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Diodes Incorporated B550C-13
- Part No.:
- B550C-13
- Manufacturer:
- Diodes Incorporated
- Category:
- Single Diodes
- Package:
- DO-214AB, SMC
- Datasheet:
-
B550C-13.pdf
- Description:
- DIODE SCHOTTKY 50V 5A SMC
- Quantity:
- Payment:
- Shipping:
Inventory:2,937
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Product details
Overview
B550C-13 from Diodes Incorporated is a 50 V, 5.0 A surface-mount Schottky barrier rectifier in SMC package, featuring 0.70 V max forward voltage at 5.0 A and 0.5 mA max reverse leakage at rated VR, optimized for low-voltage, high-frequency polarity protection and freewheeling in DC/DC converters and power supplies.
For engineers reviewing the B550C-13 datasheet, B550C-13 pinout, B550C-13 application, or B550C-13 equivalent, key selection criteria include its 50 V reverse blocking rating, thermal resistance (RθJT = 10 °C/W), JEDEC-qualified reliability, RoHS-compliant lead-free plating, and suitability for automated SMT assembly in industrial and commercial power conversion designs.
Technical Context
This Schottky rectifier uses guard ring die construction to enhance transient robustness and suppress avalanche-induced failure during inductive switching events. Its low VF and fast recovery enable high-efficiency operation in 100 kHz–1 MHz switching topologies without snubber networks.
The device operates across –55 °C to +150 °C junction temperature range with RθJA = 50 °C/W on standard FR-4 PCB (8 mm² copper pad), and exhibits 300 pF typical junction capacitance at 4 V reverse bias-critical for minimizing switching losses and EMI in high-frequency rectification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 50 V - Maximum repetitive reverse voltage before breakdown; sets safe operating limit in 24–48 V bus applications. |
| IO | 5.0 A - Average rectified output current at TA = +25°C; derates to ~3.5 A at TJ = +125°C per Figure 7. |
| VF Max | 0.70 V @ IF = 5.0 A - Low conduction loss enables >92% efficiency in 5 V output buck converters. |
| IR Max | 0.5 mA @ VR = 50 V, TA = +25°C - Minimal leakage preserves battery runtime in always-on systems. |
| RθJT | 10 °C/W - Enables direct thermal coupling to heatsink or copper pour for sustained 5 A operation. |
| CT | 300 pF @ VR = 4 V, f = 1 MHz - Low junction capacitance reduces turn-off loss and ringing in high-speed switching. |
Pinout & Package
Package: SMC (DO-214AB), molded plastic, UL 94V-0 rated, with cathode band marking and matte tin-plated terminals solderable per MIL-STD-202 Method 208.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Current entry point under forward bias | Connected to lower-potential node (e.g., switch node in buck converter); requires thermal relief pad for soldering. |
| Cathode | Current exit point under forward bias; marked with band | Connected to higher-potential rail (e.g., output capacitor positive); serves as primary heat path to PCB copper. |
Key Features
| Feature | Design Value |
|---|---|
| Guard ring die construction | Improves surge immunity against 100 A IFSM (8.3 ms half-sine) without parameter shift or catastrophic failure. |
| Low VF and fast recovery | Eliminates reverse recovery charge (Qrr ≈ 0), removing need for snubbers in 500 kHz flyback or synchronous rectifier designs. |
| JEDEC-qualified reliability | Meets AEC-Q200 stress test requirements for high-reliability commercial and industrial use-not automotive-qualified by default. |
| RoHS- and "Green"-compliant | Contains <900 ppm Br, <900 ppm Cl, <1000 ppm Sb; compatible with lead-free reflow profiles up to 260 °C peak. |
Applications
| DC/DC Converter Freewheeling Diode | Polarity Protection in 24 V Industrial Power Input |
|---|---|
Use Scenario: Placed across the low-side MOSFET in non-synchronous buck converters to recirculate inductor current during off-time. IC Role / Device Role / Timing Role: Uncontrolled freewheeling diode providing continuous current path with minimal voltage drop and zero reverse recovery delay. Use Value: Reduces conduction loss by 35% vs. standard PN rectifier, lowering thermal load on PCB and enabling smaller heatsinks. | Use Scenario: Series-connected at main 24 V DC input to prevent damage from accidental reverse battery connection. IC Role / Device Role / Timing Role: Forward-biased pass element during normal operation; blocks reverse current with 50 V margin above nominal 24 V rail. Use Value: Withstands 100 A surge (IFSM) and maintains <0.5 mA leakage at 25 °C, ensuring long-term reliability in unattended equipment. |
| Low-Voltage AC/DC Adapter Output Rectification | OR-ing Diode in Dual-Input Redundant Power Supplies |
Use Scenario: Secondary-side rectifier in 5 V/3 A wall adapter using flyback topology with 100 kHz switching frequency. IC Role / Device Role / Timing Role: High-frequency rectifying element converting transformer secondary AC to regulated DC output. Use Value: 300 pF capacitance and 0.70 V VF minimize switching loss and output ripple, improving light-load efficiency by ≥4%. | Use Scenario: Used in parallel 12 V inputs where either source may be active, requiring automatic isolation of failed/floating rails. IC Role / Device Role / Timing Role: Unidirectional current gate preventing backfeed between sources while supporting 5 A continuous load sharing. Use Value: Low thermal resistance (10 °C/W) allows stable operation at 5 A without forced air, simplifying dual-rail redundancy design. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SS5P5L-13-F | Same SMC package, 50 V VRRM, but VF = 0.55 V max @ 5 A; higher IR = 1.0 mA @ 25 °C. | Better conduction efficiency at light loads; less suitable for high-temp environments due to elevated leakage. | Select when optimizing for <1 W total loss at 5 A and ambient ≤85 °C. |
| MBR550G | TO-277 package (smaller footprint), 50 V VRRM, VF = 0.72 V max @ 5 A, RθJA = 65 °C/W. | Higher thermal resistance limits sustained 5 A operation without enhanced PCB copper; not tape-and-reel compatible with SMC feeders. | Select only if board space is constrained and thermal budget permits 15 °C higher junction rise at full load. |
Compared with SS5P5L-13-F and MBR550G, B550C-13 offers balanced VF/IR trade-off, JEDEC qualification, and SMC tape-and-reel compatibility-making it optimal for high-volume, thermally managed commercial power supplies requiring proven manufacturability and reliability.
Availability
B550C-13 is available at Aetrix Electronics and suitable for DC/DC converters, industrial 24 V input protection circuits, and low-voltage AC/DC adapters requiring stable component supply, consistent SMT placement yield, and long-term lifecycle support.
Supply support for B550C-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.
The B550C-13 belongs to Diodes' general-purpose Schottky rectifier product line, engineered for cost-sensitive, high-volume commercial power applications demanding low VF, robust surge handling, and automated assembly compatibility.
FAQ
What is the maximum junction temperature for continuous operation?
The B550C-13 supports continuous operation up to +150 °C junction temperature, with derating beginning at +25 °C ambient per Figure 7. At TJ = +125 °C, IO drops to approximately 3.5 A on standard FR-4 PCB with 8 mm² copper pad, based on RθJA = 50 °C/W and thermal equilibrium calculations.
Is B550C-13 suitable for automotive applications?
No-B550C-13 is qualified to JEDEC standards for commercial and industrial use, not AEC-Q200. For automotive-grade equivalents, Diodes offers the B550CQ-13-F variant, which undergoes additional stress testing including temperature cycling, humidity bias, and mechanical shock per AEC-Q200 Rev H.
How does the guard ring structure improve reliability?
The guard ring die construction prevents edge breakdown during voltage transients by redistributing electric field concentration away from the silicon periphery. This allows the device to withstand 100 A non-repetitive surge (IFSM) without parameter degradation or short-circuit failure, extending lifetime in inductive load switching.
What is the recommended PCB pad layout for thermal performance?
Diodes specifies a minimum 8.0 mm² (0.033 mm thick) copper pad for thermal relief. The recommended SMC pad layout-available in their package outline document-uses 6.90 mm × 4.40 mm lands with 2.50 mm spacing (X), 9.40 mm overall length (X1), and 3.30 mm width (Y) to ensure solder joint integrity and optimal heat transfer to internal layers.
B550C-13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- DO-214AB, SMC
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 50 V
- Current - Average Rectified (Io):
- 5A
- Voltage - Forward (Vf) (Max) @ If:
- 700 mV @ 5 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 500 µA @ 50 V
- Capacitance @ Vr, F:
- 300pF @ 4V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SMC
- Operating Temperature - Junction:
- -55°C ~ 125°C
B550C-13 FAQ
1.How can I place an order for B550C-13 through Aetrix?
Please submit a Request for Quotation (RFQ) for B550C-13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for B550C-13 reliable?
The price and inventory of B550C-13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for B550C-13 is usually 5 days.
3.What payment methods are accepted for B550C-13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for B550C-13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for B550C-13?
B550C-13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your B550C-13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for B550C-13?
For technical support, including B550C-13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your B550C-13 requirements.
6.How does Aetrix verify that B550C-13 is sourced from the original manufacturer or authorized distributors?
All B550C-13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that B550C-13 meets industry standards.
7.What is the process for return or replacement of B550C-13?
All B550C-13 units undergo pre-shipment inspection (PSI). If there is an issue with B550C-13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The B550C-13 part is unused and in its original packaging.
Return procedure for B550C-13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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