ripple and EMI in sensitive optical systems. |
| No external current sense resistor | Integrated current sensing with 0.525 V/A gain and ±10% accuracy - reduces component count, PCB area, and thermal drift errors in TEC current feedback path. |
| Independent heating/cooling limits | Separate ILIM and VLIM/SD programming allows asymmetric current/voltage clamping - essential for optimizing thermal response in laser diode applications where cooling demand exceeds heating capability. |
| Digital thermal loop compatibility | CONT input accepts standard 0–2.5 V DAC output; VTEC/ITEC outputs provide ratiometric analog feedback - enables seamless integration with microcontroller-based PID firmware. |
| 2.5 V reference with 1% accuracy | Stable, buffered VREF drives ILIM/VLIM dividers and serves as system reference for external signal chain - eliminates need for discrete reference IC in compact optical modules. |
Applications
| Optical Transceivers | Laser Diode Temperature Control |
|---|---|
Use Scenario: 100G/400G QSFP-DD and OSFP optical modules requiring sub-0.1°C laser wavelength stability over −5°C to +70°C ambient. IC Role / Device Role / Timing Role: TEC driver that translates DAC-setpoint voltage into bidirectional ±1 A current through the TEC to maintain constant laser junction temperature. Use Value: Enables <1 pm wavelength drift via precise TEC control, meeting ITU-T G.698.2 spectral compliance without external calibration. |
Use Scenario: High-power pump lasers in EDFA subsystems where thermal runaway must be prevented during burst-mode operation. IC Role / Device Role / Timing Role: Monitors real-time TEC voltage (VTEC) and current (ITEC) to dynamically adjust CONT input and avoid TEC overvoltage or current saturation. Use Value: Prevents catastrophic TEC failure by enforcing programmable ±1 A current and ±2.5 V differential voltage limits during transient thermal events. |
| Fiber Optic Amplifiers | Test & Measurement Instruments |
Use Scenario: C-band erbium-doped fiber amplifiers requiring stable gain flatness across temperature variations in outdoor cabinets. IC Role / Device Role / Timing Role: Drives TEC attached to wavelength-selective components (e.g., thin-film filters) using digital PID loop closed via external MCU and ADC. Use Value: Maintains ±0.05 dB gain variation over −40°C to +85°C by delivering fast, low-noise TEC current with <150 ms soft-start settling. |
Use Scenario: Benchtop optical spectrum analyzers needing rapid, jitter-free temperature ramping for calibration sweeps. IC Role / Device Role / Timing Role: Accepts step-change CONT commands from FPGA-based controller and delivers controlled ±1 A TEC current with zero-crossing transition detection. Use Value: Achieves <500 ms full-scale temperature ramp (−40°C to +85°C) with <10 mA current overshoot, enabling repeatable instrument calibration sequences. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar TEC driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADN8834ACPZ-R7 | LFCSP-24 package; includes analog thermal loop support (dual CONT inputs); higher θJA (37°C/W vs. 48°C/W); same WLCSP/LFCSP pinout family. | Supports mixed analog/digital PID; better thermal performance in high-power layouts; requires larger PCB footprint than WLCSP. | Select when analog compensation or higher thermal headroom is needed; not drop-in due to different package and thermal pad layout. |
| MAX1968EUB+ | 28-pin μMAX; 1.5 A output; 1.2 MHz switching; no integrated VREF; requires external sense resistor; separate heating/cooling enable pins. | Lacks integrated current/voltage monitoring; needs external 2.5 V reference and shunt; less suited for space-constrained optical modules. | Choose for legacy designs already using MAX1968; higher current but lower integration and larger footprint than ADN8833ACBZ-R7. |
Compared with ADN8834ACPZ-R7 and MAX1968EUB+, the ADN8833ACBZ-R7 offers the smallest form factor (2.5 mm × 2.5 mm WLCSP), integrated reference and sensing, and optimal balance of efficiency (>90%) and noise performance for next-generation pluggable optics - making it preferred for density-critical, digitally controlled TEC applications.
Availability
ADN8833ACBZ-R7 is available at Aetrix Electronics and suitable for optical transceivers, fiber optic amplifiers, laser diode temperature control, and test & measurement instruments requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for ADN8833ACBZ-R7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, serving precision instrumentation, communications, and industrial markets since 1965.
The ADN8833ACBZ-R7 belongs to Analog Devices' TEC driver product line, designed specifically for compact, digitally controlled thermal management in optical networking and photonics applications where size, efficiency, and integration are critical.
FAQ
What is the package type and thermal performance of the ADN8833ACBZ-R7?
The ADN8833ACBZ-R7 uses a 25-ball, 2.5 mm × 2.5 mm Wafer-Level Chip Scale Package (WLCSP) with exposed thermal pad. Its thermal resistance is θJA = 48°C/W (JEDEC 4-layer board), θJC = 0.6°C/W, and θJB = 5.65°C/W. This package enables high-density placement in optical modules while maintaining safe junction temperatures under 1 A continuous load when properly soldered to AGND.
How does the ADN8833ACBZ-R7 support digital PID thermal control loops?
The ADN8833ACBZ-R7 supports digital PID loops via its CONT input (accepts 0–2.5 V DAC output), plus analog feedback outputs VTEC and ITEC. These provide ratiometric voltage representations of TEC voltage (0.25 V/V gain) and current (0.525 V/A gain), enabling direct ADC sampling. Its 2.5 V ±1% VREF also serves as a stable reference for the external DAC and sensing circuitry in the loop.
Can the ADN8833ACBZ-R7 drive asymmetric heating and cooling currents?
Yes. The ADN8833ACBZ-R7 allows independent programming of heating and cooling current limits via the ILIM pin using a resistor divider. Internal 40 µA current sink during cooling mode enables higher cooling current thresholds (e.g., 1 A) while allowing lower heating limits (e.g., 0.7 A), matching typical TEC thermal asymmetry in laser diode applications.
What is the function of the VLIM/SD pin on the ADN8833ACBZ-R7?
The VLIM/SD pin on the ADN8833ACBZ-R7 serves dual functions: (1) setting bidirectional TEC voltage limits via resistor divider (cooling limit > heating limit due to 10 µA internal sink during heating), and (2) hard shutdown when pulled below 0.07 V. It enables protection against TEC overvoltage and provides a system-level disable path without affecting other supplies.
Does the ADN8833ACBZ-R7 require external components for current sensing?
No. The ADN8833ACBZ-R7 integrates high-accuracy current sensing with 0.525 V/A gain and ±10% error (WLCSP), providing a direct analog voltage output (ITEC) proportional to TEC current. This eliminates the need for external shunt resistors, associated op-amps, and calibration - reducing BOM cost, PCB area, and thermal drift in optical module designs.
ADN8833ACBZ-R7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 25-WFBGA, WLCSP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Thermoelectric Cooler
- Current - Supply:
- 2.1mA
- Voltage - Supply:
- 2.7V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 25-WLCSP (2.54x2.54)
ADN8833ACBZ-R7 FAQ
1.How can I place an order for ADN8833ACBZ-R7 through Aetrix?
Please submit a Request for Quotation (RFQ) for ADN8833ACBZ-R7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ADN8833ACBZ-R7 reliable?
The price and inventory of ADN8833ACBZ-R7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADN8833ACBZ-R7 is usually 5 days.
3.What payment methods are accepted for ADN8833ACBZ-R7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADN8833ACBZ-R7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ADN8833ACBZ-R7?
ADN8833ACBZ-R7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ADN8833ACBZ-R7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ADN8833ACBZ-R7?
For technical support, including ADN8833ACBZ-R7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADN8833ACBZ-R7 requirements.
6.How does Aetrix verify that ADN8833ACBZ-R7 is sourced from the original manufacturer or authorized distributors?
All ADN8833ACBZ-R7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADN8833ACBZ-R7 meets industry standards.
7.What is the process for return or replacement of ADN8833ACBZ-R7?
All ADN8833ACBZ-R7 units undergo pre-shipment inspection (PSI). If there is an issue with ADN8833ACBZ-R7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ADN8833ACBZ-R7 part is unused and in its original packaging.
Return procedure for ADN8833ACBZ-R7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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