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Analog Devices Inc. ADP3650JCPZ-RL

Part No.:
ADP3650JCPZ-RL
Manufacturer:
Analog Devices Inc.
Category:
Gate Drivers
Package:
8-VFDFN Exposed Pad, CSP
Datasheet:
AetrixADP3650JCPZ-RL.pdf
Description:
IC GATE DRVR HALF-BRIDGE 8LFCSP
Quantity:
Payment:
Payment
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Inventory:4,119

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Product details

Overview

ADP3650JCPZ-RL from Analog Devices is a dual, bootstrapped 12 V MOSFET driver optimized for synchronous buck converters, featuring integrated anti-crossconduction protection, output disable (OD) functionality, and capability to drive 3000 pF loads with 45 ns propagation delay and 25 ns transition time. It drives two N-channel MOSFETs-one high-side (bootstrapped) and one low-side-in telecom, industrial, and point-of-load applications powering FPGAs and ASICs.

For engineers reviewing the ADP3650JCPZ-RL datasheet, ADP3650JCPZ-RL pinout, ADP3650JCPZ-RL application, or ADP3650JCPZ-RL equivalent, key selection criteria include bootstrap-enabled high-side drive, OD-controlled shutdown, −40°C to +85°C operation, LFCSP package thermal performance, and overlap protection timing behavior under varying load capacitance and temperature.

Technical Context

The ADP3650JCPZ-RL implements adaptive overlap protection by monitoring the SW node voltage to enforce turn-off of the high-side MOSFET before enabling the low-side driver-requiring SW to fall to ≤1 V or applying a fixed 150 ns delay. Its high-side driver uses external BST/SW bootstrap circuitry with internal charge-pump logic, while the low-side driver operates referenced to PGND with VCC bias.

Timing is defined at 10%/90% thresholds; propagation delays range from 12 ns (tpdhDRVL) to 70 ns (tpdhDRVH), and transition times are specified for 3 nF loads. The OD pin asserts within 20–55 ns to force both DRVH and DRVL low, preventing output capacitor discharge during system shutdown.

Key Specifications

ParameterValue and Actual Design Meaning
VCC Range4.15 V to 13.2 V - supports 5 V, 12 V, and 13 V input rails without external regulation
High-Side Output Resistance2.5 Ω to 3.9 Ω (sourcing) - ensures robust gate drive into high dV/dt switching nodes
Low-Side Output Resistance1.4 Ω to 2.6 Ω (sinking) - enables fast turn-off of synchronous rectifier MOSFETs
Propagation Delay (DRVH)32 ns to 70 ns - defines worst-case timing margin between IN edge and high-side gate response
Transition Time (DRVH)20 ns to 40 ns - limits EMI generation while maintaining <500 kHz switching capability
UVLO Threshold1.5 V to 3.0 V with 350 mV hysteresis - prevents erratic operation during brown-out conditions
Operating Temperature−40°C to +85°C - qualified for industrial and telecom base station environments

Pinout & Package

The ADP3650JCPZ-RL is housed in an 8-lead LFCSP (3 mm × 3 mm, 0.75 mm height, CP-8-13), with exposed pad thermally and electrically connected to PGND on PCB per AN-772 guidelines.

Pin/TerminalCircuit RoleDesign Meaning
BSTBootstrap supply inputProvides floating bias for high-side driver; requires external capacitor to SW to sustain gate voltage during high-side conduction
INPWM control inputSingle logic-level signal controlling both drivers: high = DRVH active, low = DRVL active
ODOutput disableActive-low shutdown pin forcing both DRVH and DRVL low to prevent shoot-through and rapid capacitor discharge
VCCMain supply inputPower source for low-side driver and logic; requires local 1 µF ceramic bypass to PGND
DRVLLow-side gate drive outputDrives source-grounded N-MOSFET; 180° out-of-phase with IN; sinks up to 2.6 Ω load
PGNDPower ground referenceReturn path for low-side driver current; must be tightly coupled to MOSFET source and exposed pad
SWSwitch node monitorFloating return for high-side driver; used by overlap circuit to detect voltage decay before enabling DRVL
DRVHHigh-side gate drive outputDrives floating N-MOSFET gate; in-phase with IN; sourced from BST rail with 2.5–3.9 Ω pull-up

Key Features

FeatureDesign Value
Integrated overlap protectionPrevents shoot-through by enforcing minimum dead-time via SW node voltage sensing and fixed 150 ns delay
Bootstrapped high-side driveEnables efficient N-MOSFET high-side switching without isolated supply; supports >25 V BST-to-SW differential
Output disable (OD) functionSimultaneously forces DRVH and DRVL low within 55 ns to halt power stage during fault or shutdown
Thermally enhanced LFCSPθJA = 50°C/W (4-layer board) - enables high-density PoL designs with minimal heatsinking
Robust input thresholds2.0 V VIH / 0.8 V VIL with 40–350 mV hysteresis - tolerates noisy control signals in industrial environments

Applications

Telecom Point-of-LoadIndustrial FPGA Power

Use Scenario: Providing regulated 1.2 V/20 A supply to high-speed FPGA core logic in 48 V telecom shelf systems.

IC Role / Device Role / Timing Role: Dual MOSFET driver controlling synchronous buck stage; generates complementary gate signals with adaptive dead-time control.

Use Value: Enables >92% efficiency at 500 kHz switching with minimal external components and no external timing IC required.

Use Scenario: Powering multi-rail industrial PLC I/O modules requiring tight transient response and thermal reliability.

IC Role / Device Role / Timing Role: High-side/low-side gate driver with OD pin tied to system watchdog for safe shutdown during fault detection.

Use Value: Prevents catastrophic shoot-through during brown-out or reset sequences via guaranteed low-state outputs on OD assertion.

Medical Imaging DSP SupplyDatacom ASIC Core Rail

Use Scenario: Delivering clean, low-noise 0.85 V/15 A supply to real-time DSP processors in portable ultrasound equipment.

IC Role / Device Role / Timing Role: Synchronous buck driver with precise propagation matching (≤25 ns skew between DRVH/DRVL edges) to minimize ripple.

Use Value: Reduces output voltage deviation during load transients by ensuring consistent gate timing across temperature (−40°C to +85°C).

Use Scenario: Generating 0.95 V core voltage for 10 GbE switch ASICs in datacenter line cards with strict EMI limits.

IC Role / Device Role / Timing Role: Fast-transition MOSFET driver (20–40 ns tr/tf) operating at 400 kHz with controlled slew rate via external RBST.

Use Value: Limits radiated emissions by enabling gate resistor tuning without sacrificing efficiency or thermal performance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual MOSFET driver applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LM5113SD/NOPBHigher VBST rating (100 V), separate high/low enable pins, no integrated overlap logicRequires external dead-time control; suited for higher input voltage (>60 V) isolated topologiesChoose when driving GaN FETs or needing >60 V bootstrap swing; not drop-in for ADP3650JCPZ-RL's single-IN architecture
MP6610DQKT-LF-ZIntegrated bootstrap diode, lower drive strength (4 Ω sourcing), no OD pin, 3 mm × 3 mm QFNLacks output disable and adaptive overlap; relies on controller-level dead-time managementSelect for cost-sensitive, non-safety-critical DC/DC where OD and overlap protection are handled upstream

Compared with LM5113SD/NOPB and MP6610DQKT-LF-Z, the ADP3650JCPZ-RL uniquely integrates adaptive SW-sensed overlap protection and a dedicated OD pin-enabling safer, simpler, and more reliable synchronous buck implementation without external timing or shutdown logic.

Availability

ADP3650JCPZ-RL is available at Aetrix Electronics and suitable for telecom point-of-load conversion, industrial FPGA power supplies, and medical imaging DSP rails requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for ADP3650JCPZ-RL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, serving precision instrumentation, industrial automation, and communications markets.

The ADP3650 product line delivers highly integrated, thermally optimized MOSFET drivers for nonisolated synchronous buck converters-designed specifically to simplify high-efficiency, high-density power supply design in space-constrained applications.

FAQ

What is the maximum allowable BST-to-SW voltage for ADP3650JCPZ-RL?

The ADP3650JCPZ-RL supports a BST-to-SW voltage up to +15 V DC or +35 V for pulses under 200 ns. This rating enables reliable operation with fast-switching N-MOSFETs in 12 V and 24 V input buck stages. Exceeding these limits risks permanent damage to the high-side driver output stage. Always verify BST capacitor voltage rating exceeds 2× maximum input voltage.

How does the ADP3650JCPZ-RL implement overlap protection without external components?

The ADP3650JCPZ-RL implements overlap protection by continuously monitoring the SW pin voltage. When IN transitions low, it waits for SW to fall below 1 V before enabling DRVL; if SW fails to reach that threshold within 190 ns, DRVL activates unconditionally. This adaptive timing eliminates need for external RC networks or dead-time controllers while ensuring shoot-through prevention across temperature and load variations.

Can ADP3650JCPZ-RL drive GaN HEMTs in a synchronous buck configuration?

The ADP3650JCPZ-RL can drive enhancement-mode GaN HEMTs provided gate drive requirements fall within its specifications: ≤10 V gate voltage, ≤3 nF total gate capacitance, and compatible logic thresholds. However, due to GaN's faster switching and higher dV/dt, external gate resistors and careful PCB layout (minimizing SW node loop inductance) are essential. The ADP3650JCPZ-RL's 25 ns transition time and 2.5 Ω high-side drive make it suitable for moderate-frequency GaN designs up to 1 MHz.

What is the thermal resistance (θJA) of ADP3650JCPZ-RL in its LFCSP package?

The ADP3650JCPZ-RL has a junction-to-ambient thermal resistance (θJA) of 50°C/W when mounted on a 4-layer PCB with the exposed pad properly soldered to a thermal plane. This value assumes JEDEC Std test conditions and reflects superior heat dissipation versus SOIC_N (θJA = 90°C/W). For accurate thermal design, use θJC = 12°C/W (junction-to-case) with IR thermography or thermal simulation.

Does ADP3650JCPZ-RL require external bootstrap diodes and capacitors?

Yes, ADP3650JCPZ-RL requires an external bootstrap diode (≥15 V rating) and capacitor (CBST1/CBST2) between BST and SW pins. The diode charges CBST1 during low-side conduction; CBST2 and RBST limit dV/dt and ringing. Recommended values depend on MOSFET gate charge-for example, 12 nF CBST1 and 6.8 nF CBST2 for a 12 nC gate charge device at 7 V gate drive. Ceramic capacitors with X7R dielectric are strongly advised.

ADP3650JCPZ-RL Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc.
Series:
-
Package/Case:
8-VFDFN Exposed Pad, CSP
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Driven Configuration:
Half-Bridge
Channel Type:
Synchronous
Number of Drivers:
2
Gate Type:
N-Channel MOSFET
Voltage - Supply:
4.15V ~ 13.2V
Logic Voltage - VIL, VIH:
0.8V, 2V
Current - Peak Output (Source, Sink):
-
Input Type:
Non-Inverting
High Side Voltage - Max (Bootstrap):
-
Rise / Fall Time (Typ):
20ns, 16ns
Operating Temperature:
0°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-LFCSP-VD (3x3)

ADP3650JCPZ-RL FAQ

1.How can I place an order for ADP3650JCPZ-RL through Aetrix?

Please submit a Request for Quotation (RFQ) for ADP3650JCPZ-RL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ADP3650JCPZ-RL reliable?

The price and inventory of ADP3650JCPZ-RL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADP3650JCPZ-RL is usually 5 days.

3.What payment methods are accepted for ADP3650JCPZ-RL?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADP3650JCPZ-RL transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ADP3650JCPZ-RL?

ADP3650JCPZ-RL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ADP3650JCPZ-RL order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ADP3650JCPZ-RL?

For technical support, including ADP3650JCPZ-RL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADP3650JCPZ-RL requirements.

6.How does Aetrix verify that ADP3650JCPZ-RL is sourced from the original manufacturer or authorized distributors?

All ADP3650JCPZ-RL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADP3650JCPZ-RL meets industry standards.

7.What is the process for return or replacement of ADP3650JCPZ-RL?

All ADP3650JCPZ-RL units undergo pre-shipment inspection (PSI). If there is an issue with ADP3650JCPZ-RL, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ADP3650JCPZ-RL part is unused and in its original packaging.

Return procedure for ADP3650JCPZ-RL:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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