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Diodes Incorporated B3L30LP-7
- Part No.:
- B3L30LP-7
- Manufacturer:
- Diodes Incorporated
- Category:
- Single Diodes
- Package:
- 8-PowerUDFN
- Datasheet:
-
B3L30LP-7.pdf
- Description:
- DIODE SCHOTT 30V 3A U-DFN3030-8
- Quantity:
- Payment:
- Shipping:
Inventory:5,747
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Product details
Overview
B3L30LP-7 from Diodes Incorporated is a 3A, 30V Schottky barrier rectifier in U-DFN3030-8 package, optimized for low-voltage, high-frequency DC/DC conversion, reverse polarity protection, and freewheeling in compact power supplies. It delivers 0.28V forward voltage at 0.5A/25°C, 30A non-repetitive surge capability, and operates from –65°C to +150°C.
For engineers reviewing the B3L30LP-7 datasheet, B3L30LP-7 pinout, B3L30LP-7 application, or B3L30LP-7 equivalent, key selection criteria include its ultra-low VF at high current density, thermal resistance of 3°C/W (junction-to-solder point), RoHS-compliant NiPdAu terminations, and guard ring die construction for transient robustness in automotive and industrial SMPS designs.
Technical Context
This Schottky rectifier uses a planar guard ring die structure to suppress edge leakage and improve surge reliability under repetitive transients. Its low barrier height enables sub-0.3V forward drop at 1A/25°C while maintaining <1mA reverse leakage at 30V/25°C.
Thermal performance is defined for three mounting conditions: 2.5W dissipation on FR-4 (25mm² pad), 4.0W on FR-4 (75mm² pad), and 4.5W on aluminum PCB - enabling precise thermal design in space-constrained layouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 30 V - Maximum repetitive reverse blocking voltage; sets upper limit for input rail protection in 24V systems. |
| IO | 3.0 A - Continuous average forward current; supports sustained 3A output in buck converter freewheel paths. |
| VF @ 1A/25°C | 0.30 V typ - Directly reduces conduction loss by ~0.3W vs. silicon diode, improving efficiency in 5–12V converters. |
| IFSM | 30 A - Non-repetitive peak surge rating; withstands inrush and short-circuit transients in 48V input stages. |
| RθJS | 3 °C/W - Junction-to-solder-point thermal resistance; enables accurate local temperature rise modeling when soldered to copper pour. |
| IR @ 30V/25°C | 0.27 mA max - Low reverse leakage preserves battery runtime in always-on polarity protection circuits. |
| Package | U-DFN3030-8 - 3.0×3.0 mm, 0.6 mm height, 8-terminal exposed-pad package for high-density layout and enhanced thermal transfer. |
Pinout & Package
U-DFN3030-8 is a bottom-exposed thermal pad package with 8 terminals arranged in dual-row configuration. Pin #1 identification is marked by chamfered corner (top view) and "S33" marking code (bottom view). The exposed thermal pad (Pin #8) must be soldered to PCB copper for optimal thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4 | Anode (common) | Parallel anode connections reduce series resistance and current crowding; rated for full 3A continuous conduction. |
| 5, 6, 7 | Cathode (common) | Parallel cathode terminals minimize forward voltage drop and enable uniform current sharing across multiple bond wires. |
| 8 (exposed pad) | Thermal ground / Cathode tie | Electrically connected to cathode; must be soldered to ≥25 mm² copper pour to achieve RθJS = 3°C/W. |
Key Features
| Feature | Design Value |
|---|---|
| Guard ring die construction | Suppresses edge breakdown and improves surge survivability under repetitive 30A IFSM pulses without parameter shift. |
| Low VF at high temperature | 0.29V typ at 1A/125°C - maintains efficiency in thermally stressed environments like enclosed LED drivers. |
| NiPdAu over Cu lead frame | RoHS-compliant, solderable per MIL-STD-202 Method 208; eliminates intermetallic growth issues in reflow cycles. |
| Halogen & antimony free | <900 ppm Br, <900 ppm Cl, <1000 ppm Sb - meets IPC-1752A Class 3 material declaration requirements for green electronics. |
| Moisture sensitivity level | MSL Level 1 (per J-STD-020) - no bake required before assembly; simplifies SMT line handling. |
Applications
| Automotive Body Control Module (BCM) | USB-C Power Delivery Adapter |
|---|---|
Use Scenario: Reverse polarity protection on 12V supply rail feeding microcontroller and CAN transceiver. IC Role / Device Role / Timing Role: Unidirectional current gate preventing damage during battery jump-start misconnection. Use Value: 0.28V VF at 0.5A limits power loss to 140mW, avoiding thermal derating in sealed BCM enclosures. | Use Scenario: Freewheeling path in synchronous rectified flyback converter delivering 20V/3A to USB-PD sink. IC Role / Device Role / Timing Role: High-speed, low-loss secondary-side rectification replacing MOSFET synchronous switch in cost-sensitive designs. Use Value: 30A IFSM handles startup surges; 3°C/W RθJS allows direct thermal coupling to primary-side heatsink via shared PCB layer. |
| Industrial PLC I/O Module | Medical Portable Infusion Pump |
Use Scenario: Output rectification in isolated 5V/2A DC/DC module powering digital isolators and analog front-end. IC Role / Device Role / Timing Role: Primary output rectifier ensuring stable 5V under variable load (10mA–2A) and wide ambient (–40°C to +85°C). Use Value: 0.35V VF at 2A/25°C and <1mA IR at 30V/100°C maintain regulation accuracy and low standby loss. | Use Scenario: Polarity protection on Li-ion battery input (7.4V nominal) to motor driver and MCU. IC Role / Device Role / Timing Role: Fail-safe input diode preventing reverse-current damage during hot-swap battery replacement. Use Value: Guard ring construction ensures long-term reliability under repeated 30A surge events; MSL Level 1 supports automated assembly without moisture sensitivity risk. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SS33H from ON Semiconductor | Same 3A/30V rating but TO-277 package; VF = 0.45V @ 3A/25°C (0.17V higher); RθJA = 65°C/W (vs. 130°C/W for B3L30LP-7 on FR-4). | Requires larger board area; less suitable for ultra-thin adapters or stacked PCBs where height <0.6mm is mandatory. | Select when legacy TO-277 footprint compatibility or higher surge margin (40A IFSM) is prioritized over thermal density. |
| SB330 from Vishay | DO-214AA package; VF = 0.52V @ 3A/25°C; IR = 20mA @ 30V/125°C (70× higher than B3L30LP-7). | Higher conduction loss and leakage limit use in battery-powered devices with >10-year shelf life requirements. | Choose only if through-hole assembly is required or existing DO-214AA footprint must be retained. |
Compared with SS33H and SB330, B3L30LP-7 offers superior thermal density (3°C/W RθJS), lowest VF among 3A 30V Schottkys, and MSL Level 1 handling - making it optimal for high-volume, space-constrained, thermally demanding applications such as USB-C PD adapters and automotive BCMs.
Availability
B3L30LP-7 is available at Aetrix Electronics and suitable for automotive body control modules, USB-C power delivery adapters, and industrial PLC I/O modules requiring stable component supply, consistent parametric performance, and full RoHS/Green compliance.
Supply support for B3L30LP-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.
The B3L30LP-7 belongs to Diodes' high-efficiency Schottky rectifier product line, engineered specifically for low-voltage, high-frequency switching power supplies where minimal conduction loss and compact thermal management are critical.
FAQ
What is the maximum allowable PCB pad size for optimal thermal performance of B3L30LP-7?
The datasheet specifies three validated thermal configurations: 25 mm² pad yields 2.5W power dissipation, 75 mm² pad supports 4.0W, and 75 mm² on aluminum PCB enables 4.5W. For continuous 3A operation at 70°C ambient, a minimum 75 mm² copper pour connected to the exposed thermal pad (Pin #8) is required to maintain junction temperature below 125°C.
Does B3L30LP-7 support reflow soldering per JEDEC J-STD-020?
Yes - B3L30LP-7 is qualified for standard Pb-free reflow profiles (peak 260°C, 20–40 sec above 217°C) and carries MSL Level 1 rating per J-STD-020, meaning it can be stored indefinitely at ≤30°C/60% RH without baking prior to assembly.
How does the guard ring construction improve reliability in automotive applications?
The guard ring mitigates electric field crowding at the die edge, reducing premature avalanche breakdown during load dump transients (ISO 7637-2 Pulse 5a). This extends device lifetime under repeated 30A surge events and prevents parameter drift after 1000+ cycles - critical for 15-year automotive ECU deployments.
Can B3L30LP-7 replace a standard silicon rectifier in an existing 24V/2A power supply?
Yes - with identical 30V VRRM and 3A IO rating, B3L30LP-7 reduces forward loss by ~0.6W at full load versus a typical 1N5822 (VF ≈ 0.85V), lowering case temperature by ~25°C. No circuit changes are needed, but ensure PCB pad layout matches U-DFN3030-8 dimensions and thermal pad is fully soldered.
B3L30LP-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-PowerUDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 30 V
- Current - Average Rectified (Io):
- 3A
- Voltage - Forward (Vf) (Max) @ If:
- 450 mV @ 3 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 1 mA @ 30 V
- Capacitance @ Vr, F:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- U-DFN3030-8
- Operating Temperature - Junction:
- -65°C ~ 150°C
B3L30LP-7 FAQ
1.How can I place an order for B3L30LP-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for B3L30LP-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for B3L30LP-7 reliable?
The price and inventory of B3L30LP-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for B3L30LP-7 is usually 5 days.
3.What payment methods are accepted for B3L30LP-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for B3L30LP-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for B3L30LP-7?
B3L30LP-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your B3L30LP-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for B3L30LP-7?
For technical support, including B3L30LP-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your B3L30LP-7 requirements.
6.How does Aetrix verify that B3L30LP-7 is sourced from the original manufacturer or authorized distributors?
All B3L30LP-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that B3L30LP-7 meets industry standards.
7.What is the process for return or replacement of B3L30LP-7?
All B3L30LP-7 units undergo pre-shipment inspection (PSI). If there is an issue with B3L30LP-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The B3L30LP-7 part is unused and in its original packaging.
Return procedure for B3L30LP-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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