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Infineon Technologies AIMZHN120R020M1TXKSA1

Part No.:
AIMZHN120R020M1TXKSA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-247-4
Datasheet:
AetrixAIMZHN120R020M1TXKSA1.pdf
Description:
SIC_DISCRETE
Quantity:
Payment:
Payment
Shipping:
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Inventory:30

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Product details

Overview

AIMZHN120R020M1TXKSA1 from Infineon is a 1200 V, 100 A SiC trench MOSFET in PG-TO247-4-U05 package with Kelvin source sensing, optimized for high-efficiency HV DC/DC converters and on-board chargers. It delivers RDS(on) = 19 mΩ at 25°C (VGS = 20 V), 1.5 µs short-circuit withstand time, and Crss/Ciss ratio < 0.3% to prevent parasitic turn-on under high dv/dt.

For engineers reviewing the AIMZHN120R020M1TXKSA1 datasheet, AIMZHN120R020M1TXKSA1 pinout, AIMZHN120R020M1TXKSA1 application, or AIMZHN120R020M1TXKSA1 equivalent, key selection criteria include gate drive voltage compatibility (20 V recommended), thermal resistance (Rth(j-c) = 0.27 K/W), and unipolar gate driving capability enabled by high VGS(th) and low Crss.

Technical Context

This Gen1p CoolSiC™ device uses trench-gate SiC technology with .XT die attach for enhanced thermal performance and a dedicated Kelvin source terminal to eliminate source inductance effects during switching. Its gate threshold voltage (3.7–5.1 V) and ultra-low Crss (7 pF) enable robust immunity to Miller-induced false turn-on in high-frequency, high-voltage topologies.

The MOSFET supports unipolar 0 V/20 V gate drive, eliminating negative bias requirements. Its total gate charge (82 nC) and low Coss (126 pF) reduce driver losses and enable >100 kHz operation in isolated bidirectional DC/DC stages while maintaining low Eon + Eoff = 389 µJ at 25°C.

Key Specifications

ParameterValue and Actual Design Meaning
VDSS1200 V - Supports 800 V bus systems with ≥50% voltage margin for transient overvoltage handling in automotive traction inverters and EV charging.
RDS(on)19 mΩ @ 25°C - Enables <1.5 W conduction loss at 100 A, critical for high-power density OBC and auxiliary DC/DC designs.
IDDC100 A @ TC = 25°C - Sustains full rated current with minimal heatsink volume when mounted on copper baseplates.
QG(tot)82 nC - Reduces gate driver power consumption and allows use of lower-cost 2-A peak drivers in 10–50 kW systems.
Etot389 µJ @ 25°C - Lowers switching losses by >35% vs. comparable Si IGBTs, enabling air-cooled 3.3 kW/kW power density in onboard chargers.
tSC1.5 µs @ VGS = 20 V - Provides deterministic fault-clearing window for digital protection circuits without external desaturation detection.
Rth(j-c)0.27 K/W - Delivers junction-to-case thermal path equivalent to discrete SiC modules, supporting direct baseplate mounting in harsh environments.

Pinout & Package

PG-TO247-4-U05 package with isolated Kelvin source terminal for accurate gate control and minimized source loop inductance. Four-terminal layout enables precise RDS(on) measurement and stable high-speed switching.

Pin/TerminalCircuit RoleDesign Meaning
1 – DrainMain power drain connectionHigh-current path for main switching node; electrically tied to metal tab for thermal conduction.
2 – SourceMain power source returnCarries full load current; must be routed with low-inductance layout to minimize voltage spikes during turn-off.
3 – Kelvin SenseSource reference for gate driverProvides gate driver with clean source potential, decoupling gate loop from power loop to suppress Miller coupling.
4 – GateControl inputReceives 20 V turn-on signal; requires low-impedance gate resistor (2 Ω typical) to control dV/dt and EMI.

Key Features

FeatureDesign Value
Kelvin source sensingEliminates source inductance impact on gate control, enabling stable 100+ kHz switching without oscillation or false turn-on.
Gen1p chip technologyImproves RDS(on) × QG figure-of-merit by 22% vs. prior generation, reducing combined conduction + switching losses.
Crss/Ciss ratio < 0.3%Prevents parasitic turn-on under dv/dt > 50 V/ns, allowing unipolar 0 V/20 V gate drive without negative bias circuitry.
.XT die attachReduces thermal resistance by 18% vs. standard solder die attach, improving long-term reliability under thermal cycling.
AEC-Q101 qualificationValidated for automotive-grade temperature cycling (-55°C to 175°C), vibration, and humidity testing per ISO/TS 16949.

Applications

On-Board Charger (OBC)High-Voltage DC/DC Converter

Use Scenario: Bidirectional 11 kW OBC in BEV platforms converting AC grid to 400/800 V battery with PFC + CLLC stages.

IC Role / Device Role / Timing Role: Primary-side high-side switch in CLLC resonant converter operating at 100–300 kHz.

Use Value: 389 µJ total switching energy enables >97% peak efficiency and eliminates liquid cooling in compact under-hood installations.

Use Scenario: 3.3 kW isolated DC/DC stage stepping down 800 V battery to 12 V/48 V auxiliary supply in commercial EVs.

IC Role / Device Role / Timing Role: High-side synchronous rectifier in phase-shifted full-bridge topology with ZVS turn-on.

Use Value: 19 mΩ RDS(on) and 0.27 K/W Rth(j-c) sustain 100 A continuous current with <75°C junction rise on passive heatsinks.

Auxiliary Traction InverterIndustrial HV Rectifier Stack

Use Scenario: 25 kW auxiliary inverter powering HVAC compressors and steering pumps in autonomous shuttle buses.

IC Role / Device Role / Timing Role: Low-side switch in three-phase inverter leg with active short-circuit protection.

Use Value: 1.5 µs short-circuit withstand time enables deterministic hardware-level fault response without software intervention.

Use Scenario: 1500 V industrial rectifier module for medium-voltage motor drives and renewable energy inverters.

IC Role / Device Role / Timing Role: Series-connected blocking element in multi-level diode-clamped topology.

Use Value: 7.07 mm minimum creepage distance meets IEC 61800-5-1 reinforced insulation requirements for 1200 V systems.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage SiC MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IXYS IXTH120N10S11000 V rating, higher RDS(on) (22 mΩ), no Kelvin source, TO-247-3L packageLimited to 650–800 V systems; requires negative gate bias for reliable dv/dt immunitySelect only if system voltage ≤ 800 V and cost sensitivity outweighs efficiency gains.
Wolfspeed C3M0065120KSame 1200 V/100 A rating, identical 4-pin TO247 package, but RDS(on) = 65 mΩ (typ.)Higher conduction loss limits use to <50 A average current; better suited for soft-switched topologiesPrefer for lower-frequency (<50 kHz), high-reliability industrial UPS where gate drive simplicity is prioritized.

Compared with IXTH120N10S1 and C3M0065120K, AIMZHN120R020M1TXKSA1 offers the lowest RDS(on) × QG FOM and integrated Kelvin sensing-enabling higher power density and simpler gate drive in automotive OBC and DC/DC converters requiring AEC-Q101 compliance.

Availability

AIMZHN120R020M1TXKSA1 is available at Aetrix Electronics and suitable for on-board chargers, high-voltage DC/DC converters, and auxiliary traction inverters requiring stable component supply across automotive production lifecycles.

Supply support for AIMZHN120R020M1TXKSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions for automotive, industrial, and renewable energy markets.

This part belongs to the CoolSiC™ Gen1p high-voltage MOSFET product line, engineered specifically for automotive-grade 800 V battery systems and high-efficiency bidirectional power conversion in electrified transportation.

FAQ

What gate drive voltage is required for reliable operation?

The AIMZHN120R020M1TXKSA1 requires a nominal +20 V turn-on voltage and 0 V turn-off voltage. This unipolar drive scheme is enabled by its high VGS(th) (3.7–5.1 V) and ultra-low Crss (7 pF), eliminating need for negative bias while ensuring immunity to parasitic turn-on under high dv/dt conditions up to 100 V/ns.

Does this MOSFET include an integrated body diode, and what is its reverse recovery behavior?

Yes, it features a co-packaged SiC body diode with VSD = 3.9 V at 43 A and 25°C. Its forward recovery charge Qfr is 260 nC at 25°C, and exhibits negligible reverse recovery current-enabling zero-current switching in resonant topologies without snubbers or additional diodes.

How is thermal performance validated, and what is the maximum allowable case temperature?

Thermal resistance Rth(j-c) is characterized at 0.27 K/W (typ.) and verified across -55°C to 175°C junction range. The device supports continuous operation up to TC = 100°C, delivering 71 A DC current at that condition-validated per AEC-Q101 thermal cycling and steady-state power dissipation tests.

Is Kelvin source connection mandatory, and how should it be implemented?

Yes-the Kelvin source terminal (Pin 3) must be connected directly to the gate driver's source reference, separate from the main source (Pin 2). This decouples gate loop inductance from power loop, preventing voltage overshoot and ensuring stable 20 V gate control during fast switching transitions above 50 V/ns.

AIMZHN120R020M1TXKSA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
TO-247-4
Packaging:
Tube
Product Status:
Active
FET Type:
N-Channel
Technology:
SiCFET (Silicon Carbide)
Drain to Source Voltage (Vdss):
1200 V
Current - Continuous Drain (Id) @ 25°C:
100A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
18V, 20V
Rds On (Max) @ Id, Vgs:
25mOhm @ 43A, 20V
Vgs(th) (Max) @ Id:
5.1V @ 13.7mA
Gate Charge (Qg) (Max) @ Vgs:
82 nC @ 20 V
Vgs (Max):
+23V, -5V
Input Capacitance (Ciss) (Max) @ Vds:
2667 pF @ 800 V
FET Feature:
-
Power Dissipation (Max):
429W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Through Hole
Supplier Device Package:
PG-TO247-4-14

AIMZHN120R020M1TXKSA1 FAQ

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The price and inventory of AIMZHN120R020M1TXKSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AIMZHN120R020M1TXKSA1 is usually 5 days.

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5.How can I obtain technical support or documentation for AIMZHN120R020M1TXKSA1?

For technical support, including AIMZHN120R020M1TXKSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AIMZHN120R020M1TXKSA1 requirements.

6.How does Aetrix verify that AIMZHN120R020M1TXKSA1 is sourced from the original manufacturer or authorized distributors?

All AIMZHN120R020M1TXKSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AIMZHN120R020M1TXKSA1 meets industry standards.

7.What is the process for return or replacement of AIMZHN120R020M1TXKSA1?

All AIMZHN120R020M1TXKSA1 units undergo pre-shipment inspection (PSI). If there is an issue with AIMZHN120R020M1TXKSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The AIMZHN120R020M1TXKSA1 part is unused and in its original packaging.

Return procedure for AIMZHN120R020M1TXKSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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