Infineon Technologies BAS7004WH6327XTSA1

Overview

BAS7004WH6327XTSA1 from Infineon Technologies is a silicon Schottky diode in SOT-323 package configured as a common-cathode dual diode, rated for 70 V reverse voltage, 70 mA forward current, and 250 mW power dissipation at TS ≤ 48 °C. It delivers low forward voltage (VF = 375–880 mV at IF = 1–15 mA), 1.5–2 pF capacitance at 0 V/1 MHz, and 100 ps reverse recovery time - enabling high-speed switching in signal routing and voltage clamping circuits.

For engineers reviewing the BAS7004WH6327XTSA1 datasheet, BAS7004WH6327XTSA1 pinout, BAS7004WH6327XTSA1 application, or BAS7004WH6327XTSA1 equivalent, key selection criteria include its dual common-cathode topology, AEC-Q101 qualification, thermal derating profile (TS ≤ 48 °C), and matching VF tolerance (ΔVF ≤ 20 mV) for balanced signal paths in precision detector and RF mixer designs.

Technical Context

This dual Schottky diode integrates two independent anodes sharing one cathode terminal, supporting series or parallel operation in bidirectional signal conditioning. Its low junction capacitance (1.5 pF typ.) and ultrafast charge carrier lifetime (τrr ≤ 100 ps) minimize phase distortion in RF mixing and high-frequency detection.

The device operates across –55 °C to +125 °C ambient, with junction temperature limited to 150 °C and thermal resistance RthJS ≤ 410 K/W (junction-to-soldering-point), requiring careful PCB copper area design for thermal management under continuous 70 mA load.

Key Specifications

Pinout & Package

Package: SOT-323 (SC-70), surface-mount, 3-terminal plastic package with gull-wing leads. Dimensions: 2.1 × 1.25 × 0.95 mm (L × W × H).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky diode applications.

Compared with SBAT54DWY and BAS70-04W, BAS7004WH6327XTSA1 uniquely combines AEC-Q101 qualification, 1.5 pF capacitance, and matched VF in the compact SOT-323 footprint - making it the sole option for space-constrained, safety-critical automotive signal conditioning.

Availability

BAS7004WH6327XTSA1 is available at Aetrix Electronics and suitable for automotive signal clamping, RF mixer front-ends, and high-speed logic level translation requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for BAS7004WH6327XTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and discrete devices, with global manufacturing and quality certification to ISO/TS 16949.

This part belongs to the BAS70 family of high-speed Schottky diodes designed specifically for automotive-grade signal integrity and protection in harsh-environment electronic control units.

FAQ

What is the maximum allowable soldering temperature for BAS7004WH6327XTSA1?

The device complies with JEDEC J-STD-020 moisture sensitivity level 1 and supports peak reflow temperatures up to 260 °C for 10 seconds. Lead-free solder profiles must maintain time above liquidus ≤ 60 seconds and ramp rates within ±3 °C/s to prevent package delamination or bond wire damage.

Does BAS7004WH6327XTSA1 support reverse-biased operation for AC coupling?

Yes - its 70 V VR rating and 0.1 µA IR @ 50 V allow stable reverse-bias operation in AC-coupled signal paths. However, junction capacitance varies nonlinearly with VR (1.5–2 pF at 0–50 V), so impedance matching must account for voltage-dependent CT in high-frequency designs.

How does thermal derating affect continuous current capability?

At TS = 48 °C, IF is rated 70 mA; above this, current must be linearly reduced to zero at TS = 125 °C. For example, at TS = 80 °C, max IF = 45 mA. Derating follows the curve in datasheet Figure 6 and assumes 10 mm² 2-oz copper pad on top layer with 2 internal ground planes.

Can BAS7004WH6327XTSA1 replace BAS70-04 in existing designs?

Yes - identical pinout, electrical specs, and package. The 'H6327XTSA1' suffix denotes tape-and-reel packaging per EIA-481-D and AEC-Q101 qualification, whereas BAS70-04 may lack automotive validation. No layout or firmware changes are needed for drop-in replacement in qualified designs.