Diodes Incorporated B240-13-F

Overview

B240-13-F from Diodes Incorporated is a 40 V, 2.0 A surface-mount Schottky barrier rectifier in SMB package, featuring 0.50 V forward voltage at 2.0 A, 50 A non-repetitive surge rating, and AEC-Q101 qualification for automotive use. It serves as a low-loss freewheeling diode in DC-DC converters and polarity protection circuitry in 12 V automotive subsystems.

For engineers reviewing the B240-13-F datasheet, B240-13-F pinout, B240-13-F application, or B240-13-F equivalent, key selection criteria include its 40 V reverse voltage rating, thermal resistance of 20 °C/W (junction-to-lead), RoHS-compliant matte tin plating, and suitability for high-frequency switching up to 1 MHz with 200 pF junction capacitance.

Technical Context

This Schottky rectifier uses guard ring die construction to enhance transient robustness and suppress leakage under high reverse bias. Its low VF enables reduced conduction loss in low-voltage power rails, while the SMB package supports automated SMT assembly with 260 °C/10 s soldering tolerance.

Electrical behavior is characterized by minimal stored charge-enabling operation in high-frequency inverters-and stable IR ≤ 0.5 mA at 40 V and 25 °C. Thermal derating follows a linear curve: full 2.0 A rating applies up to 75 °C ambient, dropping to ~1.2 A at 125 °C per Fig. 5.

Key Specifications

Pinout & Package

Package: SMB (Surface Mount Body), molded plastic case per JEDEC DO-214AA, UL 94V-0 rated, 3.30–3.94 mm length × 4.06–4.57 mm width × 1.96–2.21 mm height. Cathode identified by band on body.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with SB240-E3/52T and SS24H, B240-13-F uniquely combines AEC-Q101 compliance, lowest VF (0.50 V), and optimized SMB thermal performance (20 °C/W), making it the preferred choice for automotive SMT power stages requiring reliability and efficiency.

Availability

B240-13-F is available at Aetrix Electronics and suitable for automotive body electronics, industrial DC-DC converters, USB-C PD adapters, and PoE midspan injectors requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for B240-13-F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design and manufacturing operations across Asia and the Americas.

The B2xx/A series belongs to Diodes' standard Schottky rectifier product line, engineered specifically for high-efficiency, high-reliability power conversion in automotive and industrial applications where low VF and robust surge capability are critical.

FAQ

What is the maximum junction temperature for continuous operation of B240-13-F?

The device is rated for TJ from –65 °C to +150 °C. For continuous 2.0 A operation, ambient must be limited to ≤75 °C (per Fig. 5 derating curve), assuming proper PCB copper area per AP02001 layout. At 125 °C ambient, max sustainable IF(AV) drops to ~1.2 A due to thermal resistance constraints.

Is B240-13-F pin-compatible with other SMB Schottky diodes like SS24 or SR240?

Yes - all SMB-packaged Schottky diodes share identical mechanical footprint and terminal geometry (DO-214AA). However, electrical differences exist: SS24 has higher VF (0.55 V) and leakage (1.0 mA), while SR240 is a 40 V, 2 A standard recovery rectifier with much slower switching and higher VF (~0.95 V).

Does B240-13-F support reflow soldering with lead-free pastes?

Yes - the device is qualified for lead-free reflow per J-STD-020 Level 1 (MSL 1), with terminal plating rated for 260 °C/10 seconds. Standard SAC305 profile (peak 245–260 °C) is fully supported; no special pre-bake required.

How does the guard ring construction improve reliability in automotive applications?

The guard ring mitigates edge breakdown under high dv/dt and transient overvoltage events (e.g., ISO 7637-2 pulse 1/2a/5a). It reduces localized electric field crowding at the silicon periphery, lowering failure probability during repeated load-dump spikes and improving long-term parametric stability in underhood environments.