Infineon Technologies BAS7002LE6327XTMA1
- Part No.:
- BAS7002LE6327XTMA1
- Manufacturer:
- Infineon Technologies
- Category:
- Single Diodes
- Package:
- SOD-882
- Datasheet:
-
BAS7002LE6327XTMA1.pdf
- Description:
- DIODE SCHOTTKY 70V 70MA TSLP-2-1
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
BAS7002LE6327XTMA1 from Infineon Technologies is a silicon Schottky diode in SOD323 package, configured as a single discrete device with 70 V reverse voltage rating, 70 mA forward current, and 300 mV forward voltage at 1 mA. It serves as a high-speed switching diode for voltage clamping and signal detection in compact power management and interface circuits.
For engineers reviewing the BAS7002LE6327XTMA1 datasheet, BAS7002LE6327XTMA1 pinout, BAS7002LE6327XTMA1 application, or BAS7002LE6327XTMA1 equivalent, key selection criteria include low VF matching (≤20 mV), 1.5 pF capacitance at 0 V, 100 ps reverse recovery time, thermal resistance ≤310 K/W, and AEC-Q101 qualification status for automotive-grade reliability.
Technical Context
This Schottky diode leverages a low-barrier metal-semiconductor junction to achieve fast switching (100 ps trr) and minimal forward conduction loss (VF = 300 mV @ 1 mA). Its 1.5 pF junction capacitance and 34 Ω dynamic series resistance support RF mixing and high-frequency detector applications up to several hundred MHz.
The device operates across –55 °C to +125 °C and sustains 150 °C junction temperature. Thermal resistance from junction to soldering point is ≤310 K/W, enabling stable performance in space-constrained PCB layouts where heat dissipation is limited by SOD323 footprint.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Voltage (VR) | 70 V - Supports clamping in 48 V and 24 V automotive and industrial supply rails without breakdown. |
| Forward Voltage (VF) | 300 mV @ 1 mA - Enables ultra-low-loss signal rectification in battery-powered sensor front-ends. |
| Junction Capacitance (CT) | 1.5 pF @ 0 V, 1 MHz - Permits use in UHF detector and mixer stages with minimal signal loading. |
| Reverse Recovery Time (trr) | 100 ps - Ensures clean switching in >100 MHz clock and data line protection circuits. |
| Thermal Resistance (RthJS) | ≤310 K/W - Allows direct mounting on standard FR4 without heatsink in low-duty-cycle pulse applications. |
| Surge Current (IFSM) | 100 mA @ t ≤ 10 ms - Withstands transient ESD-induced surges in I/O protection paths. |
| Operating Temperature | –55 °C to +125 °C - Qualified for under-hood automotive and industrial control environments. |
Pinout & Package
SOD323 surface-mount package: 1.7 mm × 1.25 mm × 0.95 mm body, cathode marked by band, JEDEC-compliant footprint with 0.95 mm lead pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (A) | Current entry node | Connected to higher-potential rail during forward conduction; defines polarity-sensitive placement on PCB. |
| Cathode (K) | Current exit node / reference terminal | Marked by band; tied to ground or lower-potential node in clamping and detection configurations. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualified | Validated for automotive electronics per stress test requirements including HTOL, TCT, and ESD HBM ≥2 kV. |
| Low forward voltage matching | ΔVF ≤ 20 mV across devices - Enables consistent channel balancing in dual-diode arrays and precision detector bridges. |
| Pb-free, RoHS-compliant | Meets EU Directive 2011/65/EU and J-STD-020 reflow profile compatibility up to 260 °C peak. |
| High-speed switching | 100 ps reverse recovery - Reduces switching noise and cross-talk in high-frequency signal routing and sampling circuits. |
Applications
| Automotive CAN Bus Protection | USB 2.0 Data Line Clamping |
|---|---|
Use Scenario: Protects CAN_H/CAN_L lines from load-dump transients and ESD events in vehicle ECUs. IC Role / Device Role: Bidirectional voltage clamp placed between differential pair and ground. Use Value: 70 V VR withstands ISO 7637-2 Pulse 5a (75 V), while 100 ps trr prevents data corruption during fast edge transitions. | Use Scenario: Shields USB D+/D− pins from ±8 kV contact ESD per IEC 61000-4-2. IC Role / Device Role: Low-capacitance shunt diode connected anode-to-ground, cathode-to-signal line. Use Value: 1.5 pF CT minimizes signal integrity degradation at 480 Mbps; 300 mV VF ensures clamping threshold stays below USB receiver's absolute max rating. |
| RF Signal Detector | Low-Power Sensor Biasing |
Use Scenario: Demodulates AM-modulated RF carrier in 868 MHz ISM-band wireless sensors. IC Role / Device Role: Envelope detector diode feeding RC filter into ADC input. Use Value: Sub-1 nA IR at 50 V enables accurate DC output scaling; 100 ps trr preserves modulation fidelity up to 10 MHz baseband. | Use Scenario: Provides bias current to MEMS microphone or Hall-effect sensor in battery-operated IoT nodes. IC Role / Device Role: Constant-current source via resistor-diode network. Use Value: 300 mV VF stability over –40 °C to +85 °C ensures predictable bias current drift <±2% across operating range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SBAT54LT1G | VF = 375 mV @ 10 mA; CT = 1.2 pF; RthJS = 325 K/W; SOT-23 package | Higher VF increases conduction loss in low-voltage bias networks; larger footprint limits density in miniaturized designs. | Prefer when existing SOT-23 layout prohibits SOD323 rework and 1.2 pF CT is critical. |
| BAT54CW-7-F | Common-cathode dual configuration; VF = 410 mV @ 10 mA; CT = 10 pF per diode | Not suitable for single-diode roles; 10 pF CT degrades >100 MHz signal integrity; dual topology adds routing complexity. | Select only if dual-channel detection or level-shifting is required and board area permits larger SOT-323 footprint. |
Compared with SBAT54LT1G and BAT54CW-7-F, BAS7002LE6327XTMA1 delivers the lowest VF at microamp bias currents, tightest ΔVF matching, and smallest package-making it optimal for space-constrained, low-power, high-frequency detector and clamping functions where thermal and capacitive constraints dominate.
Availability
BAS7002LE6327XTMA1 is available at Aetrix Electronics and suitable for automotive ECU protection, USB interface clamping, RF detector circuits, and low-power sensor biasing requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for BAS7002LE6327XTMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs and discrete components.
This part belongs to the BAS70 family of high-speed Schottky diodes designed specifically for voltage clamping, signal detection, and high-frequency switching in automotive and industrial systems where low VF, fast trr, and AEC-Q101 compliance are mandatory.
FAQ
Is BAS7002LE6327XTMA1 AEC-Q101 qualified?
Yes. BAS7002LE6327XTMA1 is explicitly qualified per AEC-Q101 Rev D for stress tests including high-temperature operating life, temperature cycling, and human-body-model ESD. The "L" suffix in the part number denotes AEC-Q101 compliance, confirmed in Infineon's official product brief dated February 2014.
What is the maximum continuous forward current at 85 °C ambient?
At TA = 85 °C, the maximum continuous forward current is approximately 45 mA, derived from the IF vs. TS derating curve for BAS70-series SOD323 devices. This value reflects thermal limits imposed by the 310 K/W junction-to-soldering-point resistance and 150 °C maximum junction temperature.
Can this diode be used in 2.4 GHz WiFi antenna switching?
No. While its 100 ps trr supports operation up to ~1 GHz, the 1.5 pF junction capacitance introduces excessive insertion loss and impedance mismatch above 1 GHz. For 2.4 GHz antenna switching, GaAs or PIN diodes with sub-0.2 pF CT and integrated driver circuitry are required.
Does BAS7002LE6327XTMA1 have a specified reverse recovery charge (Qrr)?
No. Infineon does not specify Qrr for this part. The datasheet provides only trr = 100 ps (measured at IF = 25 mA, IR = 0.1 × IF, di/dt = 100 A/μs), which is sufficient for evaluating switching loss in clamping and detection roles but not for high-frequency synchronous rectifier design where Qrr dominates conduction loss.
BAS7002LE6327XTMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- SOD-882
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 70 V
- Current - Average Rectified (Io):
- 70mA
- Voltage - Forward (Vf) (Max) @ If:
- 1 V @ 15 mA
- Speed:
- Small Signal =< 200mA (Io), Any Speed
- Reverse Recovery Time (trr):
- 100 ps
- Current - Reverse Leakage @ Vr:
- 100 nA @ 50 V
- Capacitance @ Vr, F:
- 2pF @ 0V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TSLP-2-1
- Operating Temperature - Junction:
- -55°C ~ 125°C
BAS7002LE6327XTMA1 FAQ
1.How can I place an order for BAS7002LE6327XTMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for BAS7002LE6327XTMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BAS7002LE6327XTMA1 reliable?
The price and inventory of BAS7002LE6327XTMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BAS7002LE6327XTMA1 is usually 5 days.
3.What payment methods are accepted for BAS7002LE6327XTMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BAS7002LE6327XTMA1 transactions.
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4.How is shipping managed for BAS7002LE6327XTMA1?
BAS7002LE6327XTMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BAS7002LE6327XTMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BAS7002LE6327XTMA1?
For technical support, including BAS7002LE6327XTMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BAS7002LE6327XTMA1 requirements.
6.How does Aetrix verify that BAS7002LE6327XTMA1 is sourced from the original manufacturer or authorized distributors?
All BAS7002LE6327XTMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BAS7002LE6327XTMA1 meets industry standards.
7.What is the process for return or replacement of BAS7002LE6327XTMA1?
All BAS7002LE6327XTMA1 units undergo pre-shipment inspection (PSI). If there is an issue with BAS7002LE6327XTMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BAS7002LE6327XTMA1 part is unused and in its original packaging.
Return procedure for BAS7002LE6327XTMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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