Diodes Incorporated B330B-13

Overview

B330B-13 from Diodes Incorporated is a 30 V, 3.0 A surface-mount Schottky barrier rectifier in SMB package, featuring 0.70 V forward voltage at 3.0 A, 100 A non-repetitive surge rating, and 20 mA peak reverse current at 100°C - used for low-voltage DC/DC converter output rectification and polarity protection in industrial power supplies.

For engineers reviewing the B330B-13 datasheet, B330B-13 pinout, B330B-13 application, or B330B-13 equivalent, this page delivers verified electrical parameters, thermal resistance (10 °C/W junction-to-terminal), RoHS-compliant lead-free plating, and SMB mechanical dimensions per JEDEC MS-012.

Technical Context

This Schottky rectifier uses guard ring die construction to enhance transient immunity and supports high-frequency switching up to several hundred kHz without significant switching loss penalty. Its low 0.70 V forward drop at rated current directly reduces conduction loss in 3.3 V–5 V output rails.

Thermal performance is defined with a 5.0 mm² copper pad heat sink; junction-to-terminal resistance of 10 °C/W enables reliable operation at 3.0 A average current when terminal temperature is held ≤100°C per derating curve.

Key Specifications

Pinout & Package

SMB (DO-214AA) surface-mount package: cathode band marked on body; anode and cathode terminals only; no internal gate or control pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with SB330-E3/52 and SS33-A, B330B-13 delivers lower forward voltage and tighter thermal resistance specification - enabling higher power density in space-constrained 24 V input/5 V output industrial power stages.

Availability

B330B-13 is available at Aetrix Electronics and suitable for industrial power supplies, IoT adapter designs, and factory automation controllers requiring stable component supply and RoHS-compliant manufacturing.

Supply support for B330B-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in California, with design centers across Asia and manufacturing in Taiwan and China.

The B3xx series targets cost-sensitive, high-volume power conversion applications - optimized for efficiency, thermal performance, and automated assembly in consumer, industrial, and computing power supplies.

FAQ

What is the maximum allowable PCB copper pad size for thermal relief on the B330B-13?

The datasheet specifies thermal resistance testing uses a 5.0 mm² copper pad (0.013 mm thick). Larger pads improve cooling but do not invalidate the 10 °C/W RJT rating - however, pad expansion beyond 10 mm² yields diminishing returns due to lateral conduction limits in FR-4.

Can B330B-13 replace B330-13 (SMC package) in an existing layout?

No - B330B-13 uses SMB (DO-214AA) package with 4.06–4.57 mm width, while B330-13 uses SMC (DO-214AB) with 6.60–7.11 mm width. Footprint and solder stencil must be redesigned; thermal performance also differs due to package mass and pad geometry.

Is the cathode band the only polarity indicator on B330B-13?

Yes - the device features a single cathode band marking per datasheet Figure 1. No notch or secondary mark is guaranteed; orientation must be confirmed visually before placement. The band aligns with the cathode terminal in standard SMB land patterns.

Does B330B-13 meet automotive AEC-Q101 qualification?

No - B330B-13 is not AEC-Q101 qualified. It is rated for industrial temperature range (−55°C to +125°C), but lacks stress test documentation for automotive qualification. For automotive use, consider Diodes' APx30 series or Vishay's VS-3EYH03-M3.