Nexperia USA Inc. BAS116VYX

Overview

BAS116VYX from Nexperia is a low-leakage triple switching diode in SOT363-3 (TSSOP6) package, comprising three electrically isolated epitaxial diodes optimized for surface-mounted circuits requiring minimal reverse current. It delivers max 5 nA leakage at 75 V reverse bias, 0.8 µs typical reverse recovery time, and supports 500 mA repetitive peak forward current per diode.

For engineers reviewing the BAS116VYX datasheet, BAS116VYX pinout, BAS116VYX application, or BAS116VYX equivalent, key selection criteria include leakage sensitivity in precision bias networks, multi-diode integration density in space-constrained layouts, thermal resistance (500 K/W), and compatibility with reflow/wave soldering footprints for high-yield SMT assembly.

Technical Context

The BAS116VYX integrates three independent, electrically isolated silicon switching diodes in a single compact SOT363-3 package-enabling discrete-level isolation without board-level routing overhead. Its epitaxial construction ensures stable low-leakage performance across temperature (3 nA typical at 150 °C junction).

Designed for medium-speed switching (trr = 0.8 µs typ), it operates within 75 V continuous reverse voltage and handles pulsed forward currents up to 10 A (tp = 50 µs), while maintaining low capacitance (2 pF at 0 V) for signal integrity in timing and sensing paths.

Key Specifications

Pinout & Package

Package: SOT363-3 (TSSOP6), 6-pin surface-mount plastic package with 0.65 mm pitch, 2.2 mm × 1.35 mm body, and exposed pad-compatible footprint per Fig. 7–8 of datasheet.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar triple low-leakage diode applications.

Compared with NSR3G0501MX and BAV99W, the BAS116VYX uniquely combines triple isolation, 5 nA leakage, and 0.8 µs trr in one SOT363-3 device-making it irreplaceable for space-constrained, ultra-low-leakage multi-channel analog front-ends.

Availability

BAS116VYX is available at Aetrix Electronics and suitable for high-reliability sensor interface design, multi-rail power OR-ing, compact ESD protection arrays, and level-shifting interface clamping requiring stable component supply and long-term production continuity.

Supply support for BAS116VYX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance, reliable discrete, logic, and MOSFET solutions for automotive, industrial, and consumer markets.

The BAS116VYX belongs to Nexperia's low-leakage switching diode product line, engineered specifically for surface-mounted applications demanding minimal reverse current, tight thermal behavior, and multi-diode integration in ultra-compact packages.

FAQ

What is the maximum allowable junction temperature for BAS116VYX during continuous operation?

The absolute maximum junction temperature for BAS116VYX is 150 °C, as defined in Table 5 of the datasheet. Continuous operation at this temperature requires strict adherence to derated power dissipation (Ptot ≤ 250 mW at Tamb ≤ 25 °C) and thermal management via PCB copper area or airflow. Exceeding 150 °C risks permanent parametric shift or failure.

Can BAS116VYX be used in automotive applications?

No-BAS116VYX is not automotive-qualified. The Nexperia datasheet explicitly states in Section 15 that non-automotive qualified products are "neither qualified nor tested in accordance with automotive testing or application requirements." It lacks AEC-Q101 stress qualification and is intended for industrial, consumer, and computing applications only.

How does the SOT363-3 package differ from standard SOT363?

The SOT363-3 variant features tighter dimensional tolerances and updated mold compound formulation versus legacy SOT363, as confirmed in Table 8 revision history. Key differences include refined lead coplanarity (0.10 mm max vs. 0.15 mm), improved moisture sensitivity level (MSL3), and enhanced reflow profile compatibility per Fig. 7 footprint dimensions.

Is there a recommended PCB layout for minimizing thermal resistance?

Yes-the datasheet specifies mounting on FR4 PCB with single-sided copper, tin-plated, and standard footprint (Fig. 7). To achieve the rated 500 K/W Rth(j-a), use ≥10 mm² of 1 oz copper connected to each cathode/anode pad via ≥0.3 mm thermal vias, and avoid silkscreen or solder mask over thermal pads. No thermal pad is present in SOT363-3, so copper area is the sole heat path.