Infineon Technologies BAS3010S02LRHE6327XTSA1

Overview

BAS3010S02LRHE6327XTSA1 from Infineon Technologies is a low-forward-voltage Schottky diode in TSLP-2-17 package, rated for 30 V reverse voltage and 1 A continuous forward current, with typical VF of 570 mV at 1 A and CT of 10 pF at 5 V, optimized for mobile phone battery charger circuits.

For engineers reviewing the BAS3010S02LRHE6327XTSA1 datasheet, BAS3010S02LRHE6327XTSA1 pinout, BAS3010S02LRHE6327XTSA1 application, or BAS3010S02LRHE6327XTSA1 equivalent, key selection criteria include low VF under high IF, compact footprint (1.0 × 0.6 mm), thermal resistance ≤60 K/W, and RoHS-compliant Pb-free construction.

Technical Context

This Schottky diode uses a planar silicon structure with metal–semiconductor junction to achieve fast switching (no minority-carrier storage) and low conduction loss. Its TSLP-2-17 leadless package enables high-density PCB layout while maintaining thermal performance up to 150 °C junction temperature.

The device exhibits VF = 570 mV (max) at IF = 1 A and IR ≤ 300 µA at VR = 30 V, with diode capacitance CT = 10 pF (typ) at VR = 5 V / 1 MHz - critical for minimizing AC losses and EMI in high-frequency DC/DC converter outputs.

Key Specifications

Pinout & Package

TSLP-2-17 is a 2-terminal, leadless surface-mount package measuring 1.0 × 0.6 × <0.4 mm, with cathode marked by laser etch on top surface and solderable terminals on bottom. Thermal pad is integrated into terminal design for enhanced heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky diode applications.

Compared with RB050M-30TR and NSR0130P2T5G, BAS3010S02LRHE6327XTSA1 uniquely balances 1 A current capability, 570 mV VF, and 1.0 × 0.6 mm size - making it optimal for space-constrained, high-efficiency mobile power rails where both thermal density and conduction loss must be minimized.

Availability

BAS3010S02LRHE6327XTSA1 is available at Aetrix Electronics and suitable for USB battery chargers, smartphone power path management, and wearable device power supplies requiring stable component supply and long-term lifecycle support.

Supply support for BAS3010S02LRHE6327XTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices.

This part belongs to Infineon's BAS family of low-VF Schottky diodes, designed specifically for high-efficiency, miniaturized DC/DC power conversion in portable consumer electronics.

FAQ

What is the maximum junction temperature for BAS3010S02LRHE6327XTSA1?

The absolute maximum junction temperature is 150 °C, verified per JEDEC JESD22-A104. Operation above this limit risks irreversible degradation of the Schottky barrier. Derating of IF and VR is required above TA = 25 °C, with full 1 A rating maintained only when solder-point temperature remains ≤114 °C.

Is BAS3010S02LRHE6327XTSA1 suitable for reverse battery protection?

Yes - its 30 V VR rating and low leakage (IR ≤ 300 µA at 30 V) make it effective for blocking reverse current in single-cell Li-ion systems. However, it must be paired with external overvoltage clamping if input transients exceed 30 V, as no integrated protection circuitry is present.

Does this diode have a specified surge current rating?

Yes - IFSM = 4 A for tp ≤ 10 ms (non-repetitive), defined per IEC 61000-4-5 surge immunity testing conditions. This rating supports robustness against USB hot-plug inrush and capacitive load switching events in portable chargers.

How does the TSLP-2-17 package affect thermal performance?

The TSLP-2-17 package achieves RthJS ≤ 60 K/W via direct copper exposure on terminal undersides, enabling efficient heat transfer to PCB copper pours. Unlike traditional SOD packages, its low profile (<0.4 mm) and symmetric thermal path reduce localized hot spots in high-density layouts.