Microchip Technology APTDX300A170D16AG

Overview

APTDX300A170D16AG from Microchip Technology is a 1700V, 300A fast-recovery diode phase-leg power module with aluminum nitride (AlN) substrate, M6 power terminals, and 4000 V_RMS isolation. It delivers soft-recovery characteristics, low junction-to-case thermal resistance (0.192 °C/W), and operates up to 175 °C junction temperature - deployed in high-power UPS inverters requiring robust reverse recovery energy control (57 mJ at T_J = 175 °C).

For engineers reviewing the APTDX300A170D16AG datasheet, APTDX300A170D16AG pinout, APTDX300A170D16AG application, or APTDX300A170D16AG equivalent, key selection criteria include peak repetitive reverse voltage (1700 V), forward current derating vs. case temperature, reverse recovery charge (93.5 µC at 175 °C), and isolated package mounting requirements for high-voltage DC-link rectification.

Technical Context

This device integrates two ultra-fast, soft-recovery diodes in a phase-leg configuration within a single isolated AlN-based power module. Its electrical diagram confirms dual-diode topology with common cathode/anode arrangement, enabling bidirectional DC-link clamping and regenerative braking paths in three-phase IGBT or SiC inverter stages.

Thermal design centers on direct heatsink mounting via M6 screws and low R_thJC (0.192 °C/W), while isolation rating (4000 V_RMS) supports use in grounded-neutral industrial systems. Dynamic performance is characterized at di/dt = 4750 A/µs and VR = 900 V, with reverse recovery metrics fully specified across –40 °C to 175 °C.

Key Specifications

Pinout & Package

The APTDX300A170D16AG uses a molded, isolated power module package with aluminum nitride (AlN) substrate and M6 screw terminals. Dimensions and mechanical layout are defined in Figure 2-1 of DS00005278A. Mounting torque is specified as 3–5 N·m for both terminals and heatsink interface.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fast diode phase-leg applications.

Compared with IXYS1700DA300N16 and Infineon DD1000S17K4, the APTDX300A170D16AG offers superior thermal performance (0.192 vs. ≥0.21 °C/W), integrated 4000 V_RMS isolation, and optimized soft-recovery for reduced EMI - making it preferred for space-constrained, safety-critical, high-frequency industrial inverters.

Availability

APTDX300A170D16AG is available at Aetrix Electronics and suitable for uninterruptible power supply (UPS), induction heating, and welding equipment requiring stable component supply, long-lifecycle support, and traceable sourcing for industrial OEM production.

Supply support for APTDX300A170D16AG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology Inc. is a global provider of microcontrollers, analog devices, FPGAs, and power semiconductors, headquartered in Chandler, Arizona, with design and manufacturing operations worldwide.

The APTDX300A170D16AG belongs to Microchip's high-voltage fast diode power module product line, engineered specifically for high-efficiency, high-reliability industrial inverter systems demanding low-loss, soft-switching, and reinforced isolation.

FAQ

What is the maximum continuous forward current rating for APTDX300A170D16AG at 50 °C case temperature?

The APTDX300A170D16AG has a rated DC forward current (I_F) of 300 A at T_C = 50 °C, as specified in Table 1-1 of DS00005278A. This value reflects real-world thermal interface conditions and must be used - not the 345 A rating at T_C = 25 °C - for thermal design validation. Derating curves in Figure 3-4 confirm linear reduction to 250 A at T_C = 75 °C.

Does APTDX300A170D16AG support direct mounting to a heatsink without additional insulation?

Yes, the APTDX300A170D16AG features an electrically isolated package with aluminum nitride (AlN) substrate and 4000 V_RMS isolation rating, enabling direct bolt-down mounting to grounded heatsinks without thermal pads or insulators. Mounting torque must be maintained at 3–5 N·m per M6 screw to ensure consistent thermal and electrical contact integrity.

What is the reverse recovery charge (Q_rr) of APTDX300A170D16AG at maximum operating junction temperature?

The APTDX300A170D16AG exhibits a reverse recovery charge (Q_rr) of 93.5 µC at T_J = 175 °C, per Table 1-3 in DS00005278A. This value is 2.5× higher than the 37.6 µC measured at 25 °C, underscoring the necessity of thermal-aware snubber and gate-drive design for high-temperature operation.

Can APTDX300A170D16AG replace discrete 1700 V diodes in existing phase-leg designs?

No - the APTDX300A170D16AG is a monolithic phase-leg module with fixed pinout (Terminals 1–3 forming CR1–common–CR2), not a drop-in replacement for discrete diodes. Its common-cathode topology and M6 terminal spacing require dedicated PCB layout; retrofitting demands mechanical and thermal revalidation, including heatsink interface and busbar routing.

Is APTDX300A170D16AG compliant with RoHS and REACH regulations?

Yes, the APTDX300A170D16AG is RoHS compliant per EU Directive 2011/65/EU, as explicitly stated in the Benefits section of DS00005278A. It also meets REACH SVHC requirements, with no substances of very high concern above threshold concentrations, enabling unrestricted use in EU-market industrial and medical equipment.