Diodes Incorporated BAS16Q-13-F

Overview

BAS16Q-13-F from Diodes Incorporated is an AEC-Q101 qualified surface-mount fast switching diode in SOT23 package, with 75 V peak repetitive reverse voltage, 300 mA forward current rating, and 4.0 ns reverse recovery time. It serves as a general-purpose high-speed switching element in automotive signal routing, logic clamping, and protection circuits.

For engineers reviewing the BAS16Q-13-F datasheet, BAS16Q-13-F pinout, BAS16Q-13-F application, or BAS16Q-13-F equivalent, key selection criteria include reverse recovery time, leakage current at elevated temperature, AEC-Q101 qualification status, SOT23 thermal resistance (357 °C/W), and compatibility with automated SMT assembly.

Technical Context

This diode employs a planar epitaxial silicon structure optimized for low charge storage and rapid carrier recombination, enabling sub-4 ns reverse recovery under 10 mA IF/IR conditions with 100 Ω load. Its junction design supports stable operation from −55 °C to +150 °C with <50 µA leakage at VR = 75 V and TJ = +150 °C.

The device uses matte tin–annealed Alloy 42 leadframe terminals, rated for MIL-STD-202 solderability, and is packaged in halogen-free, UL 94V-0 compliant molding compound-meeting automotive PPAP and IATF 16949 manufacturing requirements.

Key Specifications

Pinout & Package

Package: SOT23 - surface-mount plastic package with 3-terminal configuration, 0.008 g mass, moisture sensitivity level 1 per J-STD-020, and UL 94V-0 flammability rating.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fast switching diode applications.

Compared with MMBD4148-13-F and BAS16-13-F, the BAS16Q-13-F adds verified automotive qualification, full PPAP readiness, and IATF 16949 production traceability-without compromising speed, leakage, or thermal performance-making it the sole choice for safety-critical vehicle subsystems.

Availability

BAS16Q-13-F is available at Aetrix Electronics and suitable for automotive body electronics, industrial programmable logic controller (PLC) input stages, and USB interface protection requiring stable component supply and long-term lifecycle assurance.

Supply support for BAS16Q-13-F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.

The BAS16Q series belongs to Diodes' automotive-qualified switching diode product line, engineered specifically for high-reliability signal routing, clamping, and protection in harsh-environment vehicle systems.

FAQ

What does the "Q" suffix signify in BAS16Q-13-F?

The "Q" denotes AEC-Q101 qualification, PPAP capability, and manufacture in IATF 16949 certified facilities. It confirms compliance with automotive reliability testing (including temperature cycling, humidity bias, and ESD), full lot traceability, and controlled change management-not present in standard BAS16-13-F or MMBD4148-13-F variants.

Is BAS16Q-13-F pin-compatible with MMBD4148-13-F?

Yes-both use identical SOT23-3 package with anode-cathode-anode pinout (pins 1 and 3 are anode, pin 2 is cathode). The BAS16Q-13-F maintains full mechanical and electrical compatibility, allowing drop-in replacement where automotive qualification is required.

What is the maximum operating temperature for continuous use?

The device is rated for continuous operation from −55 °C to +150 °C junction temperature. At TA = +85 °C, derating reduces maximum power dissipation to ~200 mW based on the 357 °C/W R_θJA curve-verified per Figure 1 in DS12003 Rev. 33-2.

How does BAS16Q-13-F differ from standard BAS16-13-F in thermal performance?

No difference: both share identical SOT23 package construction, 357 °C/W R_θJA, and 350 mW PD rating at 25 °C. Thermal behavior is governed by package geometry and PCB layout-not qualification level-so thermal design rules apply identically across BAS16, BAS16Q, and MMBD4148 variants.