Analog Devices Inc. ADP3654ARDZ-R7
- Part No.:
- ADP3654ARDZ-R7
- Manufacturer:
- Analog Devices Inc.
- Category:
- Gate Drivers
- Package:
- 8-SOIC (0.154", 3.90mm Width) Exposed Pad
- Datasheet:
-
ADP3654ARDZ-R7.pdf
- Description:
- IC GATE DRVR LOW-SIDE 8SOIC
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
ADP3654ARDZ-R7 from Analog Devices is a high-speed dual low-side MOSFET driver IC designed to independently drive two N-channel power MOSFETs in synchronous buck, half-bridge, and motor drive topologies. It delivers ±4 A peak source/sink current, 10 ns typical rise/fall time (2.2 nF load), and matched propagation delays (≤2 ns) across channels, operating from 4.5 V to 18 V supply at −40°C to +125°C junction temperature.
For engineers reviewing the ADP3654ARDZ-R7 datasheet, ADP3654ARDZ-R7 pinout, ADP3654ARDZ-R7 application, or ADP3654ARDZ-R7 equivalent, key selection criteria include UVLO threshold (4.2 V typ), 3.3 V-compatible logic inputs, thermally enhanced SOIC_N_EP package with exposed pad, parallelable outputs, and precise delay matching for phase-critical power stage control.
Technical Context
The ADP3654ARDZ-R7 integrates two independent gate drivers with internal pull-downs on INA/INB inputs, enabling safe default-off operation during controller initialization. Its UVLO comparator features 0.3 V hysteresis (VUVLO_ON = 4.2 V, VUVLO_OFF = 3.9 V) to ensure controlled startup/shutdown when interfacing low-voltage digital controllers with higher-voltage power stages.
Each channel provides low-impedance output stages capable of driving capacitive loads up to 2.2 nF with minimal ringing, supported by dedicated PGND and exposed thermal pad (EPAD) tied to die substrate ground. Propagation delays are tightly matched (tD1 = 14–30 ns, tD2 = 22–35 ns), enabling synchronized switching in dual-phase converters and synchronous rectifiers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 4.5 V to 18 V - supports wide input rails including 5 V, 12 V, and 15 V power stages without level shifting. |
| Peak Output Current | ±4 A - enables fast charging/discharging of high-QG MOSFETs (e.g., >100 nC) at high frequencies. |
| Rise/Fall Time | 10 ns (typ) @ 2.2 nF - minimizes switching losses in hard-switched SMPS above 300 kHz. |
| UVLO Threshold | 4.2 V turn-on / 3.9 V turn-off (25°C) - ensures reliable power sequencing with hysteresis preventing chatter near brownout. |
| Input Logic Compatibility | 3.3 V CMOS/TTL - directly interfaces with modern digital PWM controllers (e.g., ADP10xx, UCD3138) without external translators. |
| Delay Matching | ≤2 ns between channels - critical for interleaved or synchronous rectifier designs requiring sub-ns timing alignment. |
| Operating Temperature | −40°C to +125°C - qualified for industrial and automotive under-hood environments with full parameter guarantee. |
Pinout & Package
The ADP3654ARDZ-R7 is packaged in an 8-lead SOIC_N_EP (RD-8-4) with exposed thermal pad, optimized for high-current switching and PCB-level heat dissipation (θJA = 59°C/W on JEDEC 4-layer board).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 8 NC | No Connect | Unused pins; must remain unconnected per datasheet to avoid parasitic coupling or ESD path disruption. |
| 2 INA | Channel A Input | 3.3 V-compatible logic input with internal pull-down; drives OUTA when high; floating state defaults to OFF. |
| 3 PGND | Power Ground | Low-inductance return path for MOSFET source; must be connected directly to source node and EPAD for optimal noise immunity. |
| 4 INB | Channel B Input | Independent logic input identical to INA; enables asynchronous or complementary control of second MOSFET. |
| 5 OUTB | Channel B Output | Low-side gate driver output capable of ±4 A; connects directly to gate of N-channel MOSFET referenced to PGND. |
| 6 VDD | Supply Voltage | Main power rail (4.5–18 V); requires local 4.7 µF MLCC + 100 nF ceramic bypass to PGND to suppress switching transients. |
| 7 OUTA | Channel A Output | Identical to OUTB; dual outputs can be paralleled (INA+INB tied, OUTA+OUTB tied) to double drive strength. |
| 9 EPAD | Exposed Thermal Pad | Electrically grounded to die substrate; must be soldered to large copper pour connected to PGND for thermal and EMI performance. |
Key Features
| Feature | Design Value |
|---|---|
| Industry-standard pinout | SOIC-8 compatible footprint enables drop-in replacement of legacy drivers (e.g., IR2110 variants) without PCB redesign. |
| Parallelable dual outputs | INA/INB and OUTA/OUTB can be wired in parallel to deliver ±8 A peak current and halve thermal stress per channel. |
| Precise UVLO with hysteresis | Guarantees clean power-up/power-down sequencing when VDD ramps with digital controller supply, eliminating shoot-through risk. |
| Matched propagation delays | Ensures ≤2 ns skew between rising/falling edges of OUTA and OUTB-critical for zero-voltage switching (ZVS) and multi-phase synchronization. |
| Thermally enhanced SOIC_N_EP | Exposed pad reduces θJA by ~30% vs. standard SOIC, supporting sustained 4 A drive at 125°C ambient in compact layouts. |
Applications
| AC-to-DC SMPS | DC-to-DC Converters |
|---|---|
|
Use Scenario: High-efficiency active clamp forward or LLC resonant converter in server PSU or telecom rectifier. IC Role / Device Role / Timing Role: Dual low-side driver controlling synchronous rectifier MOSFETs in secondary side, timed to match primary-side ZVS transitions. Use Value: 10 ns rise/fall time and matched delays enable tight dead-time control, reducing conduction loss and improving efficiency >95% at 1 MHz. |
Use Scenario: Dual-phase interleaved buck converter supplying CPU core voltage in AI accelerator modules. IC Role / Device Role / Timing Role: Independent channel control of two high-side/N-channel low-side pairs (with external high-side bootstrap), managing phase-shifted PWM. Use Value: ≤2 ns inter-channel delay matching ensures balanced current sharing and minimized output ripple at 500 kHz–1 MHz switching. |
| Synchronous Rectification | Motor Drives |
|
Use Scenario: Secondary-side rectification in isolated DC-DC modules for industrial PLC I/O power rails. IC Role / Device Role / Timing Role: Low-side gate driver for N-channel MOSFETs replacing Schottky diodes, driven by isolated gate drive signals. Use Value: ±4 A peak current sustains fast turn-on of high-capacitance MOSFETs (QG > 80 nC), cutting forward voltage drop and thermal load. |
Use Scenario: 3-phase inverter stage in BLDC motor control for HVAC blowers or robotic joint actuators. IC Role / Device Role / Timing Role: Dual driver per half-bridge leg (paired with high-side driver), managing low-side switch timing relative to commutation signals. Use Value: 3.3 V logic compatibility allows direct interface with MCU GPIOs; UVLO prevents erratic switching during brownout conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual low-side MOSFET driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM5112MMX/NOPB | Lower peak current (±2.5 A), no UVLO hysteresis, SO PowerPAD package (θJA = 42°C/W). | Best suited for lower-power <100 W DC-DC where gate charge is <50 nC and sequencing margin is less critical. | Select LM5112MMX/NOPB only if drive strength and UVLO precision requirements are relaxed; not suitable for >300 kHz or high-QG MOSFETs. |
| UCC27524ADR | Higher drive current (±5 A), tighter delay matching (1 ns), but no integrated UVLO - requires external monitoring circuitry. | Preferred in high-reliability telecom systems where ultra-low skew is mandatory and external UVLO is already present. | Choose UCC27524ADR when maximum timing fidelity is required and system-level UVLO is implemented separately; adds design complexity. |
Compared with LM5112MMX/NOPB and UCC27524ADR, the ADP3654ARDZ-R7 uniquely balances high drive strength (±4 A), built-in hysteresis-enabled UVLO, and industry-standard SOIC_N_EP packaging-making it optimal for mid-to-high power SMPS and motor drives where robustness, ease of use, and thermal performance are prioritized over marginal skew reduction or ultra-high current.
Availability
ADP3654ARDZ-R7 is available at Aetrix Electronics and suitable for AC-to-DC switch mode power supplies, DC-to-DC power supplies, and motor drives requiring stable component supply, RoHS-compliant sourcing, and guaranteed long-term availability through Analog Devices' product longevity program.
Supply support for ADP3654ARDZ-R7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, serving industrial, automotive, communications, and healthcare markets since 1965.
The ADP3654ARDZ-R7 belongs to Analog Devices' high-speed power management driver family, engineered specifically for high-frequency, high-efficiency power conversion systems demanding precise timing, thermal resilience, and seamless integration with digital controllers.
FAQ
What is the UVLO behavior of the ADP3654ARDZ-R7, and how does it affect system startup?
The ADP3654ARDZ-R7 features a precise undervoltage lockout with 4.2 V turn-on and 3.9 V turn-off thresholds at 25°C, plus 0.3 V hysteresis. This ensures the driver remains disabled until VDD reaches a safe operating level and stays enabled down to 3.9 V before shutting off-preventing erratic switching during power ramp-up or brownout. The ADP3654ARDZ-R7's UVLO eliminates need for external supervision circuits when used with 3.3 V digital controllers powering higher-voltage stages.
Can the ADP3654ARDZ-R7 drive high gate charge MOSFETs at 1 MHz switching frequency?
Yes-the ADP3654ARDZ-R7 delivers ±4 A peak current and achieves 10 ns rise/fall times into 2.2 nF loads, enabling reliable drive of MOSFETs with QG up to ~120 nC at 1 MHz. For example, driving two IRFS4310Z MOSFETs (QG = 120 nC) at 300 kHz yields ~878 mW total loss in SOIC_N_EP, well within thermal limits. At 1 MHz, careful layout and gate resistance optimization are recommended, but the ADP3654ARDZ-R7's specs support such operation with appropriate thermal design.
Is the ADP3654ARDZ-R7 pin-compatible with other dual MOSFET drivers in SOIC-8 packages?
The ADP3654ARDZ-R7 uses an industry-standard SOIC_N_EP pinout (RD-8-4), matching common footprints like the IR2110 and MIC4422. However, pin functions differ: ADP3654ARDZ-R7 has dedicated PGND (Pin 3) and EPAD (Pin 9), while legacy parts may assign GND to Pin 1 or omit exposed pads. Direct replacement requires verification of input logic levels, UVLO thresholds, and thermal pad connection-so the ADP3654ARDZ-R7 is footprint-compatible but not functionally drop-in without review.
How should the exposed pad (EPAD) of the ADP3654ARDZ-R7 be connected on the PCB?
The EPAD of the ADP3654ARDZ-R7 is electrically connected to the die substrate ground and must be soldered to a large, low-impedance PGND copper pour using multiple thermal vias. It is not internally connected to Pin 3 (PGND), but both must be tied together on the PCB. Proper EPAD connection reduces θJA by ~30%, lowers junction temperature under load, and improves EMI performance-failure to connect EPAD risks thermal runaway and degraded switching behavior in the ADP3654ARDZ-R7.
Does the ADP3654ARDZ-R7 support parallel operation of its two channels, and what layout considerations apply?
Yes-the ADP3654ARDZ-R7 supports parallel operation: INA and INB are tied together, and OUTA and OUTB are shorted to deliver ±8 A peak current and distribute thermal load. Layout must ensure symmetrical trace lengths and impedances for both channels; mismatched routing causes unequal current sharing and localized heating. The ADP3654ARDZ-R7's matched propagation delays (≤2 ns) make it especially suitable for this configuration, but PCB symmetry is essential to realize the full benefit.
ADP3654ARDZ-R7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width) Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Driven Configuration:
- Low-Side
- Channel Type:
- Independent
- Number of Drivers:
- 2
- Gate Type:
- N-Channel MOSFET
- Voltage - Supply:
- 4.5V ~ 18V
- Logic Voltage - VIL, VIH:
- 0.8V, 2V
- Current - Peak Output (Source, Sink):
- 4A, 4A
- Input Type:
- Non-Inverting
- High Side Voltage - Max (Bootstrap):
- -
- Rise / Fall Time (Typ):
- 10ns, 10ns
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC-EP
ADP3654ARDZ-R7 FAQ
1.How can I place an order for ADP3654ARDZ-R7 through Aetrix?
Please submit a Request for Quotation (RFQ) for ADP3654ARDZ-R7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ADP3654ARDZ-R7 reliable?
The price and inventory of ADP3654ARDZ-R7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADP3654ARDZ-R7 is usually 5 days.
3.What payment methods are accepted for ADP3654ARDZ-R7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADP3654ARDZ-R7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ADP3654ARDZ-R7?
ADP3654ARDZ-R7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ADP3654ARDZ-R7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ADP3654ARDZ-R7?
For technical support, including ADP3654ARDZ-R7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADP3654ARDZ-R7 requirements.
6.How does Aetrix verify that ADP3654ARDZ-R7 is sourced from the original manufacturer or authorized distributors?
All ADP3654ARDZ-R7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADP3654ARDZ-R7 meets industry standards.
7.What is the process for return or replacement of ADP3654ARDZ-R7?
All ADP3654ARDZ-R7 units undergo pre-shipment inspection (PSI). If there is an issue with ADP3654ARDZ-R7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ADP3654ARDZ-R7 part is unused and in its original packaging.
Return procedure for ADP3654ARDZ-R7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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