My Inquiry
My Account
Infineon Technologies BAS4005E6327HTSA1
- Part No.:
- BAS4005E6327HTSA1
- Manufacturer:
- Infineon Technologies
- Category:
- Diode Arrays
- Package:
- TO-236-3, SC-59, SOT-23-3
- Datasheet:
-
BAS4005E6327HTSA1.pdf
- Description:
- DIODE ARR SCHOTT 40V 120MA SOT23
- Quantity:
- Payment:
- Shipping:
Inventory:30,317
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BAS4005E6327HTSA1 from Infineon Technologies is a silicon Schottky diode in SOT23 package configured as a single discrete device, rated for 40 V reverse voltage, 120 mA forward current, and 250 mW power dissipation at TS ≤ 31 °C. It serves as a high-speed switching diode for voltage clamping and signal mixing in automotive and industrial control circuits.
For engineers reviewing the BAS4005E6327HTSA1 datasheet, BAS4005E6327HTSA1 pinout, BAS4005E6327HTSA1 application, or BAS4005E6327HTSA1 equivalent, key selection criteria include its low forward voltage (380–500 mV at 10 mA), 3–5 pF capacitance at 0 V, 10 Ω differential forward resistance, 100 ps reverse recovery time, and AEC-Q101 qualification status.
Technical Context
This Schottky diode leverages a metal–semiconductor junction to achieve fast switching with minimal stored charge, enabling sub-100 ps reverse recovery. Its low VF and low CT support high-frequency signal routing and clamping without significant distortion or delay.
The device operates across –55 °C to +150 °C and is qualified per AEC-Q101 for automotive applications. Thermal resistance from junction to soldering point is 475 K/W, reflecting its SOT23 package's limited heat-spreading capability under sustained 120 mA DC load.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Voltage (VR) | 40 V - Maximum blocking voltage before breakdown; defines safe operating range in clamp or protection circuits. |
| Forward Current (IF) | 120 mA - Continuous DC current rating; sets upper limit for steady-state signal path conduction. |
| Forward Voltage (VF) | 380–500 mV @ 10 mA - Low conduction loss enables efficient clamping and mixing at low drive levels. |
| Diode Capacitance (CT) | 3–5 pF @ 0 V, 1 MHz - Minimal junction capacitance preserves signal integrity above 100 MHz. |
| Reverse Recovery Time (τrr) | ≤100 ps - Ultrafast turn-off supports >1 GHz switching in RF detector/mixer stages. |
| Differential Forward Resistance (RF) | 10 Ω @ 10 kHz - Predictable small-signal impedance aids linear operation in analog signal paths. |
| Junction Temperature (Tj) | 150 °C - Maximum allowable die temperature; constrains thermal design in sealed enclosures. |
Pinout & Package
Package: SOT23 - surface-mount plastic package with three terminals; compact footprint (2.9 × 1.3 × 1.0 mm) suitable for space-constrained PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (Pin 1) | Current entry terminal | Connects to higher-potential node in forward-biased configuration; polarity-sensitive for clamping direction. |
| Cathode (Pin 2) | Current exit terminal | Typically tied to ground or reference rail; forms low-impedance return path during conduction. |
| NC / Heat Sink (Pin 3) | Non-connected / thermal pad | No internal connection; may be used as thermal relief pad but not electrically functional. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualified | Validated for automotive-grade reliability including temperature cycling, HTRB, and ESD robustness. |
| Low forward voltage | 380–500 mV at 10 mA enables efficient signal-level clamping without loading source impedance. |
| Ultra-low reverse recovery time | ≤100 ps ensures minimal switching distortion in RF detector and mixer applications. |
| Pb-free, RoHS-compliant | Meets EU Directive 2011/65/EU; compatible with lead-free reflow profiles up to 260 °C peak. |
Applications
| Automotive Body Control Module | Industrial Sensor Signal Conditioning |
|---|---|
Use Scenario: Clamping transient spikes on LIN bus lines during load dump or ESD events. IC Role / Device Role / Timing Role: Discrete voltage clamp protecting transceiver I/O pins from overvoltage. Use Value: 40 V VR rating and 100 ps τrr prevent latch-up while preserving bus timing integrity. | Use Scenario: Mixing low-amplitude analog sensor outputs (e.g., thermistor bridge) with local oscillator signals. IC Role / Device Role / Timing Role: Passive RF mixer diode leveraging nonlinear IV curve for frequency translation. Use Value: 3–5 pF CT and 10 Ω RF enable wideband mixing with minimal insertion loss below 500 MHz. |
| Consumer Audio Input Protection | Power Supply OR-ing Circuit |
Use Scenario: Protecting line-in jacks from electrostatic discharge and hot-plug transients. IC Role / Device Role / Timing Role: Bidirectional ESD clamp between signal line and ground. Use Value: 1 µA IR at 30 V ensures negligible leakage current that would degrade audio SNR. | Use Scenario: Diode-OR configuration in dual-input 3.3 V power rails for redundancy. IC Role / Device Role / Timing Role: Low-VF forward path enabling automatic source selection with minimal dropout. Use Value: 380–500 mV VF reduces voltage drop vs. standard PN diodes, improving efficiency by ~120 mW per rail. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SBAT54LT1G | 30 V VR, 200 mA IF, SOT23 package, VF = 350–500 mV @ 10 mA | Lower VR rating limits use in 36 V automotive systems; higher IF supports higher pulse loads. | Select when higher current headroom is needed and system VR stays ≤30 V. |
| BAT54CW | 30 V VR, dual common-cathode configuration in SOT323, VF = 350–500 mV @ 10 mA | Dual-diode layout enables complementary clamping or level-shifting; smaller package increases layout density. | Choose for space-constrained dual-clamp designs where 30 V VR suffices. |
Compared with SBAT54LT1G and BAT54CW, BAS4005E6327HTSA1 offers superior 40 V reverse blocking for 12/24 V automotive systems, tighter VF matching, and AEC-Q101 qualification-making it the preferred choice for safety-critical clamping and mixing where voltage margin and reliability are paramount.
Availability
BAS4005E6327HTSA1 is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor interfaces, consumer audio protection, and power OR-ing circuits requiring stable component supply and long-term lifecycle assurance.
Supply support for BAS4005E6327HTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and discrete devices, with global R&D and manufacturing infrastructure.
BAS4005E6327HTSA1 belongs to Infineon's BAS40 series of high-speed Schottky diodes, designed specifically for automotive-grade signal clamping, RF mixing, and ESD protection in harsh-environment electronics.
FAQ
Is BAS4005E6327HTSA1 pin-compatible with BAS40-05?
Yes, BAS4005E6327HTSA1 uses the same SOT23 package and pinout as BAS40-05: Pin 1 = Anode, Pin 2 = Cathode, Pin 3 = NC. Both share identical mechanical footprint and terminal assignment, enabling direct PCB replacement without layout changes.
What is the maximum junction temperature during pulsed operation?
The absolute maximum junction temperature remains 150 °C regardless of pulse duration. Under repetitive pulses (duty cycle ≤ 0.5), the permissible peak forward current scales inversely with pulse width per Infineon's EHD07166 curve-e.g., 350 mA for 10 µs pulses at 0.01 duty cycle.
Does BAS4005E6327HTSA1 require special handling for ESD sensitivity?
Yes-it is classified as an ESD-sensitive device (HBM Class 2, ≥2 kV). Handling requires grounded workstations, ionized air, and static-dissipative packaging. The device must not be touched directly on terminals, and PCB assembly must follow IPC-ESD-2020 guidelines.
Can BAS4005E6327HTSA1 replace BAS140W in existing designs?
No-BAS140W uses SOD323 package with different thermal resistance (≤150 K/W) and higher junction-to-soldering-point capability. BAS4005E6327HTSA1's SOT23 package has 475 K/W RthJS and lower thermal derating, so direct substitution risks thermal runaway above 60 mA continuous load.
BAS4005E6327HTSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- TO-236-3, SC-59, SOT-23-3
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Diode Configuration:
- 1 Pair Common Cathode
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 40 V
- Current - Average Rectified (Io) (per Diode):
- 120mA (DC)
- Voltage - Forward (Vf) (Max) @ If:
- 1 V @ 40 mA
- Speed:
- Small Signal =< 200mA (Io), Any Speed
- Reverse Recovery Time (trr):
- 100 ps
- Current - Reverse Leakage @ Vr:
- 1 µA @ 30 V
- Operating Temperature - Junction:
- 150°C (Max)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-SOT23
BAS4005E6327HTSA1 FAQ
1.How can I place an order for BAS4005E6327HTSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for BAS4005E6327HTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BAS4005E6327HTSA1 reliable?
The price and inventory of BAS4005E6327HTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BAS4005E6327HTSA1 is usually 5 days.
3.What payment methods are accepted for BAS4005E6327HTSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BAS4005E6327HTSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BAS4005E6327HTSA1?
BAS4005E6327HTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BAS4005E6327HTSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BAS4005E6327HTSA1?
For technical support, including BAS4005E6327HTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BAS4005E6327HTSA1 requirements.
6.How does Aetrix verify that BAS4005E6327HTSA1 is sourced from the original manufacturer or authorized distributors?
All BAS4005E6327HTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BAS4005E6327HTSA1 meets industry standards.
7.What is the process for return or replacement of BAS4005E6327HTSA1?
All BAS4005E6327HTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BAS4005E6327HTSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BAS4005E6327HTSA1 part is unused and in its original packaging.
Return procedure for BAS4005E6327HTSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BAS4005E6327HTSA1 Tags
-
BAV99-7-F
Diodes Incorporated
-
BAT54C-7-F
Diodes Incorporated
-
BAV99,215
Nexperia USA Inc.
-
BAT54SLT1G
onsemi
-
BAV70LT1G
onsemi
-
BAT54CLT1G
onsemi
-
BAT54S-7-F
Diodes Incorporated
-
BAV99LT1G
onsemi
-
BAT54S,215
Nexperia USA Inc.
-
BAS40-04LT1G
onsemi
-
MMBD1503-TP
Micro Commercial Co
-
BAV99WT1G
onsemi
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
