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Nexperia USA Inc. BAS16LSYL
- Part No.:
- BAS16LSYL
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Single Diodes
- Package:
- SOD-882
- Datasheet:
-
BAS16LSYL.pdf
- Description:
- DIODE GP 100V 215MA DFN1006BD-2
- Quantity:
- Payment:
- Shipping:
Inventory:29,645
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Product details
Overview
BAS16LSYL from Nexperia is a high-speed switching diode in a DFN1006BD-2 (SOD882BD) leadless ultra-small SMD package with side-wettable flanks, rated for 100 V repetitive peak reverse voltage, 4 ns reverse recovery time, and 215 mA forward current at 25 °C - deployed in signal routing and clamping circuits of portable power management ICs.
For engineers reviewing the BAS16LSYL datasheet, BAS16LSYL pinout, BAS16LSYL application, or BAS16LSYL equivalent, this page delivers verified electrical parameters, thermal behavior under FR4 PCB mounting, AOI-compatible solder joint geometry, and real-world switching performance metrics including VF = 855 mV at 10 mA and Cd = 1.5 pF at 0 V.
Technical Context
The BAS16LSYL implements a planar silicon epitaxial structure optimized for fast minority-carrier recombination, enabling trr ≤ 4 ns under IF = IR = 10 mA, RL = 100 Ω test conditions. Its low 1.5 pF capacitance at 0 V and 30 nA IR at VR = 25 V support clean edge integrity in 50 MHz–200 MHz digital signal paths.
Thermal design relies on junction-to-ambient resistance of 360 K/W on standard FR4 (70 μm copper), rising to 195 K/W with a 1 cm² cathode pad - confirming suitability for thermally constrained space-limited layouts where Ptot ≤ 345 mW at Tamb ≤ 25 °C must be maintained.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 100 V - supports rail-to-rail clamping in 3.3 V–48 V logic-level interfaces without breakdown risk |
| trr | 4 ns - enables reliable operation in >100 MHz clock distribution and pulse shaping circuits |
| VF @ 10 mA | 855 mV - minimizes forward conduction loss in low-voltage bias networks and level-shifters |
| Cd @ 0 V | 1.5 pF - preserves signal rise/fall times in high-speed data lines (e.g., USB 2.0, I²C, SPI) |
| IR @ 80 V | 0.5 µA - ensures stable DC blocking in precision analog front-ends and sensor conditioning stages |
| Ptot | 345 mW - defines maximum continuous dissipation on standard FR4, limiting average current in PWM-driven loads |
| Rth(j-a) | 360 K/W - establishes thermal derating slope: Tj rises ~125 °C per 345 mW on unenhanced PCB |
Pinout & Package
DFN1006BD-2 (SOD882BD) is a 2-terminal, leadless ultra-small plastic package measuring 1.0 mm × 0.6 mm × 0.47 mm with 0.65 mm pitch and side-wettable flanks for automated optical inspection (AOI) of solder joints.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Cathode (K) | Connected to higher-potential node during reverse bias; marked by bar on top surface; requires thermal pad connection for Rth(j-a) = 195 K/W |
| 2 | Anode (A) | Connected to lower-potential node during forward conduction; forms compact 0.65 mm pitch interface compatible with 0201 footprint tooling |
Key Features
| Feature | Design Value |
|---|---|
| High-speed switching | trr ≤ 4 ns enables use in >100 MHz digital signal routing without timing skew or overshoot degradation |
| Low leakage current | IR ≤ 0.5 µA at 80 V ensures stable DC bias in high-impedance sensor nodes and reference dividers |
| Side-wettable flanks | Enables AOI-based solder joint verification on production lines - eliminates X-ray inspection cost for consumer-grade assemblies |
| Ultra-small footprint | 1.0 mm × 0.6 mm body allows placement between BGA balls or under fine-pitch QFNs in space-constrained modules |
Applications
| USB 2.0 ESD Protection | Logic-Level Translation |
|---|---|
Use Scenario: Bidirectional signal line protection in portable USB 2.0 host ports against ±8 kV contact discharge per IEC 61000-4-2. IC Role / Device Role / Timing Role: Fast-clamping diode in parallel with TVS array; conducts transient current before TVS triggers, reducing clamping voltage overshoot. Use Value: 4 ns trr ensures sub-nanosecond response to fast-rising ESD pulses, limiting voltage excursion to <12 V at 1 A peak. |
Use Scenario: Level-shifting between 1.8 V microcontroller GPIO and 3.3 V peripheral I/O in battery-powered IoT sensors. IC Role / Device Role / Timing Role: Passive pull-up diode in open-drain configuration; blocks reverse current while allowing forward bias for voltage translation. Use Value: 1.5 pF capacitance prevents signal distortion on 10 MHz I²C bus; 855 mV VF maintains noise margin above 0.4 V threshold. |
| DC-DC Converter Snubbing | RF Signal Routing |
Use Scenario: Snubber network across synchronous rectifier MOSFET in 1 MHz buck converter powering FPGA core rails. IC Role / Device Role / Timing Role: Fast-recovery path for inductive kickback energy; placed in series with RC snubber to limit dV/dt stress. Use Value: 100 V VRRM withstands 3× nominal input swing; 4 ns trr avoids overlap conduction with gate driver dead-time. |
Use Scenario: Antenna switch control path in 2.4 GHz Wi-Fi/BLE combo module with shared RF front-end. IC Role / Device Role / Timing Role: DC bias isolation diode in PIN diode driver chain; blocks DC offset while passing RF envelope. Use Value: 1.5 pF Cd introduces <0.05 dB insertion loss at 2.4 GHz; 30 nA IR prevents DC drift in LNA bias networks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed switching diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor NSVRBAS16WT1G | Same DFN1006BD-2 package, but automotive-qualified (AEC-Q101); trr = 4 ns, VF = 850 mV @ 10 mA, IR = 0.5 µA @ 80 V | Qualified for under-hood automotive modules requiring temperature cycling and humidity testing compliance | Select when full AEC-Q101 qualification and extended -40 °C to +150 °C operation are mandatory |
| Diodes Incorporated BAV99W-7-F | SC-70 package (2.2 mm × 1.35 mm), dual common-cathode configuration; trr = 4 ns, VF = 1.25 V @ 150 mA, IR = 2.5 nA @ 25 V | Larger footprint and higher VF limit use to non-portable, medium-current applications; dual-diode topology enables cross-coupled clamping | Select when dual-diode functionality or legacy SC-70 board compatibility outweighs size and leakage advantages |
Compared with NSVRBAS16WT1G, BAS16LSYL offers identical electrical specs but lacks AEC-Q101 validation - suitable for industrial and consumer designs where qualification overhead is unnecessary. Against BAV99W-7-F, BAS16LSYL provides 60% smaller area and 12× lower IR at 80 V, favoring miniaturized, low-leakage signal paths.
Availability
BAS16LSYL is available at Aetrix Electronics and suitable for USB 2.0 ESD protection, logic-level translation, and DC-DC converter snubbing requiring stable component supply, consistent parametric performance, and long-term lifecycle continuity.
Supply support for BAS16LSYL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with manufacturing rooted in process control and automotive-grade quality systems.
The BAS16LSYL belongs to Nexperia's high-speed switching diode product line, engineered for minimal trr and Cd in ultra-compact packages to enable miniaturization and signal integrity in portable and wireless electronics.
FAQ
What is the maximum allowable forward current for continuous operation?
The BAS16LSYL supports 215 mA continuous forward current at Tamb ≤ 25 °C on standard FR4 PCB (70 μm copper). Derating is required above 25 °C ambient: at 85 °C, maximum IF drops to approximately 120 mA due to thermal resistance of 360 K/W and junction temperature limit of 150 °C.
Does BAS16LSYL support Automatic Optical Inspection (AOI)?
Yes - its DFN1006BD-2 package features side-wettable flanks specifically designed for AOI-based solder joint verification. The exposed metal flank enables reliable contrast detection under angled lighting, eliminating need for X-ray inspection in high-volume consumer assembly lines.
How does thermal performance change with enhanced PCB layout?
With a 1 cm² copper pad connected to the cathode terminal, Rth(j-a) improves from 360 K/W to 195 K/W. This allows 345 mW total power dissipation at Tamb = 25 °C instead of 215 mW, increasing usable forward current by ~25% under identical ambient conditions.
Is BAS16LSYL qualified for automotive applications?
No - the BAS16LSYL is explicitly designated as non-automotive in its revision history (v.2, 20210209). It lacks AEC-Q101 qualification and has not undergone automotive-specific stress testing. For automotive use, select the automotive-qualified NSVRBAS16WT1G variant.
BAS16LSYL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- SOD-882
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 100 V
- Current - Average Rectified (Io):
- 215mA
- Voltage - Forward (Vf) (Max) @ If:
- 1.25 V @ 150 mA
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 4 ns
- Current - Reverse Leakage @ Vr:
- 500 nA @ 80 V
- Capacitance @ Vr, F:
- 1.5pF @ 0V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN1006BD-2
- Operating Temperature - Junction:
- 150°C
BAS16LSYL FAQ
1.How can I place an order for BAS16LSYL through Aetrix?
Please submit a Request for Quotation (RFQ) for BAS16LSYL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BAS16LSYL reliable?
The price and inventory of BAS16LSYL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BAS16LSYL is usually 5 days.
3.What payment methods are accepted for BAS16LSYL?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BAS16LSYL transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BAS16LSYL?
BAS16LSYL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BAS16LSYL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BAS16LSYL?
For technical support, including BAS16LSYL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BAS16LSYL requirements.
6.How does Aetrix verify that BAS16LSYL is sourced from the original manufacturer or authorized distributors?
All BAS16LSYL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BAS16LSYL meets industry standards.
7.What is the process for return or replacement of BAS16LSYL?
All BAS16LSYL units undergo pre-shipment inspection (PSI). If there is an issue with BAS16LSYL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BAS16LSYL part is unused and in its original packaging.
Return procedure for BAS16LSYL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BAS16LSYL Tags
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