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Diodes Incorporated B330AF-13
- Part No.:
- B330AF-13
- Manufacturer:
- Diodes Incorporated
- Category:
- Single Diodes
- Package:
- DO-221AC, SMA Flat Leads
- Datasheet:
-
B330AF-13.pdf
- Description:
- DIODE SCHOTTKY 30V 3A SMAF
- Quantity:
- Payment:
- Shipping:
Inventory:58,073
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Product details
Overview
B330AF-13 from Diodes Incorporated is a 30 V, 3 A surface-mount Schottky barrier rectifier in SMAF package, featuring 0.50 V max forward voltage at 3 A and 0.20 mA max reverse leakage at 30 V/25°C, optimized for high-efficiency DC-DC boost stages in power supplies.
For engineers reviewing the B330AF-13 datasheet, B330AF-13 pinout, B330AF-13 application, or B330AF-13 equivalent, key selection criteria include its low VF stability up to +125°C, thermal resistance (RθJA = 85°C/W), junction capacitance (140 pF @ 4 V), and RoHS-compliant matte tin finish on copper leadframe.
Technical Context
This Schottky rectifier uses a planar epitaxial construction with low-barrier metal-semiconductor junction to achieve minimal conduction loss and suppressed reverse recovery charge-critical for high-frequency switching topologies like synchronous buck-boost converters. Its 30 V VRRM rating targets 24 V input rail applications where margin against transient overvoltage is required.
The device exhibits stable IR ≤ 0.20 mA at VR = 30 V and TJ = +25°C, rising to ≤14.0 mA at +125°C-enabling reliable operation in thermally constrained environments such as enclosed industrial power modules without thermal runaway risk.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 30 V - Maximum repetitive reverse blocking voltage; sets upper limit for input transient tolerance in 24 V systems |
| IO (AV) | 3 A - Continuous average forward current at TA = +25°C; derates to ~1.5 A at +100°C per Figure 4 |
| VF (max) | 0.50 V @ IF = 3 A, TJ = +25°C - Directly reduces conduction loss (1.5 W max) and improves system efficiency |
| IR (max) | 0.20 mA @ VR = 30 V, TJ = +25°C - Low leakage preserves standby power budget in always-on circuits |
| RθJA | 85 °C/W - Junction-to-ambient thermal resistance on standard FR-4 PCB; defines minimum heatsinking requirement |
| CT | 140 pF @ VR = 4.0 V, f = 1 MHz - Limits high-frequency switching noise and EMI in >100 kHz converters |
Pinout & Package
Package: SMAF (Surface Mount Axial Flat), molded plastic case with UL 94V-0 rating, cathode band polarity marking, 0.036 g weight, and matte tin–annealed copper leadframe.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Forward current entry point | Connected to lower-potential node (e.g., switch node in boost topology); requires low-inductance layout |
| Cathode | Forward current exit / reverse blocking terminal | Marked by band; ties to output rail or ground return; carries full load current and must handle surge IFSM = 80 A |
Key Features
| Feature | Design Value |
|---|---|
| Low forward voltage drop | VF ≤ 0.50 V @ 3 A ensures <1.5 W conduction loss at full load-reducing thermal stress in compact enclosures |
| High-temperature reverse leakage control | IR ≤ 14.0 mA @ 30 V/+125°C prevents thermal runaway during sustained high-ambient operation |
| RoHS-compliant matte tin finish | Lead-free, halogen- and antimony-free plating enables compliant assembly without solderability compromise |
| SMAF package thermal performance | RθJC = 45 °C/W allows efficient heat transfer to PCB copper pads-critical for unforced-air industrial designs |
Applications
| Boost Diodes | Blocking Diodes |
|---|---|
Use Scenario: Used in non-isolated boost converters for 12–24 V input to 48 V output telecom power supplies. IC Role / Device Role: Freewheeling path during high-side switch off-time; conducts full output current. Use Value: 0.50 V VF minimizes power loss and temperature rise under 3 A continuous load, extending converter lifetime. | Use Scenario: Prevents reverse current flow from battery backup to main supply in UPS modules. IC Role / Device Role: Unidirectional isolation element placed between dual power sources. Use Value: 30 V VRRM provides sufficient margin against battery float voltage transients up to 28.8 V. |
| Recirculating Diodes | OR-ing Diodes |
Use Scenario: Provides current path for inductive kickback in solenoid drivers for industrial PLC I/O modules. IC Role / Device Role: Clamps back-EMF across relay coils or motor windings during turn-off. Use Value: 80 A IFSM rating withstands short-duration inductive surges without degradation. | Use Scenario: Enables redundant 12 V power rails in network switch line cards. IC Role / Device Role: Forward-biased diode in parallel power paths to prevent backfeed between supplies. Use Value: Low VF ensures minimal voltage drop and balanced current sharing between redundant sources. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SB330-E3/57T (Vishay) | Same VRRM (30 V), IO (3 A), VF (0.52 V max), but TO-277 package (higher RθJA ≈ 100°C/W) | Requires larger PCB footprint and additional thermal relief; less suitable for ultra-thin designs | Select if legacy TO-277 footprint compatibility is required over space-constrained SMAF layouts |
| SS33 (ON Semiconductor) | Identical SMA package, same VF (0.50 V), but higher IR (0.5 mA @ 30 V/25°C) and no 125°C IR spec | Less robust in high-temp industrial ambient; may increase standby power in sealed enclosures | Prefer B330AF-13 where long-term reliability at +125°C ambient is mandatory |
Compared with SB330-E3/57T and SS33, B330AF-13 delivers superior thermal performance in minimal area (SMAF), tighter IR control at elevated temperature, and verified 125°C leakage stability-making it optimal for space- and reliability-critical 24 V industrial power stages.
Availability
B330AF-13 is available at Aetrix Electronics and suitable for boost diodes, blocking diodes, recirculating diodes, and OR-ing diodes requiring stable component supply in industrial power conversion, telecom infrastructure, and embedded control systems.
Supply support for B330AF-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management and signal integrity solutions for industrial, computing, and communications markets.
The B330AF-13 belongs to Diodes' high-current Schottky rectifier product line, engineered specifically for efficiency-critical, thermally demanding DC-DC conversion stages where low VF and controlled high-temperature leakage are essential.
FAQ
What is the maximum junction temperature for continuous operation of B330AF-13?
The B330AF-13 has an operating junction temperature range of –55°C to +150°C. For continuous operation at rated IO = 3 A, thermal design must ensure TJ does not exceed +150°C-achievable with RθJA = 85°C/W and TA ≤ +85°C on standard FR-4 PCB per Figure 4 derating curve.
Is B330AF-13 suitable for use in automotive applications?
B330AF-13 meets AEC-Q200 stress test requirements for passive components but is not AEC-Q101 qualified as a discrete semiconductor. It is used in non-safety-critical automotive subsystems (e.g., infotainment power rails) where ambient temperatures remain within –40°C to +105°C and customer qualification is performed.
How does the SMAF package compare to SMA in thermal performance?
SMAF is a flattened variant of SMA with reduced height (typ. 1.1 mm vs. SMA's 2.3 mm) and identical pad layout. Its RθJA = 85°C/W matches standard SMA when mounted per Diodes' recommended pad dimensions-enabling direct replacement while enabling thinner end-equipment profiles.
Can B330AF-13 replace B320AF-13 in existing designs?
Yes-B330AF-13 shares identical package (SMAF), pinout, VF (0.50 V), and IO (3 A) with B320AF-13, differing only in VRRM (30 V vs. 20 V). It is a direct upgrade where higher reverse voltage margin is needed, with no layout or thermal redesign required.
B330AF-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- DO-221AC, SMA Flat Leads
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 30 V
- Current - Average Rectified (Io):
- 3A
- Voltage - Forward (Vf) (Max) @ If:
- 500 mV @ 3 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 200 µA @ 30 V
- Capacitance @ Vr, F:
- 140pF @ 4V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SMAF
- Operating Temperature - Junction:
- -55°C ~ 150°C
B330AF-13 FAQ
1.How can I place an order for B330AF-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for B330AF-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for B330AF-13 reliable?
The price and inventory of B330AF-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for B330AF-13 is usually 5 days.
3.What payment methods are accepted for B330AF-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for B330AF-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for B330AF-13?
B330AF-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your B330AF-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for B330AF-13?
For technical support, including B330AF-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your B330AF-13 requirements.
6.How does Aetrix verify that B330AF-13 is sourced from the original manufacturer or authorized distributors?
All B330AF-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that B330AF-13 meets industry standards.
7.What is the process for return or replacement of B330AF-13?
All B330AF-13 units undergo pre-shipment inspection (PSI). If there is an issue with B330AF-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The B330AF-13 part is unused and in its original packaging.
Return procedure for B330AF-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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