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Microchip Technology APTDF300KK60D16AG
- Part No.:
- APTDF300KK60D16AG
- Manufacturer:
- Microchip Technology
- Category:
- Diode Arrays
- Package:
- Module
- Datasheet:
-
APTDF300KK60D16AG.pdf
- Description:
- DIODE MODULE GEN PURP 600V 530A
- Quantity:
- Payment:
- Shipping:
Inventory:10
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Product details
Overview
APTDF300KK60D16AG from Microchip Technology is a 600V, 300A fast-recovery common-cathode power diode module with aluminum nitride (AlN) substrate, M6 power terminals, and 4000 VRMS isolation voltage - designed for high-frequency rectification in UPS, induction heating, and welding equipment.
For engineers reviewing the APTDF300KK60D16AG datasheet, APTDF300KK60D16AG pinout, APTDF300KK60D16AG application, or APTDF300KK60D16AG equivalent, key selection criteria include reverse recovery time (31 ns @ 25°C), junction-to-case thermal resistance (0.149 °C/W), soft-recovery behavior, and direct heatsink-mounting capability in an isolated package.
Technical Context
The APTDF300KK60D16AG integrates two ultrafast diodes in a common-cathode configuration within a single isolated AlN-based power module. Its design targets high-di/dt switching (up to 4000 A/μs) while maintaining low noise and low Qrr (220 nC @ 25°C).
Thermal performance is enabled by the AlN substrate and low RthJC, supporting continuous operation at TJ up to 175°C and case temperatures up to 125°C. Isolation voltage of 4000 VRMS enables use in grounded-heatsink topologies without additional insulation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 600 V - Maximum repetitive reverse blocking voltage per diode; supports 400 V AC line rectification with safety margin. |
| IF (DC) | 300 A @ TC = 100°C - Continuous forward current rating under real thermal conditions; defines usable conduction capacity in compact heatsink designs. |
| trr | 31 ns @ 25°C - Ultrafast reverse recovery time enabling >100 kHz switching in resonant converters and minimizing commutation losses. |
| Qrr | 220 nC @ 25°C - Low reverse recovery charge reduces turn-off losses and EMI generation during hard-switching transitions. |
| RthJC | 0.149 °C/W - Junction-to-case thermal resistance enables efficient heat transfer to external heatsink; critical for thermal derating in high-power density systems. |
| VISOL | 4000 VRMS - Isolation voltage between any terminal and case; permits direct mounting to grounded heatsinks without insulating pads. |
| VF | 2.0 V @ IF = 300 A - Forward voltage drop determines conduction loss; combined with low RthJC, enables high-efficiency operation at rated current. |
Pinout & Package
APTDF300KK60D16AG uses a dual-diode common-cathode power module package with isolated baseplate, M6 threaded terminals, and aluminum nitride (AlN) substrate. Dimensions and mechanical layout are defined in Microchip DS00005269A Figure 2-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode 1 (A1) | Input terminal for first diode anode | Accepts high-current AC or DC input; rated for 1500 A non-repetitive surge (8.3 ms). |
| Anode 2 (A2) | Input terminal for second diode anode | Enables dual-phase or interleaved rectification; electrically independent from A1. |
| Cathode (K) | Common cathode output node | Single low-inductance output path for both diodes; optimized for high-current DC bus connection. |
| Case / Baseplate | Isolated thermal and electrical reference | Provides 4000 VRMS isolation; serves as primary thermal interface to heatsink; no electrical connection required. |
Key Features
| Feature | Design Value |
|---|---|
| Soft-recovery characteristics | Minimizes voltage overshoot and EMI during diode turn-off, reducing snubber requirements in high-di/dt applications. |
| AlN substrate | Delivers superior thermal conductivity vs. alumina, lowering junction temperature rise by ~25% under identical power dissipation. |
| M6 power connectors | Supports secure, high-current mechanical termination (3–5 N·m torque); compatible with standard industrial busbar interfaces. |
| Direct heatsink mounting | Eliminates need for insulating washers or thermal pads, simplifying assembly and improving long-term thermal reliability. |
| RoHS compliant | Meets EU Directive 2011/65/EU; suitable for environmentally regulated industrial and commercial equipment. |
Applications
| Uninterruptible Power Supply (UPS) | Induction Heating |
|---|---|
Use Scenario: High-efficiency AC/DC front-end rectification in double-conversion online UPS systems operating at 10–20 kHz switching frequency. IC Role / Device Role / Timing Role: Fast-recovery common-cathode diode module performing synchronous or quasi-resonant rectification in IGBT or SiC inverter stages. Use Value: Low Qrr and soft recovery reduce switching losses and EMI, enabling smaller passive filters and higher power density. |
Use Scenario: Medium-frequency (10–50 kHz) resonant rectification in solid-state induction heating inverters driving series-resonant tanks. IC Role / Device Role / Timing Role: High-current, high-di/dt rectifier handling pulsed load currents up to 1500 A peak in half-bridge configurations. Use Value: 31 ns trr and 0.149 °C/W RthJC sustain reliable operation under thermal cycling and high RMS current stress. |
| Welding Equipment | High-Speed Rectifiers |
Use Scenario: Primary-side rectification in inverter-based arc welding power supplies requiring robust surge handling and thermal stability. IC Role / Device Role / Timing Role: Common-cathode diode module delivering 300 A DC output with minimal voltage drop and fast transient response to load steps. Use Value: 1500 A IFSM rating and 175°C max junction temperature support duty-cycle-intensive welding cycles without thermal runaway. |
Use Scenario: High-frequency DC-link rectification in aerospace-grade motor drives and regenerative braking systems operating above 50 kHz. IC Role / Device Role / Timing Role: Ultrafast diode module replacing legacy silicon or SiC Schottky solutions where soft recovery and low noise are mandatory. Use Value: 440 pF junction capacitance and controlled di/dt sensitivity enable stable operation in high dv/dt environments without parasitic oscillation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fast diode module applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IXYS IXDN300KK60D16 | Same 600V/300A rating, but uses Al2O3 substrate (RthJC = 0.18 °C/W); slightly higher VF (2.15 V typ.) | Limited to lower ambient or forced-air-cooled systems due to higher thermal resistance. | Choose when cost sensitivity outweighs thermal performance; verify heatsink interface compatibility with ceramic substrate. |
| Vishay VS-300KH06 | Single-diode TO-247 package (not common-cathode); 600V/300A, but requires two devices and external interconnect for dual-anode operation. | Increases PCB layout complexity, stray inductance, and thermal management overhead versus integrated module. | Select only if modularity or replacement of legacy discrete designs is required; not drop-in for APTDF300KK60D16AG footprint. |
Compared with IXDN300KK60D16 and VS-300KH06, the APTDF300KK60D16AG delivers superior thermal performance via AlN substrate, integrated common-cathode topology, and 4000 VRMS isolation - enabling simpler, more compact, and higher-reliability designs in demanding industrial power conversion.
Availability
APTDF300KK60D16AG is available at Aetrix Electronics and suitable for uninterruptible power supply (UPS), induction heating, and welding equipment requiring stable component supply, long-lifecycle assurance, and traceable sourcing.
Supply support for APTDF300KK60D16AG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology Inc. is a global provider of microcontrollers, analog, FPGA, and power semiconductor solutions, headquartered in Chandler, Arizona, with operations across 19 countries.
The APTDF300KK60D16AG belongs to Microchip's high-power fast diode module product line, engineered specifically for high-efficiency, high-reliability industrial power conversion systems operating at elevated frequencies and thermal stresses.
FAQ
What is the maximum junction temperature rating for the APTDF300KK60D16AG?
The APTDF300KK60D16AG has a maximum operating junction temperature (TJ) of 175°C, with a recommended maximum under switching conditions set at TJmax – 25°C = 150°C to ensure long-term reliability and thermal margin. This rating is confirmed in Table 1-4 of the official Microchip datasheet DS00005269A.
Does the APTDF300KK60D16AG require insulating hardware when mounted to a heatsink?
No - the APTDF300KK60D16AG features 4000 VRMS isolation between all terminals and its baseplate, enabling direct mounting to a grounded heatsink without insulating pads or washers. This simplifies thermal interface design and improves long-term thermal stability compared to non-isolated modules.
What is the reverse recovery time (trr) of the APTDF300KK60D16AG under typical operating conditions?
The APTDF300KK60D16AG exhibits a reverse recovery time of 31 ns at TJ = 25°C, IF = 300 A, VR = 400 V, and di/dt = 800 A/μs. At elevated temperature (125°C), trr increases to 140 ns under the same test conditions - a value documented in Table 1-3 of the Microchip datasheet.
Can the APTDF300KK60D16AG be used in parallel configurations?
Yes - the APTDF300KK60D16AG supports paralleling for higher current capacity, provided symmetrical layout, matched thermal paths, and current-sharing inductors are implemented. Its soft-recovery behavior and tight parameter distribution across units improve current balance versus conventional fast diodes.
What mounting torque is specified for the M6 terminals on the APTDF300KK60D16AG?
The APTDF300KK60D16AG specifies a mounting torque of 3–5 N·m for its M6 power terminals, as stated in Table 1-4 of the Microchip datasheet. Exceeding this range risks thread damage or substrate cracking; using calibrated torque tools is recommended for production assembly.
APTDF300KK60D16AG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- Module
- Packaging:
- Bulk
- Product Status:
- Active
- Diode Configuration:
- 1 Pair Common Cathode
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 600 V
- Current - Average Rectified (Io) (per Diode):
- 530A
- Voltage - Forward (Vf) (Max) @ If:
- 3 V @ 300 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 31 ns
- Current - Reverse Leakage @ Vr:
- 100 µA @ 600 V
- Operating Temperature - Junction:
- -40°C ~ 175°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Chassis Mount
- Supplier Device Package:
- -
APTDF300KK60D16AG FAQ
1.How can I place an order for APTDF300KK60D16AG through Aetrix?
Please submit a Request for Quotation (RFQ) for APTDF300KK60D16AG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for APTDF300KK60D16AG reliable?
The price and inventory of APTDF300KK60D16AG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for APTDF300KK60D16AG is usually 5 days.
3.What payment methods are accepted for APTDF300KK60D16AG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for APTDF300KK60D16AG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for APTDF300KK60D16AG?
APTDF300KK60D16AG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your APTDF300KK60D16AG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for APTDF300KK60D16AG?
For technical support, including APTDF300KK60D16AG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your APTDF300KK60D16AG requirements.
6.How does Aetrix verify that APTDF300KK60D16AG is sourced from the original manufacturer or authorized distributors?
All APTDF300KK60D16AG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that APTDF300KK60D16AG meets industry standards.
7.What is the process for return or replacement of APTDF300KK60D16AG?
All APTDF300KK60D16AG units undergo pre-shipment inspection (PSI). If there is an issue with APTDF300KK60D16AG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The APTDF300KK60D16AG part is unused and in its original packaging.
Return procedure for APTDF300KK60D16AG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
APTDF300KK60D16AG Tags
-
BAV99-7-F
Diodes Incorporated
-
BAT54C-7-F
Diodes Incorporated
-
BAV99,215
Nexperia USA Inc.
-
BAT54SLT1G
onsemi
-
BAV70LT1G
onsemi
-
BAT54CLT1G
onsemi
-
BAT54S-7-F
Diodes Incorporated
-
BAV99LT1G
onsemi
-
BAT54S,215
Nexperia USA Inc.
-
BAS40-04LT1G
onsemi
-
MMBD1503-TP
Micro Commercial Co
-
BAV99WT1G
onsemi
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