Diodes Incorporated B230-13

Overview

B230-13 from Diodes Incorporated is a 30 V, 2.0 A surface-mount Schottky barrier rectifier in SMB package, featuring 0.50 V forward voltage at 2.0 A, 50 A non-repetitive surge rating, and AEC-Q101 qualification for automotive polarity protection and free-wheeling applications.

For engineers reviewing the B230-13 datasheet, B230-13 pinout, B230-13 application, or B230-13 equivalent, key selection criteria include low VF for efficiency-critical DC/DC outputs, thermal resistance (20 °C/W junction-to-lead), and SMB package compatibility with high-density PCB layouts in automotive body control modules and industrial power supplies.

Technical Context

This Schottky rectifier uses guard ring die construction to suppress transient-induced avalanche failure and supports high-frequency switching up to several MHz due to low junction capacitance (200 pF at 40 V). Its metal-semiconductor junction enables zero minority-carrier storage, eliminating reverse recovery time.

Designed for low-voltage DC systems, it operates across –65 °C to +150 °C with derated current above 75 °C ambient and maintains <0.5 mA leakage at rated 30 V reverse voltage and +25 °C - critical for battery-powered standby circuits.

Key Specifications

Pinout & Package

Package: SMB (Surface-Mount Small Outline) - molded plastic case, UL 94V-0 rated, 3.30–3.94 mm length × 4.06–4.57 mm width × 1.96–2.21 mm height, cathode band polarity marking.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with SB330-TB-E3/52 and SS23, B230-13 uniquely balances AEC-Q101 compliance, SMB form factor, and lowest VF (0.50 V) - making it optimal for new automotive designs where thermal density and qualification are jointly constrained.

Availability

B230-13 is available at Aetrix Electronics and suitable for automotive body electronics, industrial DC/DC converters, and smart energy metering requiring stable component supply and long-term lifecycle assurance.

Supply support for B230-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in China, Taiwan, and the U.S.

The B220/A–B260/A series targets high-reliability power conversion in automotive and industrial environments, emphasizing low VF, surge robustness, and AEC-Q101 compliance for safety-critical subsystems.

FAQ

What is the maximum junction temperature for continuous operation?

The B230-13 has an operating junction temperature range of –65 °C to +150 °C. For continuous 2.0 A operation, thermal design must ensure TJ remains ≤150 °C - typically achieved using ≥1 cm² 1 oz copper pad per terminal and ambient ≤75 °C, per Fig. 4 derating curve.

Is B230-13 suitable for synchronous rectification?

No - B230-13 is a passive Schottky rectifier, not a synchronous rectifier controller or MOSFET driver. It functions as a unidirectional conduction device only; synchronous rectification requires active gate control of a MOSFET, which this part does not provide.

Does B230-13 have a specified reverse recovery time (trr)?

No - as a Schottky barrier diode, B230-13 exhibits no minority-carrier storage and therefore has no measurable reverse recovery time. Its switching behavior is limited only by junction capacitance (200 pF) and circuit inductance, enabling clean turn-off in high-frequency applications.

Can B230-13 replace B230A-13-F in a design?

Yes - B230-13 (SMB) and B230A-13-F (SMA) share identical electrical specifications (VRRM = 30 V, IO = 2.0 A, VF = 0.50 V), but differ in package: SMB offers higher current rating via lower RθJL (20 vs. 25 °C/W) and larger thermal mass, requiring PCB pad layout adjustment.