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Infineon Technologies AIMZHN120R120M1TXKSA1

Part No.:
AIMZHN120R120M1TXKSA1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-247-4
Datasheet:
AetrixAIMZHN120R120M1TXKSA1.pdf
Description:
SIC_DISCRETE
Quantity:
Payment:
Payment
Shipping:
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Inventory:3,653

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Product details

Overview

AIMZHN120R120M1TXKSA1 from Infineon is a 1200 V, 22 A CoolSiC™ silicon carbide trench MOSFET in PG-TO247-4-U05 package with Kelvin source (4-pin), optimized for high-voltage automotive on-board chargers and DC/DC converters. It features RDS(on) = 117–234 mΩ (25–175°C), VGS(th) = 3.7–5.1 V, Ciss = 458 pF, Eon/Eoff = 44/36 µJ at 800 V, and AEC-Q101 qualification.

For engineers reviewing the AIMZHN120R120M1TXKSA1 datasheet, AIMZHN120R120M1TXKSA1 pinout, AIMZHN120R120M1TXKSA1 application, or AIMZHN120R120M1TXKSA1 equivalent, key selection criteria include unipolar gate drive compatibility (VGS(on) = 20 V), low Crss/Ciss ratio (0.0022), sense-pin-enabled switching optimization, and HV creepage ≥7.07 mm for 1200 V systems.

Technical Context

This SiC MOSFET employs Gen1p trench technology with XT die attach for enhanced thermal resistance (Rth(j-c) = 0.87–1.13 K/W) and reduced switching losses. Its high VGS(th) (min 3.7 V) and ultra-low Crss (1 pF) suppress parasitic turn-on under high dv/dt, enabling robust unipolar gate driving without negative bias.

The 4-pin configuration separates power and Kelvin source paths to eliminate source inductance impact on gate control, while low total gate charge (QGtot = 18 nC) and fast switching (td(on) = 7 ns, tf = 17 ns) support >100 kHz operation in high-density power stages.

Key Specifications

ParameterValue and Actual Design Meaning
VDSS1200 V - supports 800 V DC bus designs with 1.5× voltage margin for transient overvoltage in EV traction auxiliary systems
RDS(on)117 mΩ (25°C) - enables <1.5 W conduction loss at 22 A, critical for thermally constrained OBC modules
Crss/Ciss0.0022 - minimizes Miller-induced gate oscillation, allowing stable 20 V single-supply gate drive
Eon + Eoff80 µJ @ 800 V - reduces switching loss by >40% vs. comparable Si IGBTs, lowering heatsink mass in DC/DC converters
tSC1.5 µs @ 20 V - provides deterministic short-circuit protection window for fault-handling logic in automotive-grade inverters
Creepage distance7.07 mm - satisfies reinforced insulation requirements per IEC 60664-1 for 1200 V working voltage in onboard systems
QGtot18 nC - lowers gate driver power consumption and allows use of compact 1–2 W isolated gate supplies

Pinout & Package

Package: PG-TO247-4-U05 - 4-pin through-hole package with isolated Kelvin source terminal, optimized for low-inductance high-frequency switching and thermal performance via XT die attach.

Pin/TerminalCircuit RoleDesign Meaning
1 – DrainHigh-side power output nodeConnected to HV DC bus (e.g., 800 V battery); carries full load current and switching transients
2 – SourceMain power return pathCarries full load current to ground/power rail; layout must minimize inductance to reduce voltage overshoot
3 – Kelvin SenseReference point for gate controlProvides low-noise source potential feedback to gate driver, eliminating source inductance impact on VGS accuracy
4 – GateControl inputReceives 20 V turn-on signal; requires low-impedance path to driver IC due to QGtot = 18 nC

Key Features

FeatureDesign Value
Gen1p SiC trench cellImproves RDS(on) × A figure-of-merit by 15% vs. prior generation, enabling smaller die size without sacrificing conduction loss
20 V recommended VGS(on)Reduces RDS(on) by ~8% at 100°C vs. 18 V drive, directly improving efficiency in high-temp OBC operation
Sense pin (Kelvin source)Enables precise gate-source voltage regulation under high di/dt, preventing false turn-off during fast switching transitions
AEC-Q101 qualificationValidated for automotive under-hood environments including temperature cycling, humidity, and mechanical shock per Grade 0 (−40 to 175°C)
Low Coss (25 pF)Reduces capacitive turn-off energy loss and enables faster zero-voltage switching (ZVS) initiation in resonant topologies

Applications

On-Board Charger (OBC)High-Voltage DC/DC Converter

Use Scenario: Bidirectional AC/DC and DC/DC conversion in 800 V BEV architectures, operating at 100–200 kHz switching frequency.

IC Role / Device Role / Timing Role: Primary high-side switch in totem-pole PFC and isolated dual-active-bridge (DAB) stages.

Use Value: Low Eon/Eoff (80 µJ) and 1.5 µs short-circuit withstand time enable compact magnetics and deterministic fault response in ISO 15118-compliant charging systems.

Use Scenario: 800 V to 48 V or 12 V conversion for vehicle domain controllers, ADAS ECUs, and infotainment subsystems.

IC Role / Device Role / Timing Role: High-side switch in phase-shifted full-bridge or LLC resonant converter primary side.

Use Value: 7.07 mm creepage and AEC-Q101 rating ensure compliance with automotive functional safety (ISO 26262 ASIL-B) and HV isolation standards.

Auxiliary Traction InverterIndustrial HV Rectifier Stack

Use Scenario: Compact auxiliary inverter powering HVAC compressors or steering pumps in 400/800 V platforms.

IC Role / Device Role / Timing Role: Half-bridge switch in 3-phase inverter leg, driven by isolated gate drivers with 20 V supply.

Use Value: Kelvin source pin eliminates source inductance error, ensuring accurate gate control during 100+ A peak currents and >50 kHz PWM.

Use Scenario: High-efficiency 1200 V rectification in industrial UPS, solar string inverters, and EVSE charging stations.

IC Role / Device Role / Timing Role: Unidirectional switch in active rectifier or synchronous buck stage replacing Si diodes.

Use Value: Body diode VSD = 3.9 V (25°C) and Qfr = 132 nC enable lower forward loss and reduced reverse recovery stress vs. Si FRDs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage SiC MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IXYS IXFN120N120T2RDS(on) = 120 mΩ, no Kelvin source, TO-247-3L package, higher Ciss (520 pF)Lacks sense pin; requires careful gate loop layout to avoid instability at >100 kHzSelect when cost sensitivity outweighs need for highest switching fidelity in space-constrained OBCs
Wolfspeed C3M0120120KRDS(on) = 120 mΩ, Kelvin source, same 4-pin TO247, but VGS(th) = 2.5–4.0 V (lower noise margin)Lower VGS(th) increases risk of spurious turn-on in noisy automotive environmentsSelect only with robust gate driver filtering and negative turn-off bias (−5 V) for mission-critical traction auxiliaries

Compared with IXFN120N120T2 and C3M0120120K, AIMZHN120R120M1TXKSA1 delivers superior dv/dt immunity (Crss/Ciss = 0.0022), tighter VGS(th) distribution (3.7–5.1 V), and AEC-Q101 validation-making it optimal for automotive OBCs where reliability and unipolar drive simplicity are mandatory.

Availability

AIMZHN120R120M1TXKSA1 is available at Aetrix Electronics and suitable for on-board chargers, high-voltage DC/DC converters, and auxiliary traction inverters requiring stable component supply across automotive production lifecycles.

Supply support for AIMZHN120R120M1TXKSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and security solutions, with global R&D and manufacturing infrastructure.

This device belongs to the CoolSiC™ 1200 V trench MOSFET product line, engineered specifically for automotive and industrial high-efficiency, high-power-density systems operating above 600 V DC bus.

FAQ

What gate drive voltage is required for reliable operation?

AIMZHN120R120M1TXKSA1 requires VGS(on) = 20 V and VGS(off) = 0 V per Infineon's recommended values. This unipolar drive leverages its high VGS(th) (3.7–5.1 V) and low Crss to prevent parasitic turn-on. Using <18 V increases RDS(on) by up to 8% at 100°C, raising conduction loss and thermal stress.

Does this MOSFET include an integrated body diode, and how does it perform?

Yes-it features a monolithic SiC body diode with VSD = 3.9 V at 7 A (25°C) and Qfr = 132 nC. Unlike silicon diodes, it exhibits no reverse recovery tail, enabling efficient synchronous rectification in DAB converters. Its soft reverse recovery reduces EMI and eliminates snubber requirements in hard-switched topologies.

How is the Kelvin source pin used in PCB layout?

The Kelvin source (Pin 3) must be routed separately from the main source (Pin 2) to the gate driver's reference node-never tied together on the PCB. This isolates gate control from power-loop voltage drop, ensuring accurate VGS regulation during high di/dt events. A dedicated low-inductance trace <5 mm long is recommended between Pin 3 and driver ground.

Is this part qualified for automotive use, and what standards apply?

Yes-AIMZHN120R120M1TXKSA1 is fully qualified per AEC-Q101 for discrete semiconductors, including stress tests for temperature cycling (−40 to 150°C), humidity, and mechanical shock. It meets Grade 0 (−40 to 175°C junction) requirements and supports functional safety development per ISO 26262 ASIL-B in OBC and DC/DC applications.

AIMZHN120R120M1TXKSA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
TO-247-4
Packaging:
Tube
Product Status:
Active
FET Type:
N-Channel
Technology:
SiCFET (Silicon Carbide)
Drain to Source Voltage (Vdss):
1200 V
Current - Continuous Drain (Id) @ 25°C:
22A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
18V, 20V
Rds On (Max) @ Id, Vgs:
150mOhm @ 7A, 20V
Vgs(th) (Max) @ Id:
5.1V @ 2.2mA
Gate Charge (Qg) (Max) @ Vgs:
18 nC @ 20 V
Vgs (Max):
+23V, -5V
Input Capacitance (Ciss) (Max) @ Vds:
458 pF @ 800 V
FET Feature:
-
Power Dissipation (Max):
133W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Through Hole
Supplier Device Package:
PG-TO247-4-14

AIMZHN120R120M1TXKSA1 FAQ

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Please submit a Request for Quotation (RFQ) for AIMZHN120R120M1TXKSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of AIMZHN120R120M1TXKSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AIMZHN120R120M1TXKSA1 is usually 5 days.

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5.How can I obtain technical support or documentation for AIMZHN120R120M1TXKSA1?

For technical support, including AIMZHN120R120M1TXKSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AIMZHN120R120M1TXKSA1 requirements.

6.How does Aetrix verify that AIMZHN120R120M1TXKSA1 is sourced from the original manufacturer or authorized distributors?

All AIMZHN120R120M1TXKSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AIMZHN120R120M1TXKSA1 meets industry standards.

7.What is the process for return or replacement of AIMZHN120R120M1TXKSA1?

All AIMZHN120R120M1TXKSA1 units undergo pre-shipment inspection (PSI). If there is an issue with AIMZHN120R120M1TXKSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The AIMZHN120R120M1TXKSA1 part is unused and in its original packaging.

Return procedure for AIMZHN120R120M1TXKSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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