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Diodes Incorporated B330CE-13

Part No.:
B330CE-13
Manufacturer:
Diodes Incorporated
Category:
Single Diodes
Package:
DO-214AB, SMC
Datasheet:
AetrixB330CE-13.pdf
Description:
DIODE SCHOTTKY 30V 3A SMC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:7,308

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Product details

Overview

B330CE-13 from Diodes Incorporated is a 30 V, 3 A surface-mount Schottky barrier rectifier in SMC package, featuring 0.5 V max forward voltage at 3 A and 0.15 mA max reverse leakage at 30 V and +25°C, optimized for high-efficiency DC/DC converter output rectification in industrial power supplies.

For engineers reviewing the B330CE-13 datasheet, B330CE-13 pinout, B330CE-13 application, or B330CE-13 equivalent, key selection criteria include low VF for thermal management, high-temperature IR stability for reliability in enclosed environments, SMC package thermal resistance (RθJC = 30°C/W), and RoHS-compliant matte tin terminations.

Technical Context

This Schottky rectifier uses a platinum-silicide or similar low-barrier metal-semiconductor junction to achieve low forward voltage drop while maintaining controlled reverse leakage. Its design targets continuous conduction mode (CCM) and discontinuous conduction mode (DCM) flyback and buck-derived topologies where fast recovery and minimal switching loss are critical.

The device operates across –55°C to +150°C junction temperature range with thermal resistance junction-to-case of 30°C/W (SMC), enabling direct heatsink mounting in high-power-density designs. Reverse leakage remains stable up to 125°C, mitigating thermal runaway risk in ambient temperatures exceeding 85°C.

Key Specifications

ParameterValue and Actual Design Meaning
VRRM30 V - Maximum repetitive reverse voltage before breakdown; sets safe operating limit in boost or flyback secondary circuits.
IO(AV)3 A - Average forward current rating at TA = +25°C; derates to ~1.8 A at +100°C per Figure 4.
VF(max)0.5 V @ 3 A, +25°C - Low conduction loss improves efficiency by ~0.5–1.2% vs. standard PN diodes in 12 V output rails.
IR(max)0.15 mA @ 30 V, +25°C - Enables stable operation in high-impedance bias networks and low-power standby circuits.
RθJC30°C/W - Junction-to-case thermal resistance supports direct thermal pad attachment for >2 W dissipation without forced air.
CT140 pF @ 4 V, 1 MHz - Low junction capacitance minimizes switching node ringing in high-frequency (>300 kHz) converters.

Pinout & Package

Package: SMC (DO-214AB), molded plastic case with matte tin–annealed copper leadframe, cathode band marking, UL 94V-0 rated, moisture sensitivity level 1.

Pin/TerminalCircuit RoleDesign Meaning
AnodeInput terminal for forward conduction pathConnected to lower-potential node (e.g., switch node in synchronous buck, transformer center-tap in full-wave).
CathodeOutput terminal for forward conduction pathConnected to output rail or filter capacitor; marked with band; carries full load current and must be routed with low-inductance layout.

Key Features

FeatureDesign Value
Low forward voltage0.5 V max at 3 A ensures <0.75 W conduction loss at full load, reducing heatsink requirements in space-constrained 24 V input supplies.
High-temperature leakage stabilityIR ≤ 30 mA at VR = 45 V and TJ = +150°C (typical curve) enables reliable operation in sealed enclosures above 85°C ambient.
Green compound packagingHalogen- and antimony-free molding compound (<900 ppm Br/Cl, <1000 ppm Sb) meets IPC-1752A environmental compliance reporting needs.
Solderable terminationsMatte tin annealed over copper leadframe complies with MIL-STD-202 Method 208, supporting lead-free reflow profiles up to 260°C peak.

Applications

Boost Diode in PFC StageBlocking Diode in Solar Charge Controller

Use Scenario: Used in continuous conduction mode (CCM) boost PFC stage of 300 W industrial AC/DC front-end.

IC Role / Device Role / Timing Role: Unidirectional current path during MOSFET off-time; handles 3 A average output current at 30–40 V output.

Use Value: 0.5 V VF reduces conduction loss by 1.5 W vs. Si PN diode, lowering thermal stress on heatsink and improving system efficiency by 0.8%.

Use Scenario: Prevents reverse current flow from battery to PV panel at night in 24 V nominal solar charge controller.

IC Role / Device Role / Timing Role: Standby-blocking element; sustains 30 V reverse bias with <0.15 mA leakage at room temperature.

Use Value: Low IR prevents >1 mAh/night battery drain, extending usable battery capacity in off-grid systems.

Recirculating Diode in DC Motor DriverOutput Rectifier in Isolated Flyback Supply

Use Scenario: Freewheeling path for inductive kickback in 24 V brushed DC motor H-bridge driver (3 A stall current).

IC Role / Device Role / Timing Role: Clamps inductive voltage spike during MOSFET turn-off; conducts transient current for <10 µs duration.

Use Value: Fast intrinsic recovery and low VF minimize voltage overshoot and reduce snubber losses by ~30% vs. standard FR diodes.

Use Scenario: Secondary-side rectifier in 12 V/2.5 A isolated flyback supply for industrial PLC I/O module.

IC Role / Device Role / Timing Role: Converts transformer AC output to regulated DC; operates at 65 kHz switching frequency with 3 A peak current.

Use Value: 140 pF CT limits high-frequency ringing, easing EMI filter design and reducing need for RC snubbers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SS33HE3/57TSame 30 V/3 A rating; VF = 0.5 V @ 3 A, but RθJC = 40°C/W (SMA); IR = 0.2 mA @ 30 V.Higher thermal resistance limits power handling in thermally constrained layouts; slightly higher leakage affects ultra-low-power standby.Select when SMA footprint compatibility is required and thermal margin ≥15°C exists.
MBR330G30 V/3 A; VF = 0.54 V @ 3 A; RθJC = 25°C/W (TO-220AC); IR = 0.25 mA @ 30 V; through-hole only.Superior thermal performance but requires PCB real estate and wave soldering; not suitable for fully SMT designs.Select for high-reliability, high-ambient-temperature applications where board space permits through-hole mounting.

Compared with SS33HE3/57T and MBR330G, B330CE-13 offers optimal balance of low VF, industry-leading RθJC (30°C/W), and SMC's compact SMT footprint-making it preferred for high-density, convection-cooled industrial power modules where thermal and spatial constraints coexist.

Availability

B330CE-13 is available at Aetrix Electronics and suitable for industrial power supplies, solar charge controllers, and motor drive circuits requiring stable component supply with consistent parametric performance across production lots.

Supply support for B330CE-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.

The B330CE-13 belongs to Diodes' high-reliability Schottky rectifier product line, engineered specifically for high-efficiency, high-temperature industrial and automotive-qualified power conversion applications.

FAQ

What is the maximum junction temperature for continuous operation?

The B330CE-13 has an operating junction temperature range of –55°C to +150°C. Continuous operation at +150°C is permitted provided thermal design maintains actual TJ ≤ +150°C under worst-case ambient and power dissipation conditions, verified using RθJA = 70°C/W (SMC on FR-4) or RθJC = 30°C/W with heatsinking.

Is B330CE-13 suitable for use in automotive applications?

B330CE-13 is not AEC-Q101 qualified and lacks automotive-specific qualification testing (e.g., HTOL, TCT, ESD). While its –55°C to +150°C rating meets automotive under-hood temperature ranges, Diodes Incorporated does not endorse or guarantee its use in safety-critical or automotive OEM applications without additional customer validation.

How does the SMC package compare thermally to SMB for this part?

SMC (RθJC = 30°C/W) provides 40% lower junction-to-case thermal resistance than SMB (RθJC = 50°C/W) for the same B330x series. This allows ~1.4× higher power dissipation before reaching TJ(max), making SMC preferred for >1.5 W continuous operation or high-ambient environments.

Can B330CE-13 replace B330BE-13 in existing designs?

Yes-B330CE-13 and B330BE-13 share identical electrical specifications and thermal characteristics, differing only in package (SMC vs. SMB) and marking code. Layout redesign is required to accommodate SMC's larger footprint (6.22 × 7.11 mm vs. SMB's 3.94 × 4.57 mm), but no circuit requalification is needed for parametric performance.

B330CE-13 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
DO-214AB, SMC
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Technology:
Schottky
Voltage - DC Reverse (Vr) (Max):
30 V
Current - Average Rectified (Io):
3A
Voltage - Forward (Vf) (Max) @ If:
500 mV @ 3 A
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr):
-
Current - Reverse Leakage @ Vr:
150 µA @ 30 V
Capacitance @ Vr, F:
140pF @ 4V, 1MHz
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
SMC
Operating Temperature - Junction:
-55°C ~ 150°C

B330CE-13 FAQ

1.How can I place an order for B330CE-13 through Aetrix?

Please submit a Request for Quotation (RFQ) for B330CE-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for B330CE-13 reliable?

The price and inventory of B330CE-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for B330CE-13 is usually 5 days.

3.What payment methods are accepted for B330CE-13?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for B330CE-13 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for B330CE-13?

B330CE-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your B330CE-13 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for B330CE-13?

For technical support, including B330CE-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your B330CE-13 requirements.

6.How does Aetrix verify that B330CE-13 is sourced from the original manufacturer or authorized distributors?

All B330CE-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that B330CE-13 meets industry standards.

7.What is the process for return or replacement of B330CE-13?

All B330CE-13 units undergo pre-shipment inspection (PSI). If there is an issue with B330CE-13, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The B330CE-13 part is unused and in its original packaging.

Return procedure for B330CE-13:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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