Microchip Technology APT2X101D30J
- Part No.:
- APT2X101D30J
- Manufacturer:
- Microchip Technology
- Category:
- Diode Arrays
- Package:
- SOT-227-4, miniBLOC
- Datasheet:
-
APT2X101D30J.pdf
- Description:
- DIODE MODULE GP 300V 100A ISOTOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
APT2X101D30J from Microsemi is an ultrafast soft recovery rectifier diode in a dual-die SOT-227 (ISOTOP®) package, rated for 300 V DC reverse voltage and 100 A average forward current at TC = 115°C with 0.5 duty cycle. It delivers low forward voltage (1.4 V typ. at 100 A), soft reverse recovery (trr = 36 ns typ. at 100 A, −200 A/μs, 25°C), and low leakage (<1 μA at rated VR). It serves as an anti-parallel or freewheeling diode in high-frequency motor controllers and industrial inverters.
For engineers reviewing the APT2X101D30J datasheet, APT2X101D30J pinout, APT2X101D30J application, or APT2X101D30J equivalent, key selection criteria include soft recovery behavior under high di/dt, thermal resistance (0.42 °C/W junction-to-case), dual-anode/dual-cathode terminal configuration, and compatibility with high-power switching topologies requiring low noise and minimal snubber loss.
Technical Context
This device integrates two independent 300 V, 100 A ultrafast diode dies in a single SOT-227 metal package with isolated terminals - Anode 1, Anode 2, Cathode 1, Cathode 2 - enabling parallel or anti-parallel configurations without external interconnects. Its soft recovery minimizes voltage overshoot and EMI during commutation in IGBT-based inverters.
Designed for operation up to 150°C junction temperature, it maintains low Qrr (36 nC typ. at 100 A, −200 A/μs, 25°C) and low IRM (<1 μA at 300 V, 25°C), supporting high-efficiency, high-density power conversion where thermal management and switching losses are critical.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VR (DC Reverse Voltage) | 300 V - Maximum continuous blocking voltage across each die; defines usable bus voltage headroom in 200–250 VDC systems. |
| IF(AV) (Avg Forward Current) | 100 A at TC = 115°C, 0.5 duty - Sustained conduction capability per die; enables compact heatsinking in high-current motor drives. |
| trr (Reverse Recovery Time) | 36 ns typ. at IF = 100 A, diF/dt = −200 A/μs, 25°C - Fast, soft recovery reduces switching loss and RFI in 10–20 kHz IGBT inverters. |
| VF (Forward Voltage) | 1.4 V typ. at IF = 100 A - Low conduction loss improves system efficiency; contributes to cooler operation vs. standard fast rectifiers. |
| RθJC (Junction-to-Case) | 0.42 °C/W - Enables direct mounting to heatsink; supports >180 W dissipation per die before exceeding 150°C TJ. |
| Qrr (Reverse Recovery Charge) | 36 nC typ. at IF = 100 A, diF/dt = −200 A/μs, 25°C - Low stored charge reduces turn-off stress on paired IGBTs and snubber energy. |
| IRM (Reverse Leakage) | <1 μA at VR = 300 V, 25°C - Ensures stable blocking under high-temperature, high-voltage bias in UPS and induction heating. |
Pinout & Package
SOT-227 (ISOTOP®) metal package with four isolated terminals: Anode 1, Anode 2, Cathode 1, Cathode 2 - configured for dual-diode operation in parallel or anti-parallel arrangements. Mounting via M4 hex nuts; thermal path optimized through baseplate contact.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode 1 | First diode anode | Enables independent connection of first die; used for anti-parallel pairing with one IGBT leg. |
| Anode 2 | Second diode anode | Electrically isolated from Anode 1; supports dual-leg or paralleled conduction paths. |
| Cathode 1 | First diode cathode | Completes first diode path; routed separately to avoid shared parasitic inductance. |
| Cathode 2 | Second diode cathode | Isolated return node; allows differential layout for reduced EMI in multi-phase inverters. |
Key Features
| Feature | Design Value |
|---|---|
| Ultrafast soft recovery | trr = 36 ns + soft tail current - suppresses voltage spikes and oscillation during IGBT turn-off, reducing snubber size and EMI filter burden. |
| Dual-die isolation | Four independent terminals - eliminates internal wirebond coupling; enables true anti-parallel use without cross-conduction risk. |
| Low VF at high current | 1.4 V @ 100 A - lowers conduction loss by ~15% vs. comparable 300 V fast diodes, directly improving inverter efficiency at full load. |
| High thermal conductivity package | RθJC = 0.42 °C/W - supports >180 W steady-state dissipation per die with standard heatsink interface, easing thermal design in space-constrained drives. |
Applications
| Motor Drive Inverter | Industrial UPS System |
|---|---|
Use Scenario: 3-phase IGBT inverter driving 50–100 kW AC induction motor with 16 kHz PWM switching. IC Role / Device Role / Timing Role: Anti-parallel freewheeling diode across each IGBT switch, conducting reactive current during dead-time and regenerative braking. Use Value: Soft recovery limits VCE spike on IGBTs, enabling lower snubber capacitance and higher system reliability under overload conditions. | Use Scenario: Double-conversion online UPS with bidirectional rectifier/inverter stage handling 480 VAC input and battery backup. IC Role / Device Role / Timing Role: High-current output rectifier in inverter stage, converting DC bus to clean AC output during battery mode. Use Value: Low Qrr and low IRM ensure stable output waveform and minimal harmonic distortion even at elevated ambient temperatures (up to 55°C). |
| Induction Heating Inverter | High-Speed Rectifier Module |
Use Scenario: Resonant half-bridge inverter operating at 20–50 kHz for metal melting and hardening applications. IC Role / Device Role / Timing Role: Freewheeling diode clamping resonant tank current during zero-voltage switching transitions. Use Value: Ultra-low trr and soft recovery prevent voltage ringing that could disrupt ZVS timing and cause MOSFET/IGBT failure. | Use Scenario: Modular 300 V, 200 A rectifier assembly built from two APT2X101D30J units in parallel per phase. IC Role / Device Role / Timing Role: Primary high-current rectification element in compact, air-cooled industrial power supply front-end. Use Value: Dual-die architecture allows balanced current sharing without external busbar asymmetry; SOT-227 footprint simplifies mechanical integration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultrafast soft recovery diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| APT2X100D30J | Identical electrical specs and package; minor internal process revision - same VF, trr, Qrr, and thermal performance. | No functional difference; qualified for identical use cases including motor drives and UPS. | Select APT2X100D30J only if legacy qualification or specific lot traceability is required; otherwise APT2X101D30J is current production version. |
| IXYS MDD100-30N1 | Same 300 V / 100 A rating but higher VF (1.55 V typ.), slower trr (55 ns), and higher RθJC (0.55 °C/W). | Acceptable in lower-frequency (<10 kHz) or less thermally constrained designs; not recommended for high-di/dt motor control. | Choose only when cost sensitivity outweighs efficiency and EMI targets; verify snubber sizing and thermal margin with IXYS data. |
Compared with APT2X100D30J, APT2X101D30J offers identical performance with updated manufacturing traceability; versus IXYS MDD100-30N1, it delivers superior switching speed, lower conduction loss, and better thermal capability - critical for high-power density, high-frequency industrial inverters.
Availability
APT2X101D30J is available at Aetrix Electronics and suitable for motor drive inverters, industrial UPS systems, induction heating equipment, and high-speed rectifier modules requiring stable component supply and long-term industrial lifecycle support.
Supply support for APT2X101D30J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microsemi (now part of Microchip Technology) is a U.S.-based semiconductor company specializing in high-reliability analog and mixed-signal ICs, radiation-hardened devices, and power discretes for aerospace, defense, and industrial markets.
The APT2X101D30J belongs to Microsemi's Ultrafast Soft Recovery Diode family, engineered specifically for high-efficiency, high-frequency switching power converters where low EMI, low loss, and thermal robustness are mandatory.
FAQ
What is the maximum junction temperature rating for APT2X101D30J?
The APT2X101D30J has a specified operating junction temperature range of −55°C to +150°C. This wide range supports deployment in harsh industrial environments such as enclosed motor drives and outdoor UPS cabinets. The device maintains stable electrical parameters-including VF, trr, and IRM-across this full range, as confirmed in the 053-4057 Rev C datasheet curves. Derating of IF(AV) begins above TC = 115°C per the thermal curve in Figure 7.
Does APT2X101D30J support anti-parallel configuration with IGBTs?
Yes, APT2X101D30J is explicitly designed for anti-parallel use with IGBTs in inverter legs. Its four isolated terminals (Anode 1, Anode 2, Cathode 1, Cathode 2) allow direct mounting across individual IGBT switches without shared current paths. The soft recovery characteristic minimizes voltage overshoot during IGBT turn-off, reducing stress and enabling reliable operation in 10–20 kHz motor drives.
What is the reverse recovery charge (Qrr) of APT2X101D30J under typical operating conditions?
The APT2X101D30J exhibits a typical reverse recovery charge (Qrr) of 36 nC when tested at IF = 100 A, diF/dt = −200 A/μs, VR = 200 V, and TC = 25°C. At higher junction temperatures (125°C), Qrr increases to 120 nC under the same conditions. This low, well-characterized Qrr enables predictable snubber design and reduced turn-off losses in high-frequency switching applications.
Can APT2X101D30J be paralleled for higher current handling?
Yes, APT2X101D30J supports parallel operation using its dual-die structure: Anode 1 + Cathode 1 and Anode 2 + Cathode 2 can be independently paralleled to achieve up to 200 A total average forward current. Thermal symmetry and matched VF characteristics between dies ensure balanced current sharing. Proper mounting torque (29.2 lb·in) and uniform heatsink contact are required to maintain thermal equilibrium.
Is APT2X101D30J UL Recognized?
Yes, APT2X101D30J carries UL Recognition under file #E145592, confirming compliance with UL 60747-1 for discrete semiconductors. This recognition validates its safety performance in end-equipment requiring regulatory approval, including industrial motor drives and uninterruptible power supplies. The SOT-227 package construction and internal dielectric isolation meet mandated creepage and clearance requirements.
APT2X101D30J Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- SOT-227-4, miniBLOC
- Packaging:
- Tube
- Product Status:
- Active
- Diode Configuration:
- 2 Independent
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 300 V
- Current - Average Rectified (Io) (per Diode):
- 100A
- Voltage - Forward (Vf) (Max) @ If:
- 1.4 V @ 100 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 47 ns
- Current - Reverse Leakage @ Vr:
- 500 µA @ 300 V
- Operating Temperature - Junction:
- -55°C ~ 175°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Chassis Mount
- Supplier Device Package:
- ISOTOP®
APT2X101D30J FAQ
1.How can I place an order for APT2X101D30J through Aetrix?
Please submit a Request for Quotation (RFQ) for APT2X101D30J on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for APT2X101D30J reliable?
The price and inventory of APT2X101D30J are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for APT2X101D30J is usually 5 days.
3.What payment methods are accepted for APT2X101D30J?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for APT2X101D30J transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for APT2X101D30J?
APT2X101D30J orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your APT2X101D30J order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for APT2X101D30J?
For technical support, including APT2X101D30J datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your APT2X101D30J requirements.
6.How does Aetrix verify that APT2X101D30J is sourced from the original manufacturer or authorized distributors?
All APT2X101D30J products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that APT2X101D30J meets industry standards.
7.What is the process for return or replacement of APT2X101D30J?
All APT2X101D30J units undergo pre-shipment inspection (PSI). If there is an issue with APT2X101D30J, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The APT2X101D30J part is unused and in its original packaging.
Return procedure for APT2X101D30J:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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