Nexperia USA Inc. BAS316/DG/B3,135

Overview

BAS316/DG/B3,135 from Nexperia is a high-speed switching diode in SOD323 (SC-76) package, configured as a single discrete silicon diode with cathode-anode polarity. It delivers trr ≤ 4 ns reverse recovery time, VR = 100 V maximum reverse voltage, and IF = 250 mA forward current rating at Tamb ≤ 25 °C, enabling use in compact DC-DC converter flyback snubbers and high-frequency signal routing circuits.

For engineers reviewing the BAS316/DG/B3,135 datasheet, BAS316/DG/B3,135 pinout, BAS316/DG/B3,135 application, or BAS316/DG/B3,135 equivalent, key selection criteria include verified 4 ns trr performance under IF = 10 mA / IR = 10 mA test conditions, low 1.5 pF capacitance at 0 V bias, and AEC-Q101 qualification for automotive-grade reliability in space-constrained designs.

Technical Context

This diode operates as a unidirectional charge-transfer device optimized for fast turn-off in high-frequency switching topologies. Its junction structure achieves sub-4 ns reverse recovery by minimizing minority carrier lifetime, while the planar epitaxial process ensures stable leakage current (<0.5 µA at VR = 80 V) and low forward voltage (VF = 855 mV typ. at IF = 10 mA).

The SOD323 package provides mechanical robustness and thermal performance via low Rth(j-sp) = 55 K/W to solder point, supporting continuous operation up to 150 °C junction temperature. The cathode-marked top-side orientation and 1.35 mm × 0.8 mm body size enable automated placement in dense PCB layouts without leadframe shadowing.

Key Specifications

Pinout & Package

SOD323 (SC-76) plastic surface-mounted package; 2-terminal leadless configuration with cathode marked on top side. Body dimensions: 1.35 mm × 0.8 mm × 0.45 mm (L × W × H), compatible with standard reflow profiles per J-STD-020.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed switching diode applications.

Compared with BAS16J, BAS316/DG/B3,135 adds AEC-Q101 compliance for automotive use without sacrificing speed or voltage rating; versus BAS516, it trades 0.5 pF lower capacitance for 50 mA higher forward current and superior thermal dissipation in reflow-soldered assemblies.

Availability

BAS316/DG/B3,135 is available at Aetrix Electronics and suitable for automotive signal clamping, high-frequency data line protection, and DC-DC converter snubber applications requiring stable component supply across production lifecycles.

Supply support for BAS316/DG/B3,135 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with manufacturing rooted in process innovation and automotive-grade quality systems.

The BAS16 series is designed specifically for high-speed switching in space-constrained, thermally demanding applications-emphasizing fast recovery, low capacitance, and AEC-Q101 qualification for automotive electronics.

FAQ

What is the maximum allowable junction temperature for BAS316/DG/B3,135?

The absolute maximum junction temperature is 150 °C, validated per IEC 60134 limiting values. Operation at this temperature requires thermal design ensuring Rth(j-a) does not exceed 230 K/W under actual board layout and airflow conditions, as specified in Table 7 of the Nexperia datasheet Rev. 6.

Does BAS316/DG/B3,135 support wave soldering?

Yes, the SOD323 package is qualified for wave soldering per Figure 29 in the datasheet, with recommended footprint dimensions of 1.5 mm × 2.9 mm and solder land spacing of 1.2 mm. Thermal profile must limit peak temperature to ≤260 °C for ≤10 seconds to avoid package delamination.

How does the marking code 'A6' identify BAS316/DG/B3,135 on the device body?

The marking 'A6' appears on the top surface adjacent to the cathode bar, per Table 5 and Figure 15. This two-character code uniquely identifies the BAS316 type within the Nexperia SOD323 family and is laser-etched for readability under 20× magnification during automated optical inspection.

Is there a recommended PCB pad layout for optimal thermal performance?

Yes, the reflow footprint in Figure 28 specifies 0.5 mm × 0.6 mm solder lands for both terminals, with 0.6 mm spacing and 2.1 mm × 3.05 mm occupied area. Adding a 1 cm² copper pour connected to the cathode pad reduces Rth(j-a) from 230 K/W to 150 K/W, per thermal characterization data in Table 7.