Infineon Technologies BAS3007ARPPE6327HTSA1

Overview

BAS3007ARPPE6327HTSA1 from Infineon Technologies is a quad-channel low-VF Schottky diode array in SOT143 package, configured as a bridge rectifier for reverse polarity protection. It delivers 0.9 A forward current per channel, 30 V reverse voltage rating, and 0.5 V typical forward voltage at 0.7 A - enabling efficient low-loss DC power path protection in automotive and industrial power supplies.

For engineers reviewing the BAS3007ARPPE6327HTSA1 datasheet, BAS3007ARPPE6327HTSA1 pinout, BAS3007ARPPE6327HTSA1 application, or BAS3007ARPPE6327HTSA1 equivalent, key selection criteria include verified dual-diode conduction path in RPP mode, thermal derating above 46°C, junction-to-soldering-point thermal resistance ≤95 K/W, and AEC-Q101 qualification for under-hood use.

Technical Context

This device integrates four Schottky diodes in a single SOT143 package with fixed bridge configuration (D1–D4), where pins 1–4 form two independent anode–cathode pairs enabling simultaneous bidirectional conduction. Its design supports advanced reverse polarity protection (RPP) by routing supply current through exactly two series diodes regardless of input polarity.

Electrical behavior is defined by low VF (0.35–0.7 V across 0.1–0.9 A), low IR (≤350 µA at 30 V), and CT = 9–15 pF at 5 V/1 MHz - making it suitable for high-efficiency, fast-switching DC power rails where voltage headroom and EMI are critical.

Key Specifications

Pinout & Package

Package: SOT143 - surface-mount plastic package with 4 leads, 1.3 mm × 2.4 mm footprint, and 0.95 mm height; optimized for automated placement and reflow soldering on dense PCBs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar reverse polarity protection applications.

Compared with NSR305MXV6T1G and RB055LAM-40, BAS3007ARPPE6327HTSA1 uniquely delivers integrated bridge functionality, AEC-Q101 qualification, and verified dual-diode conduction path - reducing BOM count, improving reliability, and eliminating layout-dependent failure modes in safety-critical power paths.

Availability

BAS3007ARPPE6327HTSA1 is available at Aetrix Electronics and suitable for automotive body control modules, industrial PLC power inputs, and medical portable diagnostic devices requiring stable component supply and long-term lifecycle support.

Supply support for BAS3007ARPPE6327HTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global R&D and manufacturing infrastructure.

This part belongs to Infineon's BAS family of low-VF Schottky diodes designed specifically for high-reliability reverse polarity protection and low-loss bridge rectification in harsh-environment applications.

FAQ

What is the maximum continuous forward current per diode in BAS3007ARPPE6327HTSA1?

The maximum continuous forward current is 900 mA per diode at case temperature TS ≤ 46°C. At higher case temperatures up to 82°C, the rating derates to 700 mA. This derating is defined by thermal resistance and ambient conditions, not by peak pulse limits.

How does the BAS3007ARPPE6327HTSA1 implement reverse polarity protection?

It uses an internal bridge configuration where pins 1–4 route input current through exactly two series-connected Schottky diodes - regardless of whether the input is applied with correct or reversed polarity. This ensures the protected circuit receives properly oriented DC voltage in both cases.

Is BAS3007ARPPE6327HTSA1 suitable for 24 V automotive systems?

Yes - its 30 V reverse voltage rating provides 25% margin above nominal 24 V systems, and AEC-Q101 qualification confirms performance across -40°C to +125°C ambient with validated thermal and reliability stress testing.

What is the thermal resistance from junction to soldering point (RthJS)?

RthJS is ≤95 K/W, measured from the silicon junction to the solder joint on the PCB pad. This value enables accurate thermal modeling when designing copper pour areas and estimating temperature rise under load in real-world mounting conditions.