Nexperia USA Inc. BAS16QAZ
- Part No.:
- BAS16QAZ
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Single Diodes
- Package:
- 3-XDFN Exposed Pad
- Datasheet:
-
BAS16QAZ.pdf
- Description:
- DIODE GP 100V 290MA DFN1010D-3
- Quantity:
- Payment:

- Shipping:

Inventory:6,219
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BAS16QA from Nexperia is a single high-speed switching diode in a DFN1010D-3 (SOT1215) package, designed for signal routing and clamping in high-frequency digital logic interfaces. It delivers trr ≤ 4 ns reverse recovery time, VR = 100 V maximum reverse voltage, and VF = 1.25 V at IF = 150 mA, enabling reliable operation in 5 V and 3.3 V CMOS/TTL level-shifting and protection circuits.
For engineers reviewing the BAS16QA datasheet, BAS16QA pinout, BAS16QA application, or BAS16QA equivalent, key selection criteria include ultra-fast switching performance, low leakage (IR ≤ 0.5 µA at VR = 80 V), minimal capacitance (Cd ≤ 1.5 pF), and compatibility with AOI-enabled SMT assembly on space-constrained PCBs.
Technical Context
The BAS16QA operates as a unidirectional silicon switching diode optimized for discrete-level signal integrity in high-speed digital systems. Its junction structure supports fast carrier recombination, achieving trr ≤ 4 ns under standardized test conditions (IF = IR = 10 mA, RL = 100 Ω). The device exhibits low forward voltage drop (VF = 1.25 V typ. at 150 mA) and negligible capacitance (1.5 pF at 0 V), minimizing signal distortion in data path clamping and transient suppression.
Thermal design is enabled by its ultra-thin 0.37 mm profile and side-wettable flanks (SWF) in the DFN1010D-3 package, delivering Rth(j-sp) = 265 K/W to solder point and supporting continuous IF up to 290 mA at Tamb = 25 °C on standard FR4 PCBs. Pin 2 is internally not connected - confirmed via Nexperia's official pinning diagram and package outline.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Recovery Time (trr) | ≤ 4 ns - enables clean edge transitions in >100 MHz digital signal routing without tailing or ringing |
| Reverse Voltage (VR) | 100 V - supports interface protection across industrial I/O, USB, and legacy bus lines |
| Forward Voltage (VF) | 1.25 V @ 150 mA - minimizes power loss and self-heating in high-duty-cycle switching paths |
| Reverse Leakage (IR) | ≤ 0.5 µA @ 80 V - ensures signal integrity in high-impedance logic nodes and sample-hold circuits |
| Diode Capacitance (Cd) | ≤ 1.5 pF @ 0 V - preserves bandwidth in RF detector inputs and high-speed data line clamping |
| Package | DFN1010D-3 (SOT1215) - 1.1 × 1.0 × 0.37 mm, AOI-compatible, side-wettable flanks for solder joint inspection |
| Thermal Resistance (Rth(j-sp)) | 265 K/W - allows direct thermal coupling to copper pour for sustained 290 mA operation on FR4 |
Pinout & Package
Encapsulated in the DFN1010D-3 (SOT1215) leadless plastic package, the BAS16QA features a 0.75 mm pitch, visible side pads for automated optical inspection, and a total height of just 0.37 mm - ideal for ultra-thin portable electronics and dense BGA-adjacent routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Anode (A) | Forward current entry point; connects to higher-potential node in clamping or steering configurations |
| 2 | Not Connected (n.c.) | No internal bond wire or die connection; must remain floating - no PCB trace or thermal pad required |
| 3 & 4 | Cathode (K) | Common cathode terminals - both electrically tied internally; used for low-inductance return path and thermal conduction |
Key Features
| Feature | Design Value |
|---|---|
| High-Speed Switching | trr ≤ 4 ns enables use in 100+ MHz clock distribution networks and ESD-transient clamping without propagation delay penalty |
| Ultra-Small Footprint | 1.1 mm × 1.0 mm body area reduces PCB real estate by >60% vs. SOT23-3, critical for wearables and miniaturized IoT sensors |
| Side-Wettable Flanks (SWF) | Exposed copper sidewalls allow X-ray and AOI verification of solder fillet formation - eliminates hidden void risks in automated assembly |
| Low Capacitance | 1.5 pF Cd minimizes loading on high-impedance analog inputs (e.g., ADC reference dividers) and preserves rise/fall times in LVDS receivers |
| Thermal Performance | Rth(j-sp) = 265 K/W enables 290 mA continuous conduction without external heatsinking on standard FR4 with cathode pad |
Applications
| USB 2.0 Data Line Protection | CMOS Level Shifting |
|---|---|
Use Scenario: Clamping ESD transients on D+ and D− lines of USB 2.0 host/device ports per IEC 61000-4-2 Level 4. IC Role / Device Role / Timing Role: Discrete bidirectional transient voltage suppressor placed between data line and ground, leveraging fast trr to avoid signal distortion during hot-plug events. Use Value: 1.5 pF capacitance prevents signal integrity degradation at 480 Mbps; 100 V VR withstands system-level surge tests without breakdown. | Use Scenario: Translating logic signals between 3.3 V microcontroller GPIO and 5 V peripheral I²C/SPI buses. IC Role / Device Role / Timing Role: Unidirectional level translator using diode-drop biasing, where BAS16QA provides forward conduction path while blocking reverse leakage. Use Value: 1.25 V VF ensures predictable voltage offset; 0.5 µA IR at 80 V prevents false triggering in high-impedance pull-up networks. |
| RF Detector Input Clamping | Digital Logic Signal Steering |
Use Scenario: Protecting the input of a logarithmic RF detector IC from overvoltage during antenna mismatch or transmit leakage. IC Role / Device Role / Timing Role: Front-end clamp diode shunting excess RF energy to ground before it reaches sensitive detector circuitry. Use Value: 4 ns trr avoids rectification artifacts in 900 MHz ISM band applications; low Cd preserves detector linearity up to 2.4 GHz. | Use Scenario: Steering interrupt signals from multiple sensors to a shared MCU input pin using wired-OR configuration. IC Role / Device Role / Timing Role: Anode-connected sensor output, cathode tied to MCU input - isolates sources while enabling logical OR behavior. Use Value: Fast recovery prevents cross-talk between active sensors; 290 mA IF rating supports multiple parallel paths without derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed switching diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor NSR1030HT1G | trr = 3.5 ns (slightly faster); VF = 1.0 V @ 100 mA; same DFN1006-3 package but 0.6 mm × 1.0 mm footprint | Lower VF improves efficiency in battery-powered clamping; smaller footprint eases routing in ultra-dense layouts | Select when <1 ns trr reduction and sub-1 V forward drop justify tighter layout constraints and different land pattern |
| Diodes Incorporated BAV99WQ-7-F | Dual diode in SOT-363; trr = 4 ns; VR = 70 V; Cd = 2 pF; includes matched pair for differential clamping | Supports dual-line protection (e.g., RS-485) in one package; lower VR limits use to 3.3 V/5 V systems only | Select when protecting complementary signal pairs or requiring matched characteristics across two channels |
Compared with NSR1030HT1G and BAV99WQ-7-F, the BAS16QA offers superior VR margin (100 V vs. 70 V), identical trr performance, and larger cathode thermal pad area - making it preferred for industrial I/O protection where voltage headroom and thermal robustness outweigh footprint savings.
Availability
BAS16QA is available at Aetrix Electronics and suitable for USB 2.0 interface protection, CMOS logic level translation, and RF detector front-end clamping requiring stable component supply, consistent parametric performance, and long-term production continuity.
Supply support for BAS16QA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-grade and industrial-standard components.
The BAS16QA belongs to Nexperia's high-speed switching diode product line, engineered specifically for signal integrity preservation in compact, high-frequency digital systems - emphasizing speed, low capacitance, and AOI-ready packaging.
FAQ
Is BAS16QA automotive qualified?
No. Per Nexperia's revision history (v.3, October 2024), the BAS16QA is explicitly designated as non-automotive qualified. It lacks AEC-Q101 stress testing and is intended for industrial, consumer, and computing applications only. Automotive alternatives - such as the BAS16QAZ variant - are separately qualified and marked with "-Q" suffixes.
What is the function of Pin 2 (n.c.) on BAS16QA?
Pin 2 is internally not connected - confirmed in Nexperia's official pinning table and package drawing. It must remain unconnected on the PCB: no trace, no thermal pad, and no solder mask opening. This terminal serves only as a mechanical alignment aid and does not participate in electrical or thermal performance.
Can BAS16QA replace BAT54-type Schottky diodes?
No - the BAS16QA is a silicon PN junction diode, not a Schottky. While both offer fast switching, the BAS16QA has higher VF (1.25 V vs. ~0.3 V) and lower VR tolerance than typical BAT54 variants (30 V). It is unsuitable for low-voltage (<3 V) or ultra-low-loss applications where Schottky characteristics are essential.
Does BAS16QA require special reflow profile considerations?
Yes. Due to its DFN1010D-3 package with side-wettable flanks, BAS16QA requires precise stencil aperture design (0.35 mm × 0.45 mm per flank) and peak reflow temperature control (260 °C max, per J-STD-020). The 0.37 mm height demands tight coplanarity control (<0.05 mm) to ensure uniform solder wetting on all three terminals.
BAS16QAZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- BAS16
- Package/Case:
- 3-XDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 100 V
- Current - Average Rectified (Io):
- 290mA
- Voltage - Forward (Vf) (Max) @ If:
- 1.25 V @ 150 mA
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 4 ns
- Current - Reverse Leakage @ Vr:
- 500 nA @ 80 V
- Capacitance @ Vr, F:
- 1.5pF @ 0V, 1MHz
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN1010D-3
- Operating Temperature - Junction:
- 150°C (Max)
BAS16QAZ FAQ
1.How can I place an order for BAS16QAZ through Aetrix?
Please submit a Request for Quotation (RFQ) for BAS16QAZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BAS16QAZ reliable?
The price and inventory of BAS16QAZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BAS16QAZ is usually 5 days.
3.What payment methods are accepted for BAS16QAZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BAS16QAZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BAS16QAZ?
BAS16QAZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BAS16QAZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BAS16QAZ?
For technical support, including BAS16QAZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BAS16QAZ requirements.
6.How does Aetrix verify that BAS16QAZ is sourced from the original manufacturer or authorized distributors?
All BAS16QAZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BAS16QAZ meets industry standards.
7.What is the process for return or replacement of BAS16QAZ?
All BAS16QAZ units undergo pre-shipment inspection (PSI). If there is an issue with BAS16QAZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BAS16QAZ part is unused and in its original packaging.
Return procedure for BAS16QAZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BAS16QAZ Tags

-
1N4448X-TP
Micro Commercial Co

-
1N4148WX-TP
Micro Commercial Co

-
1N4148TR
onsemi

-
MMSD4148T1G
onsemi

-
MMBD914LT3G
onsemi

-
BAS16HT1G
onsemi

-
1N914BWT
onsemi

-
BAS21LT1G
onsemi

-
LL4148
onsemi

-
BAS16LT1G
onsemi

-
MMSD914T1G
onsemi

-
BAV21W-7-F
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

