Nexperia USA Inc. BAS316,115
- Part No.:
- BAS316,115
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Single Diodes
- Package:
- SC-76, SOD-323
- Datasheet:
-
BAS316,115.pdf
- Description:
- DIODE GEN PURP 100V 250MA SOD323
- Quantity:
- Payment:

- Shipping:

Inventory:303,374
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BAS316 from Nexperia is a high-speed switching diode in SOD323 (SC-76) package, designed for fast signal routing and low-loss rectification in compact PCB layouts. It delivers trr ≤ 4 ns reverse recovery time, VR = 100 V maximum reverse voltage, and IF = 250 mA continuous forward current at Tj = 25 °C, enabling use in 5 V–24 V digital logic interface clamping and DC-DC converter freewheeling paths.
For engineers reviewing the BAS316 datasheet, BAS316 pinout, BAS316 application, or BAS316 equivalent, key selection criteria include verified trr ≤ 4 ns performance under IF = 10 mA / IR = 10 mA test conditions, Cd = 1.5 pF capacitance at VR = 0 V / f = 1 MHz, and thermal resistance Rth(j-sp) = 150 K/W to cathode solder point - critical for thermal-aware layout in space-constrained power management circuits.
Technical Context
The BAS316 employs a planar epitaxial silicon structure optimized for minimal minority-carrier storage, directly enabling its ≤4 ns trr with 1 mA measurement threshold under standardized RL = 100 Ω test setup. Its low leakage (IR ≤ 0.5 µA at VR = 80 V, Tj = 25 °C) and stable VF (≤855 mV at IF = 10 mA) support reliable level-shifting in mixed-voltage I/O buffers.
Thermal design relies on direct junction-to-solder-point conduction (Rth(j-sp) = 150 K/W), requiring FR4 PCB mounting with tin-plated copper and standard SOD323 footprint per Figure 8. The device operates across –65 °C to +150 °C ambient, with derated IF above 25 °C per Fig. 1's temperature-dependent VF curves.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| trr | ≤4 ns - enables >100 MHz switching in flyback snubbers and data line clamping |
| VRRM | 100 V - supports 24 V industrial bus protection and 48 V telecom input stages |
| IF (cont) | 250 mA - sufficient for logic-level signal steering without heatsinking |
| Cd | 1.5 pF at VR = 0 V - minimizes capacitive loading on high-speed GPIO lines |
| IR | ≤0.5 µA at VR = 80 V, 25 °C - ensures low standby power loss in battery-backed circuits |
| VF | 855 mV at IF = 10 mA - provides predictable voltage drop for precision clamp thresholds |
| Rth(j-sp) | 150 K/W - defines thermal path to cathode pad; requires ≥1.3 mm pitch PCB land pattern |
Pinout & Package
SOD323 (SC-76) surface-mount plastic package: 2-pin, 1.7 mm × 1.25 mm × 0.95 mm body, 1.3 mm lead pitch, cathode tab solder point as thermal interface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Cathode (K) | Primary thermal path to PCB; must connect to copper pour for Rth(j-sp) = 150 K/W |
| 2 | Anode (A) | Forward current entry point; routed away from high-dv/dt nodes to limit capacitive coupling |
Key Features
| Feature | Design Value |
|---|---|
| High-speed switching | trr ≤ 4 ns verified under IF = 10 mA / IR = 10 mA / RL = 100 Ω - meets USB 2.0 ESD clamp timing requirements |
| Low junction capacitance | Cd = 1.5 pF at VR = 0 V / 1 MHz - preserves signal integrity on 50 Ω RF traces up to 500 MHz |
| Low leakage current | IR ≤ 0.5 µA at VR = 80 V - enables >10-year battery life in always-on sensor wake-up circuits |
| Robust thermal interface | Rth(j-sp) = 150 K/W to cathode solder point - allows 400 mW Ptot dissipation with <10 °C rise on 10 mm² 35 µm Cu |
Applications
| Logic-Level Clamping | DC-DC Converter Freewheeling |
|---|---|
Use Scenario: Protecting 3.3 V/5 V microcontroller GPIO pins from inductive kickback during relay or solenoid drive. IC Role / Device Role / Timing Role: Fast clamping diode shunting transient energy to VCC or GND within <4 ns. Use Value: Prevents latch-up by limiting pin voltage to VF + VCC (or –VF to GND) before MCU internal ESD structures activate. | Use Scenario: Providing low-loss return path for inductor current in 1 MHz synchronous buck converters. IC Role / Device Role / Timing Role: Freewheeling diode conducting during high-side FET off-time with minimal reverse recovery loss. Use Value: Reduces switching loss by 30% vs. standard 1N4148 due to 4 ns trr and 1.5 pF Cd, improving efficiency at 1–2 MHz. |
| High-Speed Data Line Protection | Level Translation Interface |
Use Scenario: Bidirectional ESD suppression on RS-485 differential pairs operating at 10 Mbps. IC Role / Device Role / Timing Role: Low-capacitance transient voltage clamp placed between A/B lines and ground. Use Value: Maintains signal edge rate (≤1 ns rise time) while limiting transients to <±15 V via 0.5 µA leakage and 1.5 pF loading. | Use Scenario: Translating 1.8 V logic outputs to 3.3 V inputs in FPGA configuration interfaces. IC Role / Device Role / Timing Role: Passive level shifter using forward-biased diode drop (VF ≈ 0.7 V) to offset voltage levels. Use Value: Enables reliable 100 MHz data transfer with deterministic 855 mV VF at 10 mA, eliminating need for active translators. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed switching diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 1N4148W-7-F | trr = 4 ns (same), but Cd = 4 pF and IR = 25 nA @ VR = 20 V - higher capacitance limits >100 MHz use | Less suitable for RF front-end clamping; acceptable for <50 MHz digital logic | Select when cost sensitivity outweighs RF performance and thermal constraints are relaxed |
| BAS16,115 | Same SOD323 package, but trr = 50 ns and VF = 1.25 V @ IF = 150 mA - slower, higher loss | Only viable for <1 MHz switching; unsuitable for DC-DC freewheeling above 500 kHz | Choose only if legacy design reuse mandates identical marking (A6) and speed is non-critical |
Compared with 1N4148W-7-F and BAS16,115, the BAS316 uniquely combines 4 ns trr, 1.5 pF Cd, and 150 K/W thermal resistance - making it the sole option among these three for thermally constrained, >100 MHz signal-path applications requiring sub-1 V forward drop.
Availability
BAS316 is available at Aetrix Electronics and suitable for high-speed logic clamping, DC-DC converter freewheeling, and RS-485 data line protection requiring stable component supply across automotive infotainment, industrial PLC I/O modules, and medical sensor interfaces.
Supply support for BAS316 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in automotive-qualified and industrial-grade components.
The BAS316 belongs to Nexperia's high-speed switching diode product line, engineered specifically for signal integrity preservation and thermal efficiency in space-limited power management and interface circuits.
FAQ
What is the maximum allowable peak forward current for BAS316?
The non-repetitive peak forward current (IFSM) is 4 A for tp = 1 µs square wave pulses at Tj(init) = 25 °C, decreasing to 1 A at tp = 1 ms and 0.5 A at tp = 1 s per Table 5. This rating assumes FR4 PCB mounting with single-side copper and standard SOD323 footprint - exceeding these conditions risks permanent junction damage.
How does BAS316's thermal resistance impact PCB layout?
Rth(j-sp) = 150 K/W specifies temperature rise from junction to cathode solder point, not ambient. To maintain Tj ≤ 150 °C at 400 mW Ptot, the cathode pad must be connected to ≥10 mm² of 35 µm copper with no thermal relief - Figure 8's reflow footprint (0.6 mm × 0.5 mm lands) is mandatory for achieving this value.
Is BAS316 qualified for automotive applications?
No. Per Revision History Section 14, BAS316 was explicitly changed to non-automotive qualification in v.7 (2022). Automotive alternatives are designated with "-Q" suffix (e.g., BAS316-Q) and require separate qualification documentation - BAS316 must not be used in safety-critical or AEC-Q101-compliant systems.
What test conditions define the 4 ns trr specification?
trr = 4 ns is measured under IF = 10 mA forward bias, IR = 10 mA reverse step, RL = 100 Ω load, IR(meas) = 1 mA threshold, and Tamb = 25 °C per Figure 5 test circuit. Input pulse rise time is tr = 0.6 ns, and oscilloscope bandwidth must exceed 1 GHz to capture the full recovery waveform without distortion.
BAS316,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- BAS16
- Package/Case:
- SC-76, SOD-323
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 100 V
- Current - Average Rectified (Io):
- 250mA
- Voltage - Forward (Vf) (Max) @ If:
- 1.25 V @ 150 mA
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 4 ns
- Current - Reverse Leakage @ Vr:
- 500 nA @ 80 V
- Capacitance @ Vr, F:
- 1.5pF @ 0V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOD-323
- Operating Temperature - Junction:
- 150°C (Max)
BAS316,115 FAQ
1.How can I place an order for BAS316,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for BAS316,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BAS316,115 reliable?
The price and inventory of BAS316,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BAS316,115 is usually 5 days.
3.What payment methods are accepted for BAS316,115?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BAS316,115 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BAS316,115?
BAS316,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BAS316,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BAS316,115?
For technical support, including BAS316,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BAS316,115 requirements.
6.How does Aetrix verify that BAS316,115 is sourced from the original manufacturer or authorized distributors?
All BAS316,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BAS316,115 meets industry standards.
7.What is the process for return or replacement of BAS316,115?
All BAS316,115 units undergo pre-shipment inspection (PSI). If there is an issue with BAS316,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BAS316,115 part is unused and in its original packaging.
Return procedure for BAS316,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BAS316,115 Tags

-
1N4448X-TP
Micro Commercial Co

-
1N4148WX-TP
Micro Commercial Co

-
1N4148TR
onsemi

-
MMSD4148T1G
onsemi

-
MMBD914LT3G
onsemi

-
BAS16HT1G
onsemi

-
1N914BWT
onsemi

-
BAS21LT1G
onsemi

-
LL4148
onsemi

-
BAS16LT1G
onsemi

-
MMSD914T1G
onsemi

-
BAV21W-7-F
Diodes Incorporated
Tech Hub
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

