Diodes Incorporated B230-13-F

Overview

B230-13-F from Diodes Incorporated is a 30 V, 2.0 A surface-mount Schottky barrier rectifier in SMB package, featuring 0.50 V forward voltage at 2.0 A, 50 A non-repetitive surge rating, and AEC-Q101 qualification for automotive use. It serves as a low-loss freewheeling diode in DC-DC converters and polarity protection switch in 12 V automotive power rails.

For engineers reviewing the B230-13-F datasheet, B230-13-F pinout, B230-13-F application, or B230-13-F equivalent, key selection criteria include forward voltage drop at rated current, thermal resistance (20 °C/W junction-to-lead), reverse leakage at 100 °C, surge capability, and RoHS/Green compliance status.

Technical Context

This Schottky rectifier uses guard ring die construction to enhance transient robustness and supports high-frequency switching up to several hundred kHz without significant switching loss penalties. Its low VF and fast recovery (<10 ns) enable efficient operation in synchronous rectification and flyback snubber circuits.

The device operates across –65 °C to +150 °C with derated average current above 75 °C ambient, and its SMB package provides 20 °C/W thermal resistance to lead-critical for thermally constrained PCB layouts with limited copper area.

Key Specifications

Pinout & Package

SMB (DO-214AA) surface-mount plastic package with cathode band marking; 3.30–3.94 mm length, 4.06–4.57 mm width, 1.96–2.21 mm height; matte tin-plated terminals, moisture sensitivity level 1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with SB330-E3/54 and SS23, B230-13-F delivers superior surge robustness (50 A vs. ≤35 A) and certified automotive qualification-enabling direct deployment in Tier-1 BCM and ADAS power stages without requalification.

Availability

B230-13-F is available at Aetrix Electronics and suitable for automotive body control modules, industrial DC-DC converters, USB-C power adapters, and telecom remote radio units requiring stable component supply across multi-year production cycles.

Supply support for B230-13-F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design centers across Asia and manufacturing in China, Taiwan, and the U.S.

The B220/A–B260/A series targets cost-sensitive, high-reliability power conversion-designed specifically for automotive, industrial, and consumer power supplies needing low VF, high surge tolerance, and green compliance.

FAQ

What is the maximum junction temperature for continuous operation?

The B230-13-F has a specified operating junction temperature range of –65 °C to +150 °C. For continuous operation at full 2.0 A average current, the junction temperature must remain ≤150 °C, which requires maintaining lead temperature ≤130 °C given its 20 °C/W RθJL. Derating curves in DS13004 show usable current drops to ~1.3 A at 100 °C ambient with standard pad layout.

Is B230-13-F compatible with lead-free reflow profiles?

Yes-B230-13-F is qualified for lead-free reflow with a peak temperature of 260 °C for 10 seconds, meeting IPC/JEDEC J-STD-020 requirements. Its matte tin finish ensures reliable wetting on OSP- and ENIG-finished PCBs, and its moisture sensitivity level 1 eliminates bake requirements prior to assembly.

How does the guard ring construction improve reliability?

The guard ring die structure reduces electric field crowding at the PN junction edge, suppressing premature avalanche and improving resistance to ESD (≥8 kV HBM) and repetitive line transients. In practice, this allows the device to survive ISO 7637-2 Pulse 1 and Pulse 3a without degradation-critical for automotive power inputs exposed to load dump and jump-start events.

Can B230-13-F replace B230A-13-F in existing designs?

No-B230-13-F (SMB package) and B230A-13-F (SMA package) differ mechanically and thermally: SMB offers 20 °C/W RθJL vs. SMA's 25 °C/W, and footprint dimensions differ (SMB: 3.3–3.94 × 4.06–4.57 mm; SMA: 2.29–2.92 × 4.00–4.60 mm). Direct replacement requires PCB land pattern revision and thermal validation.