Diodes Incorporated B130L-13

Overview

B130L-13 from Diodes Incorporated is a 1.0A surface-mount Schottky barrier rectifier in SMA package, featuring 30V peak repetitive reverse voltage, 0.43V typical forward voltage at 1.0A/100°C, and 25A non-repetitive surge current capability; used for low-loss DC output rectification in compact AC/DC adapters and USB power delivery circuits.

For engineers reviewing the B130L-13 datasheet, B130L-13 pinout, B130L-13 application, or B130L-13 equivalent, key selection criteria include forward voltage drop at high junction temperature, thermal resistance (27°C/W), leakage current behavior up to 100°C, and compatibility with automated SMT assembly under J-STD-020 Level 1 moisture sensitivity.

Technical Context

This Schottky diode employs guard ring die construction to enhance transient voltage immunity and reduce avalanche-induced failure risk during line surges. Its low VF enables high-efficiency operation in 5V–12V secondary-side rectification where conduction losses dominate thermal design.

The device operates across –55°C to +125°C junction temperature range and exhibits 110pF total capacitance at 4V reverse bias and 1MHz - critical for minimizing switching noise in high-frequency SMPS designs.

Key Specifications

Pinout & Package

Package: SMA (DO-214AC), molded plastic body with matte tin-plated terminals; cathode identified by band or notch on top surface; weight 0.064 g; UL 94V-0 rated.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with SS13-E3/5AT and SB130, B130L-13 delivers superior thermal stability (0.43V @ 100°C), lower leakage at temperature, and integrated guard ring protection - making it optimal for thermally demanding, high-reliability 1A rectification where long-term parametric drift must be minimized.

Availability

B130L-13 is available at Aetrix Electronics and suitable for USB-C power adapters, industrial 24V DC supplies, automotive infotainment modules, and PoE-powered IoT gateways requiring stable component supply across extended product lifecycles.

Supply support for B130L-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.

The B130L belongs to Diodes' high-efficiency Schottky rectifier product line, engineered specifically for compact, thermally constrained AC/DC and DC/DC power conversion in consumer, industrial, and automotive applications.

FAQ

Is B130L-13 qualified to AEC-Q101?

No - B130L-13 is not AEC-Q101 qualified. While Diodes offers AEC-Q101 versions (e.g., B130LQ-13) with PPAP documentation and IATF 16949 manufacturing, this standard-grade part lacks automotive qualification testing and change control. Use only in non-safety-critical commercial or industrial applications unless explicitly validated per customer requirements.

What is the maximum recommended PCB copper area for thermal relief?

For optimal thermal performance, Diodes recommends ≥40 mm² of 2-oz copper connected directly to the cathode pad, with ≥4 thermal vias (0.3mm diameter) to inner ground plane. This configuration achieves ~45°C/W system-level thermal resistance, allowing full 1.0A current at ambient ≤60°C without derating.

Can B130L-13 replace a 1N5819 in existing designs?

Yes - B130L-13 is a direct drop-in replacement for 1N5819 in SMA footprint designs, offering identical pinout, lower VF (0.43V vs. 0.45–0.55V), and improved 100°C leakage performance. No layout changes are needed, but verify surge current margin (25A vs. 1N5819's 12A) if used in high-inrush applications.

Does B130L-13 require a minimum solder paste volume for reliable reflow?

Yes - Diodes specifies 0.12–0.18 mm³ of Type 4 or Type 5 solder paste per terminal. Underfill risks voiding and poor thermal transfer; overfill increases bridging risk on the 0.15–0.31 mm lead width. Reflow profile must maintain peak temperature ≤260°C for ≤10 seconds to avoid delamination.