Nexperia USA Inc. BAS116,235

Overview

BAS116,235 from Nexperia is a low-leakage epitaxial medium-speed switching diode in SOT23 package, featuring 3 pA typical reverse leakage at 75 V, 0.8 µs typical reverse recovery time, and AEC-Q101 qualification for automotive use. It serves as a precision clamping or signal steering diode in high-impedance analog front-ends and sensor bias networks.

For engineers reviewing the BAS116,235 datasheet, BAS116,235 pinout, BAS116,235 application, or BAS116,235 equivalent, key selection criteria include ultra-low IR at elevated temperature, SOT23 footprint compatibility with space-constrained PCB layouts, and validated automotive reliability per AEC-Q101 stress testing.

Technical Context

The BAS116,235 employs an epitaxial planar structure optimized for low junction capacitance (2 pF at 0 V) and stable reverse leakage across temperature-typical IR rises only to 3 nA at 25 °C and 80 nA at 150 °C under 75 V bias. Its 0.8 µs trr enables reliable operation in medium-frequency (<1 MHz) switching and sampling circuits.

Designed for surface-mounted low-power signal path integrity, it operates within a −65 °C to +150 °C junction range and dissipates up to 250 mW at 25 °C ambient on FR4 PCB. The SOT23 package supports reflow and wave soldering with defined land patterns per JEDEC TO-236AB.

Key Specifications

Pinout & Package

SOT23 plastic surface-mount package (JEDEC TO-236AB), 3-terminal, 1.9 mm pitch, 2.9 × 1.3 × 1.0 mm body. Standard footprint per Nexperia sot023_fr (reflow) and sot023_fw (wave).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-leakage switching diode applications.

Compared with NSVRBAS116WT1G and VS-3BAS116-M3/84A, the BAS116,235 uniquely combines AEC-Q101 qualification, 3 pA leakage, and SOT23 packaging-making it the sole option for production automotive signal-path protection where both reliability and nanoampere-level leakage control are mandatory.

Availability

BAS116,235 is available at Aetrix Electronics and suitable for automotive cabin sensors, industrial current sensing, medical wearable biosensors, and test & measurement front-ends requiring stable component supply and long-term lifecycle support.

Supply support for BAS116,235 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with core competencies in efficiency, miniaturization, and automotive-grade quality.

The BAS116,235 belongs to Nexperia's AEC-Q101-qualified low-leakage diode product line, engineered specifically for signal integrity preservation in automotive and industrial analog interfaces where nanoampere-level leakage and robust thermal performance are design-critical.

FAQ

What is the maximum continuous forward current for BAS116,235 at 70 °C ambient?

At 70 °C ambient temperature on a standard FR4 PCB, the maximum continuous forward current is derated to approximately 140 mA, based on the linear derating curve in Figure 1 of the datasheet (250 mW total power dissipation limit and 500 K/W Rth(j-a)). This ensures junction temperature remains ≤150 °C under steady-state conditions.

Is BAS116,235 suitable for bidirectional ESD protection?

No. The BAS116,235 is a unidirectional diode with anode and cathode terminals; it provides clamping only in one polarity. For bidirectional ESD protection, a dedicated TVS diode such as PESD5V0S1BA should be used instead-BAS116,235 is intended for precision signal steering or unidirectional overvoltage limiting.

Does the 'n.c.' pin require PCB trace routing or grounding?

No. Pin 2 is internally not connected and must remain un-routed and un-soldered on the PCB. Routing or grounding this pin introduces unnecessary parasitic capacitance and mechanical stress risk, potentially degrading trr consistency and long-term reliability-per Nexperia's pinning diagram and layout guidelines.

How does BAS116,235 perform at junction temperatures above 125 °C?

At 150 °C junction temperature, reverse leakage increases to 80 nA (max) under 75 V bias-still within functional limits for many automotive applications-but forward voltage drops slightly to ~0.95 V. Thermal resistance data confirms Rth(j-sp) = 330 K/W to cathode solder point, enabling effective heat extraction in thermally optimized layouts.