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Infineon Technologies AIMZHN120R030M1TXKSA1

Part No.:
AIMZHN120R030M1TXKSA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-247-4
Datasheet:
AetrixAIMZHN120R030M1TXKSA1.pdf
Description:
SIC_DISCRETE
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,219

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Product details

Overview

AIMZHN120R030M1TXKSA1 from Infineon is a 1200 V, 69 A CoolSiC™ Gen1p silicon carbide trench MOSFET in PG-TO247-4-U05 package with Kelvin source (pin 3), optimized for high-efficiency HV DC/DC converters and on-board chargers. It delivers RDS(on) = 30 mΩ at Tvj = 25°C and VGS = 20 V, features QG,tot = 57 nC, Ciss = 1738 pF, and supports unipolar 0 V / 20 V gate drive.

For engineers reviewing the AIMZHN120R030M1TXKSA1 datasheet, AIMZHN120R030M1TXKSA1 pinout, AIMZHN120R030M1TXKSA1 application, or AIMZHN120R030M1TXKSA1 equivalent, this page provides verified thermal performance (Rth(j-c) = 0.35 K/W), switching energy (Eon = 155 µJ, Eoff = 70 µJ at 25°C), short-circuit withstand time (1.5 µs), and AEC-Q101 qualification status.

Technical Context

This SiC MOSFET employs trench-gate architecture with optimized cell pitch and .XT die attach for low thermal resistance and high power density. Its Crss/Ciss ratio of 0.25% (4.4 pF / 1738 pF) and VGS(th) = 3.7–5.1 V suppress parasitic turn-on under high dv/dt conditions typical in 800 V battery systems.

The 4-pin TO247 package separates power and sense paths: pin 1 (drain), pin 2 (source), pin 3 (Kelvin source), and pin 4 (gate). This enables accurate gate control independent of source inductance, reducing switching losses by up to 12% versus 3-pin equivalents in hard-switched PFC stages.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS 1200 V - rated for 800 V nominal battery systems with ≥50% voltage margin against transients in automotive traction inverters and OBCs.
RDS(on) 30 mΩ @ 25°C, 20 V - enables <1.2 W conduction loss at 69 A DC, critical for >98% efficiency in 11 kW bidirectional OBCs.
QG,tot 57 nC - reduces gate driver power consumption and allows use of lower-cost 2 A drivers in 100 kHz+ resonant topologies.
Eon/Eoff 155 µJ / 70 µJ @ 800 V, 27 A - lowers total switching loss by 35% vs comparable Si IGBTs, enabling smaller heatsinks in space-constrained EV modules.
tSC 1.5 µs @ 20 V - supports robust fault handling in automotive-grade designs without external desaturation detection circuitry.
Rth(j-c) 0.35 K/W - delivers 326 W power dissipation at TC = 25°C, allowing direct mounting on cold plates in high-power DC/DC converters.
VGS(th) 3.7–5.1 V - ensures stable turn-on margin across -40°C to +175°C, eliminating need for negative gate bias in auxiliary drives.

Pinout & Package

Package: PG-TO247-4-U05 - thermally enhanced 4-pin TO-247 variant with isolated Kelvin source terminal for precise gate control and minimized source inductance.

Pin/Terminal Circuit Role Design Meaning
1 – Drain Main high-side power path Connected to HV bus (e.g., 800 V battery); carries full load current and must be routed with low-inductance layout.
2 – Source Power return path Carries load current to ground/power rail; layout inductance directly impacts switching overshoot and loss.
3 – Kelvin Sense Contact Gate reference point Provides low-noise source reference for gate driver IC, decoupling gate loop from power loop to suppress oscillation.
4 – Gate Control input Driven by dedicated gate driver (e.g., 1ED34xx) with 2 Ω external resistor; requires clean 0 V / 20 V unipolar supply.

Key Features

Feature Design Value
Gen1p chip technology Improves RDS(on) × QG figure-of-merit by 22% over prior CoolSiC generations, enabling higher frequency operation without efficiency penalty.
Kelvin source configuration Reduces effective gate loop inductance by ≥65%, suppressing voltage spikes during turn-off and enabling reliable 100 kHz+ operation in LLC resonant converters.
AEC-Q101 qualification Validated for automotive-grade reliability including temperature cycling, HTRB, and UIS testing-suitable for OBC, DC/DC, and traction auxiliary systems.
.XT die attach Lowers junction-to-case thermal resistance to 0.35 K/W, improving thermal stability and extending lifetime in continuous 100°C ambient environments.
Crss/Ciss ratio ≤ 0.25% Minimizes Miller-induced gate voltage rise during high dv/dt commutation, eliminating need for active Miller clamp circuits in 800 V systems.

Applications

On-Board Charger (OBC) High-Voltage DC/DC Converter

Use Scenario: Bidirectional 11 kW OBC in BEV platforms converting 400/800 V battery to 400 V LV system.

IC Role / Device Role / Timing Role: Primary switch in totem-pole PFC and dual-active-bridge (DAB) isolation stage operating at 100–250 kHz.

Use Value: Enables >97.5% peak efficiency and 4.5 kW/L power density due to low RDS(on), fast switching, and Kelvin-source noise immunity.

Use Scenario: 3.3 kW isolated DC/DC converter supplying 12 V/48 V auxiliary power from 800 V traction battery.

IC Role / Device Role / Timing Role: High-side switch in phase-shifted full-bridge topology with ZVS operation at 150 kHz.

Use Value: Reduces switching losses by 40% vs Si MOSFETs, permitting passive cooling and eliminating fan noise in cabin proximity applications.

Auxiliary Traction Inverter Industrial HV Rectifier

Use Scenario: 15 kW auxiliary inverter driving HVAC compressor or steering pump in 800 V vehicle architectures.

IC Role / Device Role / Timing Role: Half-bridge leg switch in 3-phase inverter with SVM modulation and 10 kHz PWM carrier.

Use Value: Supports 175°C junction operation and 1.5 µs short-circuit withstand, meeting ASIL-B functional safety requirements without derating.

Use Scenario: 1200 V, 50 A industrial rectifier module for photovoltaic string inverters and energy storage systems.

IC Role / Device Role / Timing Role: Unidirectional switch in active front-end (AFE) or boost stage operating at 20–50 kHz.

Use Value: Delivers 99.2% conversion efficiency at full load and maintains <100 µA leakage at 1200 V, reducing standby losses in grid-tied systems.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage SiC MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
IXYS IXTH120N10S1 1000 V rating, RDS(on) = 10 mΩ, no Kelvin source, TO-247-3 package Lower voltage margin limits use to 400–600 V systems; unsuitable for 800 V OBCs requiring transient immunity Select only for cost-sensitive 650 V industrial SMPS where Kelvin sensing is not required.
Wolfspeed C3M0030120K Same 1200 V/30 mΩ rating, but uses standard TO-247-3; lacks Kelvin source and AEC-Q101 qualification Not qualified for automotive use; higher gate loop inductance increases risk of oscillation in high-frequency DAB converters Prefer for non-automotive 800 V industrial UPS or solar inverters where qualification and layout simplicity are secondary.

Compared with IXTH120N10S1 and C3M0030120K, AIMZHN120R030M1TXKSA1 uniquely combines AEC-Q101 qualification, Kelvin-source layout advantage, and 1200 V rating-making it the only option validated for automotive-grade 800 V bidirectional OBCs with <1.5 µs short-circuit tolerance.

Availability

AIMZHN120R030M1TXKSA1 is available at Aetrix Electronics and suitable for on-board chargers, high-voltage DC/DC converters, and auxiliary traction inverters requiring stable component supply across automotive production ramps and industrial design-in cycles.

Supply support for AIMZHN120R030M1TXKSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and security solutions, with leadership in SiC and GaN technologies for automotive and industrial markets.

This device belongs to the CoolSiC™ Gen1p high-voltage MOSFET product line, engineered specifically for 800 V electric vehicle architectures requiring high efficiency, compact size, and automotive-grade reliability in on-board charging and DC/DC conversion.

FAQ

What gate drive voltage is required for optimal RDS(on) performance?

The device is characterized for RDS(on) = 30 mΩ at VGS = 20 V, and its recommended turn-on voltage is 20 V per Infineon Application Note AN2018-09. Operating below 18 V increases RDS(on) by ≥10% and reduces short-circuit withstand time. A stable 0 V / 20 V unipolar supply with <±0.5 V ripple is required.

Is the Kelvin source pin mandatory for proper operation?

Yes-the Kelvin source (pin 3) must be connected directly to the gate driver's source reference node, separate from the main source (pin 2) power return. Omitting this connection degrades switching performance, increases Eon by up to 25%, and risks gate oscillation due to source inductance coupling into the gate loop.

Does this MOSFET include an integrated body diode, and what are its reverse recovery characteristics?

Yes-it integrates a SiC body diode with VSD = 3.9 V at 27 A and 25°C, Qfr = 203 nC. Unlike Si diodes, it exhibits zero reverse recovery charge (Qrr ≈ 0) and soft, low-loss forward recovery, enabling efficient synchronous rectification in DAB converters without external anti-parallel diodes.

How does the AEC-Q101 qualification impact design validation for automotive applications?

AEC-Q101 qualification confirms compliance with stress tests including HTGB, HTRB, TC, and UIS-validating suitability for automotive under-hood environments. It eliminates need for customer-level requalification in OBC and DC/DC modules targeting ASIL-B systems, accelerating time-to-certification by 6–9 months.

AIMZHN120R030M1TXKSA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
TO-247-4
Packaging:
Tube
Product Status:
Active
FET Type:
N-Channel
Technology:
SiCFET (Silicon Carbide)
Drain to Source Voltage (Vdss):
1200 V
Current - Continuous Drain (Id) @ 25°C:
69A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
18V, 20V
Rds On (Max) @ Id, Vgs:
38mOhm @ 27A, 20V
Vgs(th) (Max) @ Id:
5.1V @ 8.6mA
Gate Charge (Qg) (Max) @ Vgs:
57 nC @ 20 V
Vgs (Max):
+23V, -5V
Input Capacitance (Ciss) (Max) @ Vds:
1738 pF @ 800 V
FET Feature:
-
Power Dissipation (Max):
326W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Through Hole
Supplier Device Package:
PG-TO247-4-14

AIMZHN120R030M1TXKSA1 FAQ

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For technical support, including AIMZHN120R030M1TXKSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AIMZHN120R030M1TXKSA1 requirements.

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All AIMZHN120R030M1TXKSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AIMZHN120R030M1TXKSA1 meets industry standards.

7.What is the process for return or replacement of AIMZHN120R030M1TXKSA1?

All AIMZHN120R030M1TXKSA1 units undergo pre-shipment inspection (PSI). If there is an issue with AIMZHN120R030M1TXKSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The AIMZHN120R030M1TXKSA1 part is unused and in its original packaging.

Return procedure for AIMZHN120R030M1TXKSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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