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STMicroelectronics ASM330LHHXG1TR
- Part No.:
- ASM330LHHXG1TR
- Manufacturer:
- STMicroelectronics
- Category:
- IMUs (Inertial Measurement Units)
- Package:
- 14-VFLGA
- Datasheet:
-
ASM330LHHXG1TR.pdf
- Description:
- HIGH-ACCURACY 6-AXIS AUTOMOTIVE
- Quantity:
- Payment:
- Shipping:
Inventory:949
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Product details
Overview
ASM330LHHXG1TR from STMicroelectronics is a high-accuracy 6-axis automotive inertial measurement unit (IMU) integrating a 3-axis digital accelerometer (±2/±4/±8/±16 g full scale) and 3-axis digital gyroscope (±125 to ±4000 dps range), AEC-Q100 qualified, operating from −40°C to +125°C, with embedded machine learning core and finite state machine for motion pattern recognition in telematics and dead-reckoning systems.
For engineers reviewing the ASM330LHHXG1TR datasheet, ASM330LHHXG1TR pinout, ASM330LHHXG1TR application, or ASM330LHHXG1TR equivalent, key selection criteria include dual-mode power management (high-performance vs. low-power), six-channel synchronized sensor output, 3 KB embedded FIFO, I²C/MIPI I3C℠/SPI interface support, and automotive-grade temperature stability with factory-trimmed offset and sensitivity.
Technical Context
The ASM330LHHXG1TR implements a tightly coupled dual-sensor architecture where accelerometer and gyroscope data paths are fully synchronized at hardware level, enabling sub-millisecond timestamp alignment critical for dead reckoning. Its on-die sensor hub supports up to four external sensors (e.g., magnetometer) via I²C master mode (Mode 2), with all inputs processed by the same finite state machine (FSM) and machine learning core (MLC).
Both the FSM (16 independent programs) and MLC (8 concurrent flows, up to 512 configurable nodes) operate directly on raw LSB data from internal and external sensors, executing logic-based classification without host CPU involvement-reducing system-level power by offloading activity detection, orientation recognition, and shock event triggering.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Accelerometer FS Range | ±2 / ±4 / ±8 / ±16 g - selectable per application; ±16 g enables crash reconstruction and impact detection with 0.488 mg/LSB resolution. |
| Gyroscope FS Range | ±125 to ±4000 dps - wide dynamic range supports both low-speed vehicle maneuvering and high-speed vibration monitoring with 140 mdps/LSB at ±4000 dps. |
| Output Data Rate (ODR) | Accelerometer: 1.6 Hz–6.67 kHz; Gyroscope: 12.5 Hz–6.67 kHz - enables real-time V2X motion tracking and low-power e-tolling wake-up at 1.6 Hz (7 µA). |
| Current Consumption | Combo low-power mode: 530–1000 µA at 52 Hz ODR - sustains continuous DR operation while minimizing battery drain in connected vehicles. |
| FIFO Depth | 3 KB embedded FIFO - buffers up to ~2000 samples at 1.6 kHz ODR, reducing host interrupt frequency and easing real-time sensor fusion processing load. |
| Temperature Stability | ±100 ppm/°C accel sensitivity drift, ±0.10 mg/°C zero-g offset drift - ensures <±20 mg offset accuracy over −40°C to +125°C for reliable antitheft and comfort control. |
| Communication Interfaces | I²C (up to 1 MHz), MIPI I3C℠, SPI (3-/4-wire) - supports legacy automotive microcontrollers and next-gen sensor hubs with flexible pin-multiplexed Mode 1/Mode 2 configuration. |
Pinout & Package
ASM330LHHXG1TR is housed in a compact 14-pin LGA package (2.5 × 3.0 × 0.83 mm³) with exposed pad for thermal performance and mechanical robustness in automotive under-hood environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 SDO/SA0 | SPI data output / I²C address LSB | Enables SPI 4-wire readback or I²C slave addressing; SA0 sets static device address for multi-sensor I²C bus. |
| 2 MSDA & 3 MSCL | I²C master serial data/clock | Only active in Mode 2; allows direct connection and polling of external magnetometers without host intervention. |
| 4 INT1 & 9 INT2 | Programmable interrupt outputs | Hardware-triggered signals for free-fall, 6D orientation, activity/inactivity, FSM end-state, or MLC result change - eliminates polling overhead. |
| 5 Vdd_IO & 8 Vdd | I/O and core power supplies | Separate 1.62–3.6 V rails allow I/O voltage matching with host MCU while maintaining stable core operation at 1.71–3.6 V. |
| 12 CS | Interface mode select | Logic-high enables I²C/I3C communication; logic-low configures SPI - simplifies PCB routing with single-pin protocol switching. |
| 13 SCL & 14 SDA | I²C/I3C bidirectional bus | Shared with SPI clock/data in 3-wire mode; supports standard/fast/high-speed I²C and MIPI I3C℠ for scalable bandwidth and multi-drop topology. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded Machine Learning Core (MLC) | Executes up to 8 concurrent motion classification flows using configurable "if-then-else" nodes - enables on-sensor driving/walking detection without host CPU cycles. |
| Finite State Machine (FSM) | 16 independent, user-programmable state machines process raw accel/gyro/external sensor data - detects vehicle stationary/motion status or antitheft shock events autonomously. |
| Six-Channel Synchronized Output | Hardware-aligned timestamps across accel X/Y/Z and gyro X/Y/Z - eliminates software interpolation errors in dead-reckoning path estimation. |
| Smart Programmable Interrupts | Configurable edge/polarity triggers for 6D orientation, wake-up, free-fall, and MLC/FSM events - reduces host polling and extends battery life in always-on telematics. |
| Extended Temperature Range | Validated operation from −40°C to +125°C with factory calibration and long-term bias stability - meets automotive under-dash and infotainment mounting requirements. |
Applications
| Dead Reckoning (DR) | Vehicle-to-Everything (V2X) |
|---|---|
|
Use Scenario: GPS-denied navigation in tunnels, urban canyons, or parking garages using inertial trajectory integration. IC Role / Device Role / Timing Role: Primary 6-axis motion reference providing synchronized, low-latency accel/gyro data streams with hardware timestamping. Use Value: Sub-meter position drift per minute enabled by 0.03 m/sec/√h velocity random walk and 0.21 °/√h angular random walk performance. |
Use Scenario: Real-time cooperative awareness between adjacent vehicles during lane changes or intersection negotiation. IC Role / Device Role / Timing Role: Motion context engine feeding vehicle dynamics (yaw rate, acceleration jerk) into V2X message generation. Use Value: 12.5–6667 Hz programmable ODR supports adaptive update rates aligned with DSRC/C-V2X MAC layer timing constraints. |
| Telematics & E-Tolling | Impact Detection & Crash Reconstruction |
|
Use Scenario: Driver behavior scoring and usage-based insurance (UBI) via continuous motion profiling. IC Role / Device Role / Timing Role: Always-on low-power sensor node detecting trip start/stop, harsh braking, cornering G-force, and idle time. Use Value: 7 µA consumption at 1.6 Hz ODR enables multi-year battery life in portable OBD-II dongles without compromising event fidelity. |
Use Scenario: Post-collision forensic analysis of vehicle kinematics during airbag deployment and structural deformation. IC Role / Device Role / Timing Role: High-bandwidth (6.67 kHz) inertial capture triggered by integrated shock-detection FSM before and after impact. Use Value: ±16 g accelerometer range and 1700 mg self-test response ensure measurable signal integrity even during severe frontal collisions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 6-axis automotive IMU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LSM6DSO32XTR | No MLC or FSM; 3 KB FIFO; max ODR 6.67 kHz; −40°C to +105°C rating | Lacks autonomous motion classification; suitable for basic DR but not AI-driven antitheft or comfort functions | Select when cost-sensitive designs require AEC-Q100 compliance without embedded intelligence. |
| ICM-42688-P | Integrated temperature sensor; lower noise floor (40 µg/√Hz); no I3C support; −40°C to +85°C | Better for precision vibration monitoring; lacks automotive extended temp and V2X synchronization features | Prefer for industrial predictive maintenance where extended temperature and FSM are unnecessary. |
Compared with LSM6DSO32XTR and ICM-42688-P, the ASM330LHHXG1TR uniquely delivers automotive-grade extended temperature operation, hardware-synchronized 6-channel output, and dual embedded processing engines (FSM + MLC) - making it the only choice for production-ready, AI-accelerated telematics and safety-critical nonsafety motion systems.
Availability
ASM330LHHXG1TR is available at Aetrix Electronics and suitable for dead reckoning, vehicle-to-everything (V2X), and telematics requiring stable component supply across automotive production lifecycles.
Supply support for ASM330LHHXG1TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing MEMS sensors, microcontrollers, and power management ICs for automotive, industrial, and consumer markets.
The ASM330LHHXG1TR belongs to ST's automotive-qualified inertial sensor portfolio, engineered specifically for nonsafety automotive applications demanding high stability, embedded intelligence, and extended temperature resilience.
FAQ
What is the maximum gyroscope full-scale range supported by the ASM330LHHXG1TR?
The ASM330LHHXG1TR supports a maximum gyroscope full-scale range of ±4000 dps, with corresponding sensitivity of 140 mdps/LSB. This range is validated across the full −40°C to +125°C operating temperature and enables high-fidelity capture of rapid vehicle maneuvers, suspension dynamics, and crash-induced angular transients.
How does the embedded machine learning core reduce system power consumption?
The MLC executes motion classification algorithms directly on sensor data using configurable "if-then-else" decision trees, eliminating the need to stream raw accel/gyro data to the host processor. This reduces host wake-ups, memory access, and CPU cycles-cutting overall system power by up to 70% in use cases like driver activity detection and smart wake-up.
Can the ASM330LHHXG1TR interface with external magnetometers?
Yes-when configured in Mode 2, pins 2 (MSDA) and 3 (MSCL) become an I²C master interface capable of polling up to four external sensors, including magnetometers. This enables full 9-axis sensor fusion without additional host-controlled I²C transactions, and all external sensor data is accessible to both the FSM and MLC.
What packaging and assembly considerations apply to the ASM330LHHXG1TR?
The ASM330LHHXG1TR uses a 14-pin LGA package (2.5 × 3.0 × 0.83 mm³) with wettable flanks and an exposed thermal pad. ST recommends following TN0018 for solder profile, stencil design (0.12 mm thickness), and reflow conditions-peak temperature ≤260°C, with controlled ramp rates to prevent die stress and maintain long-term bias stability.
ASM330LHHXG1TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 14-VFLGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Sensor Type:
- Accelerometer, Gyroscope, 6 Axis
- Output Type:
- I2C, I3C, SPI
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Supplier Device Package:
- 14-LGA (2.5x3)
- Mounting Type:
- Surface Mount
ASM330LHHXG1TR FAQ
1.How can I place an order for ASM330LHHXG1TR through Aetrix?
Please submit a Request for Quotation (RFQ) for ASM330LHHXG1TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ASM330LHHXG1TR reliable?
The price and inventory of ASM330LHHXG1TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ASM330LHHXG1TR is usually 5 days.
3.What payment methods are accepted for ASM330LHHXG1TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ASM330LHHXG1TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ASM330LHHXG1TR?
ASM330LHHXG1TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ASM330LHHXG1TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ASM330LHHXG1TR?
For technical support, including ASM330LHHXG1TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ASM330LHHXG1TR requirements.
6.How does Aetrix verify that ASM330LHHXG1TR is sourced from the original manufacturer or authorized distributors?
All ASM330LHHXG1TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ASM330LHHXG1TR meets industry standards.
7.What is the process for return or replacement of ASM330LHHXG1TR?
All ASM330LHHXG1TR units undergo pre-shipment inspection (PSI). If there is an issue with ASM330LHHXG1TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ASM330LHHXG1TR part is unused and in its original packaging.
Return procedure for ASM330LHHXG1TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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