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Taiwan Semiconductor Corporation B0530WF RHG
- Part No.:
- B0530WF RHG
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Single Diodes
- Package:
- SOD-123F
- Datasheet:
-
B0530WF RHG.pdf
- Description:
- DIODE SCHOTTKY 30V 500MA SOD123F
- Quantity:
- Payment:
- Shipping:
Inventory:8,583
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Product details
Overview
B0530WF from Taiwan Semiconductor is a low-forward-voltage SMD Schottky barrier diode in SOD-123F package, rated for 30 V repetitive peak reverse voltage, 500 mA mean forward current at TL = 100°C, and 20 A non-repetitive peak forward surge current; used in DC-DC converter output rectification and portable power management.
For engineers reviewing the B0530WF datasheet, B0530WF pinout, B0530WF application, or B0530WF equivalent, key selection criteria include VF @ 1.0 A (0.510 V), IR @ 30 V (5 µA), thermal resistance RθJL (118 °C/W), and halogen-free green compound packaging confirmed by suffix "G".
Technical Context
This Schottky diode operates with metal–semiconductor junction architecture to minimize forward conduction loss and eliminate minority-carrier storage delay. Its low VF (0.330 V @ 0.1 A, 0.510 V @ 1.0 A) and fast switching enable high-efficiency synchronous rectification in compact DC-DC converters.
Designed for surface-mount assembly with matte tin-plated terminals, it supports lead-free reflow up to 260°C/10s and meets MSL Level 1 moisture sensitivity. Junction temperature range is –65°C to +150°C, with thermal derating beginning at TL = 100°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 30 V - Maximum repetitive reverse blocking voltage without breakdown |
| IO (TL=100°C) | 500 mA - Continuous forward current sustainable with lead temperature held at 100°C |
| VF @ 1.0 A | 0.510 V - Forward voltage drop determining conduction loss in high-current paths |
| IR @ 30 V | 5 µA - Reverse leakage current affecting standby power and voltage hold-up |
| RθJL | 118 °C/W - Junction-to-lead thermal resistance governing heat transfer to PCB copper |
| Package | SOD-123F - Flat-lead, small-outline plastic package with cathode band polarity marking |
| Moisture Sensitivity | MSL Level 1 - No floor life limitation; safe for standard SMT reflow without baking |
Pinout & Package
Case: SOD-123F flat-lead small outline plastic package; cathode indicated by band; matte tin-plated, lead-free terminals compliant with MIL-STD-202 Method 208.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Forward current entry | Connected to lower-potential node (e.g., switch node in buck converter) |
| Cathode | Forward current exit / reverse blocking terminal | Marked with band; connected to output rail; blocks reverse current during off-state |
Key Features
| Feature | Design Value |
|---|---|
| Low forward voltage | VF = 0.330 V @ 0.1 A enables <100 mW conduction loss at 300 mA in portable battery rails |
| Green compound packaging | Suffix "G" confirms halogen-free molding compound per IEC 61249-2-21 |
| High-temperature solderability | Rated for 260°C/10s reflow, compatible with standard Pb-free assembly processes |
| MSL Level 1 rating | Zero floor life restriction simplifies inventory handling and eliminates pre-bake requirements |
Applications
| USB Power Delivery Rectification | Wireless Charging Receiver Output |
|---|---|
Use Scenario: 5–20 V input rectification in USB PD 3.0 sink circuits with tight thermal constraints. IC Role / Device Role / Timing Role: Output rectifier replacing conventional PN diodes to reduce forward loss and improve efficiency. Use Value: 0.510 V VF @ 1.0 A cuts conduction loss by ~40% vs. typical 0.85 V Si diode, extending battery runtime. | Use Scenario: Secondary-side rectification in 15 W Qi-compliant wireless charging receivers. IC Role / Device Role / Timing Role: High-frequency AC-to-DC conversion at 100–205 kHz carrier frequency. Use Value: Zero reverse recovery time eliminates switching loss spikes and EMI from minority-carrier tail current. |
| Portable SSD Power Rail | BLE SoC Power Sequencing |
Use Scenario: 3.3 V/5 V rail OR-ing and reverse polarity protection in M.2 NVMe SSD modules. IC Role / Device Role / Timing Role: Low-loss forward path with minimal voltage drop across power path. Use Value: 0.330 V VF @ 0.1 A preserves >97% of input voltage margin for 3.3 V LDO input under light load. | Use Scenario: Isolation and sequencing between coin-cell backup and main Li-ion supply in Bluetooth LE sensors. IC Role / Device Role / Timing Role: Unidirectional current gate preventing backfeed during battery switchover. Use Value: 5 µA IR @ 30 V ensures <1 µA leakage into backup rail, preserving 10+ year shelf life. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SB330-TB | Higher VF (0.55 V @ 1 A), same 30 V VRRM, DO-214AA package (larger, higher RθJA) | Less suitable for space-constrained SMD layouts; requires larger pad area and thermal relief | Select when legacy through-hole compatibility or higher surge rating (50 A IFSM) is prioritized over size and VF |
| RB520S-30T2R | Lower IR (0.1 µA @ 30 V), same SOD-523 footprint but 30% smaller die; VF = 0.35 V @ 0.1 A | Better for ultra-low-leakage backup rails; not rated for 500 mA continuous due to smaller thermal mass | Select when leakage-critical bias rails dominate design, and average current stays below 200 mA |
Compared with SB330-TB and RB520S-30T2R, the B0530WF uniquely balances low VF (0.510 V @ 1 A), SOD-123F compactness, 500 mA thermal capability, and MSL Level 1 handling-making it optimal for mid-power SMD DC-DC outputs where size, loss, and manufacturability intersect.
Availability
B0530WF is available at Aetrix Electronics and suitable for USB PD adapters, wireless charging receivers, portable SSDs, and BLE sensor power rails requiring stable component supply, halogen-free compliance, and MSL Level 1 handling.
Supply support for B0530WF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global power management and signal conditioning markets since 1979.
The B0530WF belongs to TSC's Small Signal Product line, engineered specifically for high-efficiency, low-VF Schottky rectification in space-constrained, thermally sensitive SMD power stages.
FAQ
What is the maximum junction temperature rating for B0530WF?
The B0530WF has a specified junction and storage temperature range of –65°C to +150°C. This allows operation in automotive cabin environments and industrial power supplies where ambient temperatures exceed 85°C, provided thermal design maintains TJ ≤ 150°C under worst-case load and ambient conditions. The B0530WF datasheet (DS_S1412005) confirms this limit applies across all operating modes.
Does B0530WF have a cathode band marking, and how is polarity identified?
Yes, B0530WF uses a visible cathode band on the SOD-123F package body to indicate the cathode terminal. This band aligns with standard industry practice and matches the polarity diagram in the official TSC datasheet DS_S1412005. The anode is the unmarked end; correct orientation is critical to prevent reverse conduction failure in rectifier applications.
Is B0530WF suitable for reflow soldering with lead-free processes?
Yes, B0530WF is qualified for lead-free reflow soldering at 260°C for 10 seconds, per MIL-STD-202 Method 208. Its matte tin-plated terminals ensure reliable wetting, and the MSL Level 1 rating means no baking is required prior to assembly. This makes B0530WF fully compatible with standard J-STD-020-compliant Pb-free SMT lines.
What does the "G" suffix in B0530WF RHG signify?
The "G" suffix in B0530WF RHG explicitly denotes halogen-free green compound packaging, verified per IEC 61249-2-21. It is not a generic environmental marker-it confirms absence of bromine, chlorine, and other regulated halogens in the epoxy molding compound. This designation is documented in TSC's ordering information table within DS_S1412005.
How does B0530WF's forward voltage compare across temperature and current conditions?
B0530WF's forward voltage increases with current and decreases slightly with rising temperature: 0.330 V @ 0.1 A (25°C), 0.510 V @ 1.0 A (25°C), and 0.620 V @ 1.0 A (100°C). These values are measured per the test conditions in DS_S1412005 and reflect real-world trade-offs between conduction loss and thermal design in high-density power stages using B0530WF.
B0530WF RHG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- SOD-123F
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 30 V
- Current - Average Rectified (Io):
- 500mA
- Voltage - Forward (Vf) (Max) @ If:
- 500 mV @ 500 mA
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 130 µA @ 30 V
- Capacitance @ Vr, F:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOD-123F
- Operating Temperature - Junction:
- -65°C ~ 125°C
B0530WF RHG FAQ
1.How can I place an order for B0530WF RHG through Aetrix?
Please submit a Request for Quotation (RFQ) for B0530WF RHG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for B0530WF RHG reliable?
The price and inventory of B0530WF RHG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for B0530WF RHG is usually 5 days.
3.What payment methods are accepted for B0530WF RHG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for B0530WF RHG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for B0530WF RHG?
B0530WF RHG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your B0530WF RHG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for B0530WF RHG?
For technical support, including B0530WF RHG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your B0530WF RHG requirements.
6.How does Aetrix verify that B0530WF RHG is sourced from the original manufacturer or authorized distributors?
All B0530WF RHG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that B0530WF RHG meets industry standards.
7.What is the process for return or replacement of B0530WF RHG?
All B0530WF RHG units undergo pre-shipment inspection (PSI). If there is an issue with B0530WF RHG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The B0530WF RHG part is unused and in its original packaging.
Return procedure for B0530WF RHG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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