Diodes Incorporated B180B-13

Overview

B180B-13 from Diodes Incorporated is a 1.0A, 80V high-voltage Schottky barrier rectifier in SMB package, featuring low forward voltage (0.79V @ 1.0A, 25°C), 30A non-repetitive surge capability, and junction-to-terminal thermal resistance of 25K/W. It serves as a freewheeling or polarity protection diode in DC-DC converters and low-voltage, high-frequency inverters.

For engineers reviewing the B180B-13 datasheet, B180B-13 pinout, B180B-13 application, or B180B-13 equivalent, key selection criteria include its 80V VRRM rating, 0.79V forward drop at rated current, 80pF junction capacitance at 4V reverse bias, 0.5mA peak reverse leakage at 25°C, and SMB surface-mount compatibility for automated assembly.

Technical Context

This Schottky rectifier uses guard-ringed die construction to enhance transient immunity and improve reliability under repetitive surge stress. Its low forward voltage and fast switching enable high-efficiency operation in high-frequency power conversion topologies without reverse recovery charge.

The device operates across –65°C to +150°C with UL 94V-0 molded plastic case and solderable terminals compliant with MIL-STD-202 Method 208. Thermal performance is defined by junction-to-terminal resistance (25K/W), assuming terminals held at ambient temperature.

Key Specifications

Pinout & Package

SMB (DO-214AA) surface-mount plastic package with cathode band marking; dimensions: 3.30–3.94mm (L) × 4.06–4.57mm (W) × 1.96–2.21mm (H); weight ≈ 0.093g.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with B180B-13, SS18 trades thermal performance for size reduction, while SB180 offers identical functionality with alternate supply-chain validation-neither provides higher voltage rating or lower VF, making B180B-13 optimal for thermally demanding SMB designs requiring Diodes Incorporated qualification.

Availability

B180B-13 is available at Aetrix Electronics and suitable for DC-DC converter output rectification, automotive body control module power supplies, high-frequency inverter freewheel paths, and industrial PLC digital input protection requiring stable component supply and consistent SMB packaging.

Supply support for B180B-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management and signal integrity solutions for industrial, computing, and automotive markets.

B180B-13 belongs to the B170/B–B1100/B high-voltage Schottky rectifier family, engineered for low-loss, high-reliability operation in space-constrained, thermally aggressive power conversion and protection circuits.

FAQ

What is the maximum junction temperature for B180B-13?

The absolute maximum junction temperature is +150°C, as specified in the DS30018 Rev. B-2 datasheet. Operation above this temperature risks permanent degradation of the Schottky junction. Derating curves show that average forward current must be reduced to 0.5A at TJ = 150°C, assuming proper thermal management via PCB copper area or heatsinking.

Can B180B-13 replace a standard silicon rectifier in a 24V power supply?

Yes, provided the reverse voltage requirement does not exceed 80V and the application benefits from lower forward drop. At 1.0A, B180B-13 drops 0.79V versus ~1.1V for a typical 1N4007, reducing conduction loss by 310mW. However, its higher reverse leakage (0.5mA vs. <5µA) may increase standby power in always-on systems.

Is B180B-13 suitable for use in automotive infotainment power rails?

Yes, it meets AEC-Q101 stress test requirements when procured as the automotive-grade variant (B180BQ-13). The standard B180B-13 is not AEC-qualified; for infotainment systems requiring automotive reliability, confirm part number suffix "Q" and consult Diodes Incorporated's AEC-Q101 report for temperature cycling, HTRB, and ESD data.

How does the SMB package affect thermal performance compared to SMA?

The SMB package has lower thermal resistance (25K/W vs. 35K/W for SMA), enabling higher continuous current in the same PCB layout. Its larger footprint improves mechanical stability during thermal cycling and reduces solder joint stress, especially in environments with vibration or repeated power cycling.