Diodes Incorporated AP25810LQDFZ20-13

Overview

AP25810LQ from Diodes Incorporated is a USB Type-C® downstream-facing port (DFP) controller with integrated 3A high-side power switch, CC line monitoring, VCONN generation, and load-detection logic. It supports USB 2.0/3.1 host ports, identifies audio/debug accessories, and delivers 1.7A or 3.4A programmable current limits with 30mΩ R_DS(ON). Used in notebook sleep-charging circuits, docking stations, and wall chargers.

For engineers reviewing the AP25810LQ datasheet, AP25810LQ pinout, AP25810LQ application, or AP25810LQ equivalent, this device requires attention to CC polarity detection timing, LD_DET hysteresis (±125mA), FAULT deglitching (5.5–10.7ms), and triple-supply sequencing (IN1/IN2/AUX).

Technical Context

The AP25810LQ implements dual-path analog CC monitoring with dedicated charge-pump-based VCONN switching and independent current-limit control for VBUS and VCONN rails. Its REF/REF_RTN precision reference enables ±7.1% ILIM accuracy across temperature.

It features three UVLO thresholds (IN1: 4.1V, IN2: 4.1V, AUX: 2.75V), open-drain status outputs with 250mV VOL at 1mA sink, and thermal shutdown at +135°C (OUT/VCONN limit) and +155°C (full device shutdown), both with +20°C hysteresis.

Key Specifications

Pinout & Package

AP25810LQ uses a RoHS-compliant W-QFN3040-20 (Type A1) package with 3.0mm × 4.0mm footprint and exposed thermal pad connected to GND.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar USB Type-C DFP controller applications.

Compared with TI TUSB546A and Renesas uPD720210, the AP25810LQ uniquely combines triple-supply operation, LD_DET–driven multi-port power coordination, and AEC-Q100 qualification-making it the only option supporting automotive-grade, thermally constrained, and multi-port USB-C host designs with minimal external components.

Availability

AP25810LQ is available at Aetrix Electronics and suitable for notebook sleep-charging circuits, USB-C docking stations, and automotive infotainment hubs requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for AP25810LQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal ICs for power management, signal integrity, and connectivity applications.

The AP25810LQ belongs to Diodes' USB Type-C interface product line, engineered specifically for robust, low-quiescent-current DFP implementations in space-constrained and thermally demanding host systems.

FAQ

What is the purpose of the REF and REF_RTN pins?

REF and REF_RTN form a precision current reference interface that sets the AP25810LQ's VBUS current-limit threshold. A 100kΩ ±1% resistor between them generates a 0.8V reference, enabling ±7.1% ILIM accuracy across temperature. This eliminates calibration overhead and external DACs required by competing controllers.

How does the LD_DET output function in multi-port systems?

LD_DET asserts low when the AP25810LQ detects >1.95A load current on its VBUS output. In multi-port systems, multiple LD_DET signals feed a central power manager that throttles non-critical ports to prevent exceeding total system current budget-enabling dynamic allocation without firmware intervention.

Can the AP25810LQ operate without an IN2 supply?

Yes. When IN2 is shorted to IN1, the device uses the same supply for both VBUS and VCONN functions. However, this disables independent VCONN regulation and reduces flexibility in systems where VCONN must remain active even if VBUS is disabled-such as during cable enumeration before UFP attachment.

What thermal considerations apply to the W-QFN3040-20 package?

The W-QFN3040-20 package has R_θJA = 40°C/W and R_θJC = 5°C/W. To maintain safe junction temperature below +155°C under 3A load, the PCB must provide ≥200mm² exposed copper connected to the thermal pad, with ≥2 vias to inner ground planes. Derating to 2.2A is recommended above +85°C ambient.