Diodes Incorporated B230BE-13

Overview

B230BE-13 from Diodes Incorporated is a 30 V, 2 A surface-mount Schottky barrier rectifier in SMB package, featuring 0.5 V max forward voltage at 2 A and 0.1 mA max reverse leakage at 30 V and +25°C. It serves as a low-loss power conversion diode in DC/DC boost stages, reverse polarity protection circuits, and freewheeling paths in switching regulators.

For engineers reviewing the B230BE-13 datasheet, B230BE-13 pinout, B230BE-13 application, or B230BE-13 equivalent, key selection criteria include its thermal resistance (90 °C/W junction-to-ambient), high-temperature reverse leakage stability, RoHS-compliant matte tin finish, and SMB package compatibility with automated SMT assembly for industrial power supplies and embedded converters.

Technical Context

This Schottky rectifier uses a planar metal–semiconductor junction to achieve low forward voltage drop and fast switching without minority-carrier storage delay. Its design targets continuous conduction mode (CCM) operation in 100 kHz–1 MHz DC/DC topologies where conduction loss minimization is critical.

Thermal performance is defined by R_θJA = 90 °C/W on standard FR-4 PCB (0.4" × 0.5", 2 oz copper), with R_θJC = 40 °C/W enabling effective heat transfer to external copper pours. Reverse leakage remains ≤0.1 mA at 30 V and +25°C, rising to ≤15 mA at +125°C - a key reliability factor for high-ambient environments.

Key Specifications

Pinout & Package

SMB (Surface Mount Small Outline) package: molded plastic body, UL 94V-0 rated, cathode band marking, matte tin–annealed copper leadframe, moisture sensitivity level 1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with B230BE-13, SS33-E3/57T offers higher current headroom but trades off leakage performance, while SB330-E3/57T matches footprint and voltage rating but incurs slightly higher conduction loss - both require layout verification for thermal derating above 2 A.

Availability

B230BE-13 is available at Aetrix Electronics and suitable for industrial power supplies, embedded DC/DC converters, and automotive body electronics requiring stable component supply and long-lifecycle availability.

Supply support for B230BE-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.

The B220AE–B245BE series belongs to Diodes' general-purpose Schottky rectifier product line, engineered for cost-sensitive, high-volume power conversion applications demanding low VF, stable high-temperature leakage, and RoHS/Green compliance.

FAQ

What is the maximum junction temperature for continuous operation of B230BE-13?

The B230BE-13 has an operating junction temperature range of –55°C to +150°C. For reliable long-term operation at 2 A DC current, thermal design must ensure T_J stays below 150°C - typically achieved with ≥1 cm² of 2 oz copper on the cathode pad and ambient ≤85°C.

Is B230BE-13 suitable for use in automotive applications?

B230BE-13 meets AEC-Q101 stress test requirements for discrete semiconductors and operates up to +150°C, making it suitable for under-dash and engine bay auxiliary power modules. However, it is not qualified to AEC-Q100 and should not be used in safety-critical ADAS or powertrain control units without additional validation.

How does the SMB package of B230BE-13 compare to SMA in thermal performance?

The SMB package has R_θJA = 90 °C/W versus 95 °C/W for SMA, offering 5% better junction-to-ambient thermal resistance. Its larger footprint (4.06–4.57 mm × 3.30–3.94 mm) allows greater copper attachment area, improving heat spreading in space-constrained layouts.

Can B230BE-13 replace B230AE-13 in existing designs?

Yes - B230BE-13 is the SMB-package variant of B230AE-13 (SMA), sharing identical electrical specifications (V_RRM, I_O, V_F, I_R). Layout change is required due to different pad dimensions and thermal pad geometry, but no circuit redesign is needed if PCB thermal relief accommodates SMB's larger size.